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Materials
Volume 18
Issue 15
10.3390/ma18153634
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Article

Microstructural Characterisation of Bi-Ag-Ti Solder Alloy and Evaluation of Wettability on Ceramic and Composite Substrates Joined via Indirect Electron Beam Heating in Vacuum

by
Mikulas Sloboda
1,*,
Roman Kolenak
1,
Tomas Melus
1,
Peter Gogola
1,
Matej Pasak
1,
Daniel Drimal
2 and
Jaromir Drapala
3
1
Faculty of Materials Science and Technology in Trnava, Slovak University of Technology in Bratislava, Jána Bottu č. 2781/25, 917 24 Trnava, Slovakia
2
The First Welding Company Inc., Kopčianska 14, 851 01 Bratislava, Slovakia
3
FMT—Faculty of Materials Science and Technology, Technical University of Ostrava, 17. Listopadu 15, 708 33 Ostrava, Czech Republic
*
Author to whom correspondence should be addressed.
Materials 2025, 18(15), 3634; https://doi.org/10.3390/ma18153634 (registering DOI)
Submission received: 1 July 2025 / Revised: 25 July 2025 / Accepted: 26 July 2025 / Published: 1 August 2025
(This article belongs to the Special Issue Advanced Materials and Processing Technologies)
Versions Notes

Abstract

This paper examines the wettability and interactions between ceramic and composite materials soldered with Bi-based solder containing 11 wt.% of silver and 3 wt.% titanium using indirect electron beam soldering technology. The Bi11Ag3Ti solder, with a melting point of 402 °C, consisted of a bismuth matrix containing silver lamellae. Titanium, acting as an active element, positively influenced the interaction between the solder and the joined materials. SiC and Ni-SiC substrates were soldered at temperatures of 750 °C, 850 °C, and 950 °C. Measurements of wettability angles indicated that the lowest value (20°) was achieved with SiC substrates at 950 °C. A temperature of 750 °C appeared to be the least suitable for both substrates and was entirely unsuitable for Ni-SiC. It was also observed that the Bi11Ag3Ti solder wetted the SiC substrates more effectively than Ni-SiC substrates. The optimal working temperature for this solder was determined to be 950 °C. The shear strength of the joints soldered with the Bi11Ag3Ti alloy was 23.5 MPa for the Al2O3/Ni-SiC joint and 9 MPa for the SiC/Ni-SiC joint.
Keywords: active solder; higher application temperatures; ceramic material; electron beam soldering active solder; higher application temperatures; ceramic material; electron beam soldering

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MDPI and ACS Style

Sloboda, M.; Kolenak, R.; Melus, T.; Gogola, P.; Pasak, M.; Drimal, D.; Drapala, J. Microstructural Characterisation of Bi-Ag-Ti Solder Alloy and Evaluation of Wettability on Ceramic and Composite Substrates Joined via Indirect Electron Beam Heating in Vacuum. Materials 2025, 18, 3634. https://doi.org/10.3390/ma18153634

AMA Style

Sloboda M, Kolenak R, Melus T, Gogola P, Pasak M, Drimal D, Drapala J. Microstructural Characterisation of Bi-Ag-Ti Solder Alloy and Evaluation of Wettability on Ceramic and Composite Substrates Joined via Indirect Electron Beam Heating in Vacuum. Materials. 2025; 18(15):3634. https://doi.org/10.3390/ma18153634

Chicago/Turabian Style

Sloboda, Mikulas, Roman Kolenak, Tomas Melus, Peter Gogola, Matej Pasak, Daniel Drimal, and Jaromir Drapala. 2025. "Microstructural Characterisation of Bi-Ag-Ti Solder Alloy and Evaluation of Wettability on Ceramic and Composite Substrates Joined via Indirect Electron Beam Heating in Vacuum" Materials 18, no. 15: 3634. https://doi.org/10.3390/ma18153634

APA Style

Sloboda, M., Kolenak, R., Melus, T., Gogola, P., Pasak, M., Drimal, D., & Drapala, J. (2025). Microstructural Characterisation of Bi-Ag-Ti Solder Alloy and Evaluation of Wettability on Ceramic and Composite Substrates Joined via Indirect Electron Beam Heating in Vacuum. Materials, 18(15), 3634. https://doi.org/10.3390/ma18153634

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