Next Article in Journal
A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications
Previous Article in Journal
Time-Elastic Generative Model for Acceleration Time Series in Human Activity Recognition
 
 
Article

Article Versions Notes

Sensors 2017, 17(2), 314; https://doi.org/10.3390/s17020314
Action Date Notes Link
article pdf uploaded. 8 February 2017 13:34 CET Version of Record https://www.mdpi.com/1424-8220/17/2/314/pdf-vor
article pdf uploaded. 15 February 2017 10:46 CET Updated version of record https://www.mdpi.com/1424-8220/17/2/314/pdf
article xml uploaded. 15 February 2017 10:46 CET Original file https://www.mdpi.com/1424-8220/17/2/314/xml
article html file updated 15 February 2017 10:48 CET Original file -
article html file updated 2 March 2017 11:25 CET Update -
article html file updated 4 May 2019 12:13 CEST Update -
article html file updated 23 September 2019 05:21 CEST Update -
article html file updated 7 February 2020 22:55 CET Update https://www.mdpi.com/1424-8220/17/2/314/html
Back to TopTop