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Journal: SensorsVolume: 20Number: 4208
Article: Monitoring of Assembly Process Using Deep Learning Technology
  • Authors:
  • Chengjun Chen1,2,*,
  • Chunlin Zhang1,2 and
  • Tiannuo Wang1,2
  • et al.
Link: https://www.mdpi.com/1424-8220/20/15/4208

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