Search Results (171)

This paper examines the wettability and interactions between ceramic and composite materials soldered with Bi-based solder containing 11 wt.% of silver and 3 wt.% titanium using indirect electron beam soldering technology. The Bi11Ag3Ti solder, with a melting point of 402 °C, consisted of a bismuth matrix containing silver lamellae. Titanium, acting as an active element, positively influenced the interaction between the solder and the joined materials. SiC and Ni-SiC substrates were soldered at temperatures of 750 °C, 850 °C, and 950 °C. Measurements of wettability angles indicated that the lowest value (20°) was achieved with SiC substrates at 950 °C. A temperature of 750 °C appeared to be the least suitable for both substrates and was entirely unsuitable for Ni-SiC. It was also observed that the Bi11Ag3Ti solder wetted the SiC substrates more effectively than Ni-SiC substrates. The optimal working temperature for this solder was determined to be 950 °C. The shear strength of the joints soldered with the Bi11Ag3Ti alloy was 23.5 MPa for the Al₂O₃/Ni-SiC joint and 9 MPa for the SiC/Ni-SiC joint. Full article

The article describes a basic comparison of soldering materials (preforms) from several suppliers, focusing on the main differences in surface structure, internal structure, and contamination on the surface and in the interior of the solder. As a result, we are able to define how different preforms of the surface, preforms related to impurities, or preforms of the structures of the composition parts of the power modules, which are subjected to the soldering process, influence the formation of different void types. Simultaneously an investigation of the impact on the soldering process (heating, cleaning, soldering, cooling), which influences the formation of the solder joint and on the formation intermetallic structure (IMC) and voids, is performed as well. A comparison of the individual results between RTG or X-ray (Radioisotope Thermoelectric Generator) and SAM (Scanning Acoustic Microscopy) are given together with the highlighted differences. This application study was carried out under various settings to investigate the effects of temperature and exposure time on formic acid. The findings confirm that oxide reduction is a time-dependent process. The lowest average void area—0.2%—was observed at the highest tested temperature of 230 °C, and the longest formic acid exposure duration of 300 s. Full article

The corrosion behaviors of newly developed solder alloys with excellent mechanical properties, Sn-2.5 Ag-1.0 Bi-0.8 Cu-0.05 Ni (SABC25108N) and Sn-1.5 Bi-0.75 Cu-0.065 Ni (SBC15075N), are analyzed to supplement the corrosion behavior of the limited corrosion data in Pb- and Zn-free solder compositions. A potentiodynamic polarization test is conducted on these compositions in a NaCl electrolyte solution, the results of which are compared with those of conventional Sn-3.0 (wt%) Ag-0.5Cu and Sn-1.2Ag-0.5Cu-0.05Ni alloys. The results indicate that SBC15075N exhibits the lowest corrosion potential and highest corrosion current density, thus signifying the lowest corrosion resistance. By contrast, SABC25108N exhibits the lowest corrosion current density and highest corrosion resistance. Notably, SABC25108N shows a slower corrosion progression in the active state and exhibits the longest passive state. The difference in corrosion resistance is affected more significantly by the formation and distribution of the Ag₃Sn intermetallic compound phase owing to the high Ag content instead of by the presence of Bi or Ni. This uniform dispersion of Ag₃Sn IMC phases in the SABC25108N alloy effectively suppressed corrosion propagation along the grain boundaries and reduced the formation of corrosion products, such as Sn₃O(OH)₂Cl₂, thereby enhancing the overall corrosion resistance. These findings provide valuable insights into the optimal design of solder alloys and highlight the importance of incorporating sufficient Ag content into multicomponent compositions to improve corrosion resistance. Full article

This study investigates the electroplating characteristics of Co-Zn alloy coatings with varying Zn contents (0.55 wt.%~8.8 wt.%) and their influence on intermetallic compound (IMC) formation during reactions with Sn solder. Co-Zn alloy coatings were successfully fabricated by electroplating using cobalt plating solutions with different concentrations of zinc sulfate. The results reveal anomalous co-deposition behavior, where the less noble Zn preferentially deposits over Co. Surface morphologies and microstructures evolve significantly with increasing Zn content, transitioning from columnar to dendritic structures. Zn incorporation into the Co lattice disrupts its crystallinity, leading to decreased crystallinity and partial amorphization. Liquid-state and solid-state interfacial reactions with Sn solder demonstrate that Zn content considerably influences IMC formation. In liquid-state reactions at 250 °C, lower Zn contents (0.55–4.8 wt.%) slightly enhance CoSn₃ growth. It exhibits a dense layered-structure without IMC spallation. In contrast, a higher Zn content (8.8 wt.%) significantly reduces IMC formation by approximately 50% and produces a duplex structure with two distinct layers. In solid-state reactions at 160 °C, the suppression effect becomes even more pronounced. The Co-0.55Zn deposit exhibits significant inhibition of CoSn₃ growth, while the Co-8.8Zn sample forms only a thin IMC layer, achieving a suppression rate exceeding 85%. These findings demonstrate that Zn doping effectively limits CoSn₃ formation during solid-state reactions and improves interfacial stability. Full article

Ball Grid Array (BGA) failures are often dominated by stress concentrations at the outer solder joints, particularly under thermomechanical loading. To mitigate this issue, this study investigates the mechanical and reliability implications of optimizing the BGA solder joint array by removing the outermost rows and columns, positioning all connections directly beneath the silicon die. Two commonly used solder alloys—SAC305 and Sn37Pb—were selected to evaluate the effects of this optimized array design. A combined experimental and numerical approach was employed, including accelerated thermal cycling (–40 °C to 125 °C), in situ resistance monitoring, cross-sectional failure analysis, and finite element modeling (FEM) to assess fatigue behavior under the altered layout. The optimized array significantly improved performance for SAC305, yielding a 1.67× increase in mean cycles-to-failure and a 29% reduction in peak von Mises stress, with failure locations shifting from the corners to more evenly distributed areas beneath the die. Sn37Pb assemblies showed only a 1.01× improvement despite an 11% stress reduction, attributed to persistent shear-dominated failures at second-row joints. These results highlight the critical influence of joint array architecture and solder alloy selection on reliability, offering design-level guidance for applications prioritizing thermomechanical robustness with reduced I/O counts. Full article

This study investigates the microstructural changes and micromechanical responses of Pb-containing and Pb-free solder alloys subjected to various annealing conditions, with the goal of elucidating the relationship between microstructure evolution and micromechanical properties. Results indicate that grain size in SAC0307 and SAC305 significantly increases with annealing temperature, while that of Sn63Pb37 remains relatively stable. In Sn63Pb37, the Pb-rich phase coarsens and its area fraction increases with higher annealing temperatures, whereas in SAC0307, the intermetallic compounds (IMCs) phase coarsens but its area fraction decreases. Nano-indentation tests show that the hardness of Sn63Pb37 significantly increases with rising annealing temperature, whereas the hardness of SAC0307 decreases, and that of SAC305 remains relatively unchanged. These variations in these alloys induced by annealing are closely related to the changes in the hardness of individual phases within the grains. For Sn63Pb37, higher annealing temperatures increase the hardness of both the Sn matrix and Pb-rich phases, enhancing overall hardness. Conversely, in SAC0307, increased temperatures reduced the hardness of both the Sn matrix and IMCs phases, resulting in lower overall hardness. The differing trends in mechanical property of individual phases in three alloy are attributed to their distinct evolutions under annealing treatment. This study provides insights into the micromechanical behavior of solder alloys under annealing and offers guidance for optimizing their performance. Full article

This study investigates the interfacial reactions of FeCoNiCr and FeCoNiMn medium-entropy alloys (MEAs) with Sn and Sn-3Ag-0.5Cu (SAC305) solders at 250 °C. The evolution of interfacial microstructures is analyzed over various aging periods. For comparison, the FeCoNiCrMn high-entropy alloy (HEA) is also examined. In the Sn/FeCoNiCr system, a faceted (Fe,Cr,Co)Sn₂ layer initially forms at the interface. Upon aging, the significant spalling of large (Fe,Cr,Co)Sn₂ particulates into the solder matrix occurs. Additionally, an extremely large, plate-like (Co,Ni)Sn₄ phase forms at a later stage. In contrast, the Sn/FeCoNiMn reaction produces a finer-grained (Fe,Co,Mn)Sn₂ phase dispersed in the solder, accompanied by the formation of the large (Co,Ni)Sn₄ phase. This observation suggests that Mn promotes the formation of finer intermetallic compounds (IMCs), while Cr facilitates the spalling of larger IMC particulates. The Sn/FeCoNiCrMn system exhibits stable interfacial behavior, with the (Fe,Cr,Co)Sn₂ layer showing no significant changes over time. The interfacial behavior and microstructure are primarily governed by the dissolution of the constituent elements and composition ratio of the HEAs, as well as their interactions with Sn. Similar trends are observed in the SAC305 solder reactions, where a larger amount of fine (Fe,Co,Cu)Sn₂ particles spall from the interface. This behavior is likely attributed to Cu doping, which enhances nucleation and stabilizes the IMC phases, promoting the formation of finer particles. The wettability of SAC305 solder on MEA/HEA substrates was further evaluated by contact angle measurements. These findings suggest that the presence of Mn in the substrate enhances the wettability of the solder. Full article

The self-healing characteristics of Al6061 reinforced with CuO have been examined experimentally. The solder alloys 60Pb40Sn and 99.3Sn0.7Cu with low melting points are incorporated to strengthen the Al6061 MMCs’; the self-healing properties have been investigated. Developed self-healing samples have undergone testing for hardness, tensile, and impact characteristics in accordance with ASTM standard test protocols. The findings demonstrate how the solder filling affects the mechanical characteristics of self-healed Al6061 alloy and its MMCs’. The results showed that the composites formed a decent bond between the solder and matrix, confirming successful fabrication. Pb-Sn filled samples demonstrated higher self-healing efficiency for tensile and impact of 90.02% and 90.30% with 6 wt.% of CuO, respectively, and Sn-Cu filled samples witnessed higher self-healing efficiency for tensile and impact of 91.81% and 91.09% with 6 wt.% of CuO respectively. However, the self-healed composite did not split in two when subjected to Charpy impact and tensile strength tests, and the healing efficiency of Sn-Cu-filled composites is higher than that of the Pb-Sn-filled composites. Full article

Transient liquid-phase bonding (TLPB) enables the low-temperature fabrication of encapsulated solder joints with high-temperature resistance and electromigration resilience; yet, Ni-Sn TLPB joints suffer from brittle fracture due to intermetallic compounds (IMCs). This study investigates the Co, Cu, and Pt alloying effects on Ni₃Sn via formation energy, molecular dynamics, and first-principles calculations. Occupancy models of Ni_6−xM_xSn₂ (M = Co, Cu, and Pt) were established, with the lattice parameters, B/G ratios, fracture toughness (K_IC), and stress–strain behaviors analyzed. The results reveal that Co enhances fracture toughness and reduces Ni₃Sn anisotropy, mitigating microcrack risks, while Cu/Pt introduce antibonding interactions (Cu–Sn and Pt–Sn), weakening the bonding strength. The classical B/G brittleness criterion proves inapplicable in Ni–M–Sn systems due to mixed bonding (metallic/covalent) and the hexagonal structure’s limited slip systems. The Ni_6−xCo_xSn₂ formation improves toughness with a low Co content, supported by an electronic structure analysis (density of states and Bader charges). The thermodynamic stability and reduced molar shrinkage (Ni + Sn → Ni₃Sn) confirm Co’s efficacy in optimizing Ni–Sn solder joints. Full article

Micro Light Emitting Diode (Micro-LED) technology, characterized by exceptional brightness, low power consumption, fast response, and long lifespan, holds significant potential for next-generation displays, yet its commercialization hinges on resolving challenges in high-density interconnect fabrication, particularly micrometer-scale bump formation. Traditional fabrication approaches such as evaporation enable precise bump control but face scalability and cost limitations, while electroplating offers lower costs and higher throughput but suffers from substrate conductivity requirements and uneven current density distributions that compromise bump-height uniformity. Emerging alternatives include electroless plating, which achieves uniform metal deposition on non-conductive substrates through autocatalytic reactions albeit with slower deposition rates; ball mounting and dip soldering, which streamline processes via automated solder jetting or alloy immersion but struggle with bump miniaturization and low yield; and photosensitive conductive polymers that simplify fabrication via photolithography-patterned composites but lack validated long-term stability. Persistent challenges in achieving micrometer-scale uniformity, thermomechanical stability, and environmental compatibility underscore the need for integrated hybrid processes, eco-friendly manufacturing protocols, and novel material innovations to enable ultra-high-resolution and flexible Micro-LED implementations. This review systematically compares conventional and emerging methodologies, identifies critical technological bottlenecks, and proposes strategic guidelines for industrial-scale production of high-density Micro-LED displays. Full article

With the enhancement of environmental protection awareness and the implementation of related regulations, lead-free soldering materials are gradually replacing the traditional leaded soldering materials in the field of electronics manufacturing. Sn–Ag soldering materials have become a research hotspot because of their good mechanical properties, solderability, and thermal fatigue reliability, but their high cost limits their large-scale application. The low silver content of the Sn–Ag solder reduces the cost while maintaining an excellent performance. However, as the size of electronic components shrinks and the package density increases, the solder joint spacing decreases, the potential gradient increases, and electrochemical migration (ECM) becomes a key factor affecting the reliability of solder joints. In this study, the ECM failure process was simulated by the water droplet method, and the SEM and XPS analyses were utilized to investigate the ECM mechanism of Sn1.0Ag solder alloys, and the effects of different concentrations of NaCl solutions on their ECM were investigated. The results showed that the ECM of the Sn1.0Ag solder occurred in a 0.01 M NaCl solution, the dendritic composition was pure Sn, and the white precipitate was a mixture of Sn(OH)₂ and Sn(OH)₄. With the increase in the NaCl concentration, the corrosion resistance of the Sn1.0Ag solder alloy decreases and the ECM reaction intensifies, but with a high concentration of the NaCl solution, a large amount of precipitation hinders the migration of Sn ions, resulting in the generation of no dendrites. The present study provides new insights into the ECM behavior of a low-silver-content Sn–Ag solder system. Full article

As semiconductor packaging technologies face limitations, through-silicon via (TSV) technology has emerged as a key solution to extending Moore’s law by achieving high-density, high-performance microelectronics. TSV technology enables enhanced wiring density, signal speed, and power efficiency, and offers significant advantages over traditional wire-bonding techniques. However, achieving fine-pitch and high-density interconnects remains a challenge. Solder flip-chip microbumps have demonstrated their potential to improve interconnect reliability and performance. However, the environmental impact of lead-based solders necessitates a shift to lead-free alternatives. This review highlights the transition from Sn-Pb solders to lead-free options, such as Sn-Ag, Sn-Cu, Sn-Ag-Cu, Sn-Zn, and Bi- or In-based alloys, driven by regulatory and environmental considerations. Although lead-free solders address environmental concerns, their higher melting points pose challenges such as thermal stress and chip warping, which affect device reliability. To overcome these challenges, the development of low-melting-point solder alloys has gained momentum. This study examines advancements in low-temperature solder technologies and evaluates their potential for enhancing device reliability by mitigating thermal stress and ensuring long-term stability. Full article

Soldering with Sn alloys has always been the essential assembly step of microelectronics. The conductive Sn whiskers, which can spontaneously grow from soldering surfaces, mean a considerable reliability risk for microelectronics due to possible short circuit formation between the leads of the components. Since their discovery in 1951, thousands of research studies have been conducted to unravel their growth mechanisms and find effective prevention methods against them. Till 2006, the Sn whisker problem was solved and partially forgotten due to the very effective whisker suppression effect of Pb alloying into the solder materials. The lead-free change gave new impetus to the problem, which was further enhanced by the application of new material systems, growing reliability requirements, and accelerating miniaturization in the 21st century. Our review would like to give an overview of the Sn whisker’s history from the beginning till the latest results, focusing on the suppression solutions by the modification of the solder alloy compositions. Recently, promising results have been reached by alloying Bi and In, which are metals that are the focus of low-temperature soldering, and by composite solders. Full article

This paper presents a comparative study of the fatigue life of solder joints in a board-level Ball Grid Array (BGA) assembly. It specifically contrasts the commonly used SAC305 alloy with the advanced Innolot-based solder alloy, recognized for its superior tensile strength. Through Finite Element Analysis (FEA), we simulate and predict the reliability of these solder joints under harmonic and random vibration conditions. Following the JEDEC (Joint Electronic Device Engineering Council) standards, two different board-level BGA assemblies are used for the analysis. In both assemblies, the dimensions of the substrate, molding compound, and solder balls remain identical; only the board dimensions are changed to observe how they affect stress in the solder joints. The results indicate that using Innolot raises the volume-averaged stress levels by more than 25% on larger boards and about 5% on smaller boards compared to SAC305. This increase in stress levels is due to the Innolot alloy having a less significant stiffening effect than SAC305, which results in higher stress levels under the same excitation conditions. While the stress in the Innolot-based solder joint is greater than that in the SAC305 joint under identical excitation conditions, the fatigue life of the Innolot joint is significantly higher than that of the SAC305 joint. The results show that the Innolot-based alloy exceeds the performance of SAC305, and that it is suitable for use as a solder alloy in extreme vibration conditions. Full article

In this paper, the issue of an aging process’s influence on power LEDs’ properties is considered. Some measured DC characteristics of these devices and their thermal and optical parameters obtained are presented after considering different values of the aging process’ duration. Components soldered using different metal–ceramic composite pastes, e.g., with TiO₂, were tested. The tested devices and the used measurement setup are described. The measurement procedure is described in detail. The obtained measurement results are discussed. It is shown that after the aging process at elevated temperatures, worse properties were observed for the power LEDs soldered using classical SACX0307 alloy. Most of the samples soldered with reference alloy (not composite) were damaged during the test. The best properties were obtained for the samples soldered with solder paste with the addition of titanium oxide. Full article