Next Article in Journal
High Sensitive pH Sensor Based on AlInN/GaN Heterostructure Transistor
Next Article in Special Issue
Multiband Imaging CMOS Image Sensor with Multi-Storied Photodiode Structure
Previous Article in Journal
Infrastructure for Integration of Legacy Electrical Equipment into a Smart-Grid Using Wireless Sensor Networks
Previous Article in Special Issue
High Dynamic Range Imaging at the Quantum Limit with Single Photon Avalanche Diode-Based Image Sensors
Article Menu
Issue 5 (May) cover image

Export Article

Open AccessArticle
Sensors 2018, 18(5), 1313; https://doi.org/10.3390/s18051313

Design and Performance of a 1 ms High-Speed Vision Chip with 3D-Stacked 140 GOPS Column-Parallel PEs

1
Sony Semiconductor Solutions, Japan, 4-14-1 Asahi-cho, Atsugi-shi, Kanagawa 243-0014, Japan
2
Sony LSI Design, Japan, 4-16-1 Okada, Atsugi-shi, Kanagawa 243-0021, Japan
3
Graduate School of Information Science and Technology, The University of Tokyo, 7 Chome-3-1 Hongo, Bunkyō, Tokyo 113-8654, Japan
*
Author to whom correspondence should be addressed.
Received: 19 December 2017 / Revised: 15 March 2018 / Accepted: 9 April 2018 / Published: 24 April 2018
(This article belongs to the Special Issue Special Issue on the 2017 International Image Sensor Workshop (IISW))
Full-Text   |   PDF [4763 KB, uploaded 3 May 2018]   |  

Abstract

We have developed a high-speed vision chip using 3D stacking technology to address the increasing demand for high-speed vision chips in diverse applications. The chip comprises a 1/3.2-inch, 1.27 Mpixel, 500 fps (0.31 Mpixel, 1000 fps, 2 × 2 binning) vision chip with 3D-stacked column-parallel Analog-to-Digital Converters (ADCs) and 140 Giga Operation per Second (GOPS) programmable Single Instruction Multiple Data (SIMD) column-parallel PEs for new sensing applications. The 3D-stacked structure and column parallel processing architecture achieve high sensitivity, high resolution, and high-accuracy object positioning. View Full-Text
Keywords: vision chip; high-speed image sensor; detection; tracking vision chip; high-speed image sensor; detection; tracking
Figures

Figure 1

This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).
SciFeed

Share & Cite This Article

MDPI and ACS Style

Nose, A.; Yamazaki, T.; Katayama, H.; Uehara, S.; Kobayashi, M.; Shida, S.; Odahara, M.; Takamiya, K.; Matsumoto, S.; Miyashita, L.; Watanabe, Y.; Izawa, T.; Muramatsu, Y.; Nitta, Y.; Ishikawa, M. Design and Performance of a 1 ms High-Speed Vision Chip with 3D-Stacked 140 GOPS Column-Parallel PEs . Sensors 2018, 18, 1313.

Show more citation formats Show less citations formats

Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Related Articles

Article Metrics

Article Access Statistics

1

Comments

[Return to top]
Sensors EISSN 1424-8220 Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert
Back to Top