Search Results (33)

In the present study, the coaxial waterjet-assisted nanosecond laser drilling of micro-holes in C_f/SiC composites, coupled with nanosecond laser drilling in air for fabricating micro-holes with high aspect ratios, were investigated. The surface morphology, reaction products, and micro-hole shapes were thoroughly examined. The results reveal that, for the coaxial waterjet-assisted nanosecond laser drilling of micro-holes in the C_f/SiC composite, the increasing of waterjet velocity enhances the material removal rate and micro-hole depth, but reduces the micro-hole diameter and taper angle. The coaxial waterjet isolates the laser-ablated region and cools down the corresponding region rapidly, leading to the formation of a mixture of SiC, SiO₂, and Si on the surface. As the coaxial waterjet velocity increases, the morphology of residual surface products changes from a net-like structure to individual spheres. Coaxial waterjet-assisted nanosecond laser drilling, with a waterjet velocity of 9.61 m/s, achieves micro-holes with a good balance between efficiency and quality. For the fabrication of micro-holes with a high aspect ratio in C_f/SiC composites, micro-holes fabricated by nanosecond laser drilling in air exhibit obvious taper features, which should be ascribed to the combined effects of spattering slag, plasma, and energy dissipation. The application of coaxial waterjet-assisted nanosecond laser drilling on micro-holes fabricated by laser drilling in air effectively expands the hole diameter. The fabricated micro-holes have very small taper angles, with clean wall surfaces and almost no reaction products. This approach, combining nanosecond laser drilling in air followed by coaxial waterjet-assisted nanosecond laser drilling, offers a promising technique for fabricating high-quality micro-holes with high aspect ratios in C_f/SiC composites. Full article

Given the exceptional capabilities of femtosecond laser processing in achieving high-precision ablation for air-film cooling hole fabrication on turbine blades, it is imperative to develop an advanced monitoring methodology that enables real-time feedback control to automatically terminate the laser upon complete penetration detection, thereby effectively preventing backside damage. To tackle this issue, a spectrum-domain coherent imaging technique has been developed. This innovative approach adapts the fundamental principle of fiber-based Michelson interferometry by integrating the air-film hole into a sample arm configuration. A broadband super-luminescent diode with a 830 nm central wavelength and a 26 nm spectral bandwidth serves as the coherence-optimized illumination source. An optimal normalized reflectivity of 0.2 is established to maintain stable interference fringe visibility throughout the drilling process. The system achieves a depth resolution of 11.7 μm through Fourier transform analysis of dynamic interference patterns. With customized optical path design specifically engineered for through-hole-drilling applications, the technique demonstrates exceptional sensitivity, maintaining detection capability even under ultralow reflectivity conditions (0.001%) at the hole bottom. Plasma generation during laser processing is investigated, with plasma density measurements providing optical thickness data for real-time compensation of depth measurement deviations. The demonstrated system represents an advancement in non-destructive in-process monitoring for high-precision laser machining applications. Full article

The present work aims to verify whether the incremental hole-drilling technique (IHD), a widely accepted technique, is suitable for determining residual stresses in AISI 316L samples obtained by selective laser melting (SLM). The thermo-mechanical effects of cutting during the application of this technique can induce unwanted residual stresses due to the relatively low thermal conductivity of this material, leading to erroneous results. To accomplish this aim, a hybrid experimental-numerical method was implemented to analyze the ability of IHD to determine an imposed stress state. Experimentally, samples were subjected to a tensile calibration stress using a horizontal tensile test machine. To eliminate pre-existing residual stress, the samples were subjected to differential loads, instead of absolute ones. In this way, experimental strain-depth relaxation curves related to the imposed calibration stress were obtained. Based on the experimental data, IHD was numerically simulated using the finite element method. Numerical strain-depth relaxation curves, related to the same calibration stress used in the experimental study, were obtained. The comparison between the experimental and numerical strain-depth relaxation curves, as well as the stresses calculated using the so-called integral method for determining stresses via IHD, shows that IHD is a suitable technique for measuring residual stresses in additively manufactured AISI 316L samples. Full article

Modified polyimide (MPI) flexible printed circuits (FPCs) are used as chip carrier boards. The quality of the FPC directly affects the reliability of the integrated circuit. Furthermore, micro-holes are critical components of FPCs. In this study, an ultraviolet (UV) femtosecond laser is used to drill micro-holes in double-layer flexible circuit boards with MPI as the substrate. The morphology of the micro-hole wall in the copper foil and MPI layer is observed, and the effects of the laser processing parameters on the diameter and depth of the micro-holes are analyzed. The drilling process and mechanism of micro-holes obtained using a UV femtosecond laser in MPI FPCs are discussed. The results show that the morphology of femtosecond laser-machined copper is closely related to the laser energy, and a periodic structure is observed during the machining process. Copper, MPI, and copper oxides are the most common molten deposits in micro-holes during drilling. The depth of the micro-holes increases with an increase in the energy of a single pulse, scanning time, and scanning overlap rate of the laser beam. However, the diameter exhibits no discernible alteration. The material removal rate increased significantly when laser processing was applied to the MPI resin layer. Full article

Laser drilling is widely used for fabricating holes in the semiconductor industry due to high throughput and a small heat-affected zone. However, it produces varying depths owing to uncertain external conditions and requires live control at the rate of a few tens of kHz to handle the fast material removal rate. Optical coherent tomography is capable of in situ acquiring a raw interferogram at a high rate (>80 kHz), but the depth extraction is slow due to the involved heavy Fast Fourier Transform (FFT). To address this, an efficient depth-tracking algorithm is proposed to save the FFT. It searches the depth in the raw interferogram locally with a known last depth given the two truths that only one depth exists and the adjacent depths do not change significantly. The proposed algorithm was proven to expedite the measuring rate six times with sub-pixel tracking precision. To further secure the rate against the interrupting of the system, the tracking process is parallelly implemented in a field-programmable gate array. The closed-loop control tests were conducted on probe cards with depth variations introduced by offsetting laser focus. The proposed method maintained a uniform depth, with variations reduced by 80% compared to traditional methods. Full article

The laser beam mode affects the power density distribution on the irradiated target, directly influencing the product quality in laser processing, especially the hole quality in laser drilling. The Gaussian beam shape, Mexican-Hat beam shape, Double-Hump beam shape, and Top-Hat beam shape are four typical laser beam modes used as a laser heat source and introduced into our proficient laser-drilling model, which involves complex physical phenomena such as heat and mass transfer, solid/liquid/gas phase changes, and two-phase flow. Simulations were conducted on an aluminum target, and the accuracy was verified using experimental data. The results of the simulations for the fundamental understanding of this laser–material interaction are presented in this paper; in particular, the hole shape, including the depth–diameter ratio and the angle of the cone, as well as spatter phenomena and, thus, the formed recast layer, are compared and analyzed in detail in this paper. This study can provide a reference for the optimization of the laser-drilling process, especially the selection of laser beam mode. Full article

In this contribution, we present novel results on top-down drilling in silicon, the most important semiconductor material, focusing specifically on the influence of the laser parameters. We compare the holes obtained with repetitive single pulses, as well as in different MHz- and GHz-burst regimes. The deepest holes were obtained in GHz-burst mode, where we achieved holes of almost 1 mm depth and 35 µm diameter, which corresponds to an aspect ratio of 27, which is higher than the ones reported so far in the literature, to the best of our knowledge. In addition, we study the influence of the energy repartition within the burst in GHz-burst mode. Full article

In this paper, water jet-guided laser (WJGL) drilling of ${\mathrm{C}}_{\mathrm{f}}/\mathrm{SiC}$ composites was employed and the effects of the processing parameters on the depth and quality of the micro-holes were systematically investigated. Firstly, the depth measurement showed that the increase in processing time and power density led to a significant improvement in micro-hole drilling depth. However, the enhancement of the water jet speed resulted in a pronounced decrease in the depth due to the phenomenon of water splashing. In contrast, the scanning speed, path overlap ratio, pulse frequency, and helium pressure exhibited less effect on the micro-hole depth. Secondly, the microstructural analysis revealed that the increase in power density resulted in the deformation and fracture of the carbon fibers, while the augmentation in water jet speed reduced the thermal defects. Finally, based on the optimization of the processing parameters, a micro-hole of exceptional quality was achieved, with a depth-to-diameter ratio of 8.03 and a sidewall taper of 0.72°. This study can provide valuable guidance for WJGL micro-hole drilling of ${\mathrm{C}}_{\mathrm{f}}/\mathrm{SiC}$ composites. Full article

Electrochemical machining (ECM) has become more prevalent in titanium alloy processing. However, the presence of the passivation layer on the titanium alloys significantly impacts the performance of ECM. In an attempt to overcome the passivation effects, a high-temperature electrolyte or the addition of halogen ions to the electrolyte has been used. Still, it often results in compromised machining accuracy and surface roughness. This study applied laser and shaped tube electrolytic machining (Laser-STEM) for titanium alloy drilling, where the laser was guided to the machining zone via total internal reflection. The performance of Laser-STEM using different types of electrolytes was compared. Further, the effects of laser power and pulse voltage on the machining side gap, material removal rate (MRR), and surface roughness were experimentally studied while drilling small holes in titanium alloy. The results indicated that the use of passivating electrolytes improved the machining precision, while the MRR decreased with an increase in laser power during Laser-STEM. The MRR showed an increase while using aggressive electrolytes; however, at the same time, the machining precision deteriorated with the increase in laser power. Particularly, the maximum feeding rate of 6.0 mm/min for the tool electrode was achieved using NaCl solution as the electrolyte during Laser-STEM, marking a 100% increase compared to the rate without the use of a laser. Moreover, the model and equivalent circuits were also established to illustrate the material removal mechanisms of Laser-STEM in different electrolytes. Lastly, the processing of deep small holes with a diameter of 1.5 mm, a depth of 38 mm, and a surface roughness of Ra 2 µm was achieved via Laser-STEM without the presence of a recast layer and heat-affected zones. In addition, the cross-inner flow channels in the titanium alloys were effectively processed. Full article

In this paper, the experimentally observed significant increase in yield stress for strain rates beyond 10⁴ s⁻¹ (viscous regime) is explicitly considered in laser shock processing (LSP) simulations. First, a detailed review of the most common high-strain-rate deformation models is presented, highlighting the expected strain rates in materials subject to LSP for a wide range of treatment conditions. Second, the abrupt yield stress increase presented beyond 10⁴ s⁻¹ is explicitly considered in the material model of a titanium alloy subject to LSP. A combined numerical–analytical approach is used to predict the time evolution of the plastic strain. Finally, extended areas are irradiated covering a squared area of 25 × 25 mm² for numerical–experimental validation. The in-depth experimental residual stress profiles are obtained by means of the hole drilling method. Near-surface-temperature gradients are explicitly considered in simulations. In summary, the conventionally accepted strain rate range in LSP (10⁶–10⁷ s⁻¹) is challenged in this paper. Results show that the conventional high-strain-rate hardening models widely used in LSP simulations (i.e., Johnson Cook model) clearly overestimate the induced compressive residual stresses. Additionally, pressure decay, whose importance is usually neglected, has been found to play a significant role in the total plastic strain achieved by LSP treatments. Full article

In this contribution, we present a comparative study on top-down drilling in sodalime glass, with a femtosecond laser operating in single-pulse, MHz-burst and GHz-burst modes, respectively. We investigate the hole depth, drilling rate, and hole morphology for these three regimes while keeping the same experimental conditions. We demonstrate that, for both burst regimes, the burst length has to be adapted for optimizing the hole depth. In the GHz-burst regime, the lower the ablation rate the longer the holes. The three drilling regimes lead to different hole morphologies, where the GHz-burst mode results in the best hole quality featuring glossy inner walls and an almost cylindrical morphology. Furthermore, we obtain crack-free holes, the deepest measuring 3.7 mm in length and 25 µm in entrance diameter corresponding to an aspect ratio of 150, which is the highest aspect ratio reported thus far with femtosecond GHz-burst drilling to the best of our knowledge. Full article

In this study, the novel coaxial-annulus-argon-assisted (CAAA) atmosphere is proposed to enhance the machining capacity of the water-jet-guided laser (WJGL) when dealing with hard-to-process materials, including ceramic matrix composites (CMCs) and chemical-vapor-deposition (CVD) diamond. A theoretical model was developed to describe the two-phase flow of argon and the water jet. Simulations and experiments were conducted to analyze the influence of argon pressure on the working length of the WJGL beam, drainage circle size, and extreme scribing depth on ceramic matrix composite (CMC) substrates. A comparative experiment involving coaxial annulus and helical atmospheres revealed that the coaxial annulus atmosphere disrupts the water jet proactively, while effectively maintaining the core velocity within the confined working length and enhancing the processing capability of the WJGL beam. Single-point percussion drilling experiments were performed on a CMC substrate to evaluate the impact of machining parameters on hole morphology. The maximum depth-to-width ratio of the groove and depth-to-diameter ratio of the hole reached up to 41.2 and 40.7, respectively. The thorough holes produced by the CAAAWJGL demonstrate superior roundness and minimal thermal damage, such as fiber drawing and delamination. The average tensile strength and fatigue life of the CMCs specimens obtained through CAAAWJGL machining reached 212.6 MPa and 89,463.8 s, exhibiting higher machining efficiency and better mechanical properties compared to femtosecond (194.2 MPa; 72,680.2 s) and picosecond laser (198.6 MPa; 80,451.4 s) machining. Moreover, groove arrays with a depth-to-width ratio of 11.5, good perpendicularity, and minimal defects on a CVD diamond were fabricated to highlight the feasibility of the proposed machining technology. Full article

The femtosecond GHz-burst mode laser processing has attracted much attention in the last few years. Very recently, the first percussion drilling results obtained in glasses using this new regime were reported. In this study, we present our latest results on top-down drilling in glasses, focusing specifically on the influence of burst duration and shape on the hole drilling rate and the quality of the drilled holes, wherein holes of very high quality with a smooth and glossy inner surface can be obtained. We show that a decreasing energy repartition of the pulses within the burst can increase the drilling rate, but the holes saturate at lower depths and present lower quality than holes drilled with an increasing or flat energy distribution. Moreover, we give an insight into the phenomena that may occur during drilling as a function of the burst shape. Full article

Using mechanical drilling to obtain energy resources stored in deep and hard rock layers is becoming increasingly challenging. Therefore, laser irradiation has emerged as a new and promising drilling method. In this study, the effects of immersion conditions on rock-breaking by laser irradiation on the temperature, hole size, rock-breaking efficiency, and macro-fracture after laser irradiation were investigated. Furthermore, the mineral changes and thermogravimetric analysis of rocks were studied. As indicated by the results, the temperature area over 100 °C increases with the increase of irradiation time, and the temperature range of between 2.27 cm² and 13.20 cm² varies with the change of laser power at between 90 W and 135 W. The hole-diameter value of the soaked sample was smaller than that of the dried sample. In addition, the hole depth of the soaked sample reduced by 15% at a power of 90 W and 45% at a power of 135 W, compared with that of the dried sample. The value of the modified specific energy of the soaked sample increased, which was particularly noticeable at low power. The soaked sample had a larger effect on the rate of perforation at high power and a smaller effect at low power. The cracks on the surface of the rock samples became larger after being placed for one month. Fracture length increased from 0.61 to 5.09 mm for dried samples and from 2.24 to 8.7 mm for soaked samples at a laser power of 90 W. Fracture length increased from 6.30 to 9.85 mm for dried samples and from 9.04 to 11.38 mm for soaked samples at a laser power of 135 W. The soaked sample began to show differences when heated at 100 °C, which was caused by the evaporation of some free water molecules in the rock. The main weight loss temperatures of the samples occurred in the range of 640 °C to 900 °C. Full article

In high-aspect ratio laser drilling, many laser and optical parameters can be controlled, including the high-laser beam fluence and number of drilling process cycles. Measurement of the drilled hole depth is occasionally difficult or time consuming, especially during machining processes. This study aimed to estimate the drilled hole depth in high-aspect ratio laser drilling by using captured two-dimensional (2D) hole images. The measuring conditions included light brightness, light exposure time, and gamma value. In this study, a method for predicting the depth of a machined hole by using a deep learning methodology was devised. Adjusting the laser power and the number of processing cycles for blind hole generation and image analysis yielded optimal conditions. Furthermore, to forecast the form of the machined hole, we identified the best circumstances based on changes in the exposure duration and gamma value of the microscope, which is a 2D image measurement instrument. After extracting the data frame by detecting the contrast data of the hole by using an interferometer, the hole depth was predicted using a deep neural network with a precision of within 5 μm for a hole within 100 μm. Full article