Song, P.; Si, C.; Zhang, M.; Zhao, Y.; He, Y.; Liu, W.; Wang, X.
A Novel Piezoresistive MEMS Pressure Sensors Based on Temporary Bonding Technology. Sensors 2020, 20, 337.
https://doi.org/10.3390/s20020337
AMA Style
Song P, Si C, Zhang M, Zhao Y, He Y, Liu W, Wang X.
A Novel Piezoresistive MEMS Pressure Sensors Based on Temporary Bonding Technology. Sensors. 2020; 20(2):337.
https://doi.org/10.3390/s20020337
Chicago/Turabian Style
Song, Peishuai, Chaowei Si, Mingliang Zhang, Yongmei Zhao, Yurong He, Wen Liu, and Xiaodong Wang.
2020. "A Novel Piezoresistive MEMS Pressure Sensors Based on Temporary Bonding Technology" Sensors 20, no. 2: 337.
https://doi.org/10.3390/s20020337
APA Style
Song, P., Si, C., Zhang, M., Zhao, Y., He, Y., Liu, W., & Wang, X.
(2020). A Novel Piezoresistive MEMS Pressure Sensors Based on Temporary Bonding Technology. Sensors, 20(2), 337.
https://doi.org/10.3390/s20020337