MEMS Sensors and Resonators

The measurement of in-plane motion in microelectromechanical systems (MEMS) is a challenge for existing measurement techniques due to the small size of the moving devices and the low amplitude of motion. This paper studied the possibility of using images obtained using a scanning electron microscope (SEM) together with existing motion detection algorithms to characterize the motion of MEMS. SEM imaging has previously been used to detect motion in MEMS device. However, the differences in how SEM imaging and optical imaging capture motion, together with possible interference caused by electrical actuation, create doubts about how accurately motion could be detected in a SEM. In this work, it is shown that existing motion detection algorithms can be used to detect movement with an amplitude of 69 nm. In addition, the properties of SEM images, such as bright edges, complement these algorithms. Electrical actuation was found to cause error in the measurement, however, the error was limited to regions that were electrically connected to the actuating probes and minimal error could be detected in regions that were electrically insulated from the probes. These results show that an SEM is a powerful tool for characterizing low amplitude motion and electrical contacts in MEMS and allow for the detection of motion under 100 nm in amplitude. Full article

In this paper, a miniaturized weighing cell that is based on a micro-electro-mechanical-system (MEMS) is discussed. The MEMS-based weighing cell is inspired by macroscopic electromagnetic force compensation (EMFC) weighing cells and one of the crucial system parameters, the stiffness, is analyzed. The system stiffness in the direction of motion is first analytically evaluated using a rigid body approach and then also numerically modeled using the finite element method for comparison purposes. First prototypes of MEMS-based weighing cells were successfully microfabricated and the occurring fabrication-based system characteristics were considered in the overall system evaluation. The stiffness of the MEMS-based weighing cells was experimentally determined by using a static approach based on force-displacement measurements. Considering the geometry parameters of the microfabricated weighing cells, the measured stiffness values fit to the calculated stiffness values with a deviation from −6.7 to 3.8% depending on the microsystem under test. Based on our results, we demonstrate that MEMS-based weighing cells can be successfully fabricated with the proposed process and in principle be used for high-precision force measurements in the future. Nevertheless, improved system designs and read-out strategies are still required. Full article

The increasing use of mobile broadband requires new acoustic filtering technologies that can operate efficiently at frequencies above 6 GHz. Previous research has shown that AlN Super High Frequency (SHF) Cross-Sectional Lamé Mode resonators (CLMRs) can address this challenge, but their performance is limited by the piezoelectric strength of AlN. In this work, we explore the use of substitutional doping of Al in AlN with Sc to enhance the $k{}_t{}^2$ values of SHF CLMRs. Our results showed that the measured $k{}_t{}^2$·$Q{}_m$ product of Al${}_{72}$Sc${}_{28}$N CLMRs was four times greater than that of AlN CLMRs operating at the same frequency. Additionally, the measured fractional bandwidth (FWB) of Al${}_{72}$Sc${}_{28}$N 2nd order ladder filters was 4.13%, a fourfold improvement over AlN filters with the same design. We also discuss other aspects of the technology, such as power handling, losses, and spurious mode suppression, and identify potential areas for future research. Full article

This current study aims to enhance the electrostatic MEMS converter performance mainly by boosting its output power. Three different techniques are applied to accomplish such performance enhancement. Firstly, the power is boosted by scaling up the technology of the converter CMOS accompanied circuit, the power conditioning, and power controlling circuits, from 0.35 µm to 0.6 µm CMOS technology. As the converter area is in the range of mm², there are no restrictions concerning the scaling up of the accompanied converter CMOS circuits. As a result, the maximum voltage of the system for harvesting energy, V_max, which is the most effective system constraint that greatly affects the converter’s output power, increases from 8 V to 30 V. The output power of the designed and simulated converter based on the 0.6 µm technology increases from 2.1 mW to 4.5 mW. Secondly, the converter power increases by optimizing its technological parameters, the converter thickness and the converter finger width and length. Such optimization causes the converter output power to increase from 4.5 mW to 11.2 mW. Finally, the converter structure is optimized to maximize its finger length by using its wasted shuttle mass area which does not contribute to its capacitances and output power. The proposed structure increases the converter output power from 11.2 mW to 14.29 mW. Thus, the three applied performance enhancement techniques boosted the converter output power by 12.19 mW, which is a considerable enhancement in the converter performance. All simulations are carried out using COMSOL Multiphysics 5.4. Full article

In this paper, an all-Si resonant pressure microsensor based on eutectic bonding was developed, which can eliminate thermal expansion coefficient mismatches and residual thermal stresses during the bonding process. More specifically, the resonant pressure microsensor included an SOI wafer with a pressure-sensitive film embedded with resonators, which was eutectically bonded with a silicon cap for vacuum encapsulation. The all-Si resonant pressure microsensor was carefully designed and simulated numerically, where the use of the silicon cap was shown to effectively address temperature disturbances of the microsensor. The microsensor was then fabricated based on MEMS processes where eutectic bonding was adopted to link the SOI wafer and the silicon cap. The characterization results showed that the temperature disturbances of the resonant pressure microsensor encapsulated with the silicon cap were quantified as −0.82 Hz/°C of the central resonator and −2.36 Hz/°C of the side resonator within a temperature range from −40 °C to 80 °C, which were at least eight times lower than that of the microsensor encapsulated with the glass cap. Compared with the microsensor using the glass cap, the all-silicon microsensor demonstrated an accuracy improvement from 0.03% FS to 0.01% FS and a reduction in short-term frequency fluctuations from 3.2 Hz to 1.5 Hz. Full article

In this paper, the basic concepts of the equivalent model, vibration modes, and conduction mechanisms of MEMS resonators are described. By reviewing the existing representative results, the performance parameters and key technologies, such as quality factor, frequency accuracy, and temperature stability of MEMS resonators, are summarized. Finally, the development status, existing challenges and future trend of MEMS resonators are summarized. As a typical research field of vibration engineering, MEMS resonators have shown great potential to replace quartz resonators in timing, frequency, and resonant sensor applications. However, because of the limitations of practical applications, there are still many aspects of the MEMS resonators that could be improved. This paper aims to provide scientific and technical support for the improvement of MEMS resonators in timing, frequency, and resonant sensor applications. Full article

In this study, an electrostatically driven vertical MEMS actuator was designed using a hollow square electrode. To attain vertical actuation, a hollow square-shaped electrode was designed on the glass substrate. The silicon proof mass, containing a step, was utilized to realize analogue actuation without pull-in. The vertical MEMS actuator was fabricated using the SiOG (Silicon on Glass) process and the total actuator size was 8.3 mm × 8.3 mm. The fabricated proof mass was freestanding due to eight serpentine springs with 30 μm width. The vertical movement of the MEMS actuator was successfully controlled electrostatically. The measured vertical movement was 5.6 µm for a voltage of 40 V, applied between the top silicon structure and the hollow square electrode. The results shown here confirm that the proposed MEMS actuator was able to control the vertical displacement using an applied voltage. Full article

Graphene membranes act as temperature sensors in nanoelectromechanical devices due to their excellent thermal and high-temperature resistance properties. Experimentally, reports on the sensing performance of graphene mainly focus on the temperature interval under 400 K. To explore the sensing performance of graphene temperature sensors at higher temperature intervals, micro-fabricated single-layer graphene on a SiN_X substrate is presented as temperature sensors by semiconductor technology and its electrical properties were measured. The results show that the temperature coefficient of the resistance value is 2.07 × 10⁻³ in the temperature range of 300–450 K and 2.39 × 10⁻³ in the temperature range of 450–575 K. From room temperature to high temperature, the “metal” characteristics are presented, and the higher TCR obtained at higher temperature interval is described and analyzed by combining Boltzmann transport equation and thermal expansion theory. These investigations provide further insight into the temperature characteristics of graphene. Full article

A novel three-dimensional (3D) wafer-level sandwich packaging technology is here applied in the dual mass MEMS butterfly vibratory gyroscope (BFVG) to achieve ultra-high Q factor. A GIS (glass in silicon) composite substrate with glass as the main body and low-resistance silicon column as the vertical lead is processed by glass reflow technology, which effectively avoids air leakage caused by thermal stress mismatch. Sputter getter material is used on the glass cap to further improve the vacuum degree. The Silicon-On-Insulator (SOI) gyroscope structure is sandwiched between the composite substrate and glass cap to realize vertical electrical interconnection by high-vacuum anodic bonding. The Q factors of drive and sense modes in BFVG measured by the self-developed double closed-loop circuit system are significantly improved to 8.628 times and 2.779 times higher than those of the traditional ceramic shell package. The experimental results of the processed gyroscope also demonstrate a high resolution of 0.1°/s, the scale factor of 1.302 mV/(°/s), and nonlinearity of 558 ppm in the full-scale range of ±1800°/s. By calculating the Allen variance, we obtained the angular random walk (ARW) of 1.281°/√h and low bias instability (BI) of 9.789°/h. The process error makes the actual drive and sense frequency of the gyroscope deviate by 8.989% and 5.367% compared with the simulation. Full article

Micro-electromechanical systems (MEMS) vibrating gyroscopes have gained a lot of attention over the last two decades because of their low power consumption, easy integration, and low fabrication cost. The usage of the gyroscope equipped with an inertial measurement unit has increased tremendously, with applications ranging from household devices to smart electronics to military equipment. However, reliability issues are still a concern when operating this inertial sensor in harsh environments, such as to control the movement and alignment of mini-satellites in space, tracking firefighters at an elevated temperature, and assisting aircraft navigation in gusty turbulent air. This review paper focuses on the key fundamentals of the MEMS vibrating gyroscopes, first discussing popular designs including the tuning fork, gimbal, vibrating ring, and multi-axis gyroscopes. It further investigates how bias stability, angle random walk, scale factor, and other performance parameters are affected in harsh environments and then discusses the reliability issues of the gyroscopes. Full article

Rigid sensors are a mature type of sensor, but their poor deformation and flexibility limit their application range. The appearance and development of flexible sensors provide an opportunity to solve this problem. In this paper, a resistive flexible sensor utilizes gallium−based liquid metal (eutectic gallium indium alloy, EGaIn) and poly(dimethylsiloxane) (PDMS) and is fabricated using an injecting thin−line patterning technique based on soft lithography. Combining the scalable fabrication process and unique wire−shaped liquid metal design enables sensitive multifunctional measurement under stretching and bending loads. Furthermore, the flexible sensor is combined with the glove to demonstrate the application of the wearable sensor glove in the detection of finger joint angle and gesture control, which offers the ability of integration and multifunctional sensing of all−soft wearable physical microsystems for human–machine interfaces. It shows its application potential in medical rehabilitation, intelligent control, and so on. Full article

In this paper, we proposed two methods for reducing the pyro-shock of the MEMS Inertial Measurement Unit (IMU). First, we designed the vibration isolator for reducing the pyro-shock inside the IMU. However, it turned out that there is a limit to reducing the pyro-shock with only the vibration isolator. Therefore, we improved the pyro-shock reduction performance by changing the method of mounting on the flight vehicle. Four mounting options were tested and one of them was adopted. The results showed the best reduction performance when we designed the vibration isolator with an aluminum integrated structure. When mounting, two methods were applied. One was to insert a bracket with a different material between the mounting surface and IMU and the other was to insert a set of three washers that was stacked in a PEEK-metal-PEEK order at each part of the screw connections. Full article

In this paper, we present the design of an integrated temperature and strain dual-parameter sensor based on surface acoustic waves (SAWs). First, the COMSOL Multiphysics simulation software is used to determine separate frequencies for multiple sensors to avoid interference from their frequency offsets caused by external physical quantity changes. The sensor consists of two parts, a temperature-sensitive unit and strain-sensitive unit, with frequencies of 94.97 MHz and 90.05 MHz, respectively. We use standard photolithography and ion beam etching technology to fabricate the SAW temperature–strain dual-parameter sensor. The sensing performance is tested in the ranges 0–250 °C and 0–700 μԑ. The temperature sensor monitors the ambient temperature in real time, and the strain sensor detects both strain and temperature. By testing the response of the strain sensor at different temperatures, the strain and temperature are decoupled through the polynomial fitting of the intercept and slope. The relationship between the strain and the frequency of the strain-sensitive unit is linear, the linear correlation is 0.98842, and the sensitivity is 100 Hz/μԑ at room temperature in the range of 0–700 μԑ. The relationship between the temperature and the frequency of the temperature-sensitive unit is linear, the linearity of the fitting curve is 0.99716, and the sensitivity is 7.62 kHz/°C in the range of 25–250 °C. This sensor has potential for use in closed environments such as natural gas or oil pipelines. Full article