- Review
65 Pages
Thermal Management Challenges in 2.5D and 3D Chiplet Integration: A Review on Architecture–Cooling Co-Design
- Darpan Virmani and
- Baibhab Chatterjee
The increasing power density of 2.5D and 3D chiplets imposes severe thermal constraints that have a direct impact on the performance and long-term reliability of high-performance computing systems. Stacked and laterally integrated dies, which generat...