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Method for Keyhole-Free High-Aspect-Ratio Trench Refill by LPCVD
- Henk-Willem Veltkamp,
- Yves L. Janssens,
- Meint J. de Boer,
- Yiyuan Zhao,
- Remco J. Wiegerink,
- Niels R. Tas and
- Joost C. Lötters
In micro-machined micro-electromechanical systems (MEMS), refilled high-aspect-ratio trench structures are used for different applications. However, these trenches often show keyholes, which have an impact on the performance of the devices. In this p...