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Search Results (591)

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Keywords = film-substrate adhesion

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16 pages, 3370 KB  
Article
Optimized Interfacial Layers for High-Adhesion and Damp-Heat-Resistant Cu Meshes with Aperiodic Geometries on PET Substrates
by Xiao Lu, Jia Li, Biyou Bao, Chengli Zhang, Qiang Wang, Guanglong Xu, Xianfa Rao, Hongliang Zhang and Weijie Song
Materials 2026, 19(12), 2608; https://doi.org/10.3390/ma19122608 - 17 Jun 2026
Viewed by 221
Abstract
Copper (Cu) thin films and meshes on polyethylene terephthalate (PET) substrates are promising flexible transparent conductive electrodes (TCEs), yet their practical use is limited by insufficient interfacial adhesion and poor oxidative stability on inert polymer substrates. This work addresses these issues via a [...] Read more.
Copper (Cu) thin films and meshes on polyethylene terephthalate (PET) substrates are promising flexible transparent conductive electrodes (TCEs), yet their practical use is limited by insufficient interfacial adhesion and poor oxidative stability on inert polymer substrates. This work addresses these issues via a synergistic strategy of interfacial layer engineering and maskless laser lithography-based aperiodic mesh patterning, systematically comparing ceramic (Al2O3) and metallic (NiCr) interfacial layers for PET-supported Cu films and fabricating Linear/Sinusoidal aperiodic Cu meshes with tailored performance. Magnetron sputtering shows that Ar plasma-activated NiCr interfacial layers form a gradient-alloyed interface with Cu via interdiffusion, achieving 5B-level adhesion, mitigating bending-induced stress concentration, and enhancing damp-heat resistance (85 °C/85% RH) by suppressing oxidation—outperforming brittle Al2O3 layers. Patterning the optimized Cu/NiCr/PET structure into micrometer-scale meshes yields a Linear design with superior optoelectronic performance (~10.8 Ω/sq sheet resistance, >87% transmittance at 550 nm) and a Sinusoidal design with enhanced bending robustness via stress delocalization. Microstructural and elemental analyses clarify the NiCr layer’s interfacial toughening and anti-oxidation mechanisms. Practical validation in flexible transparent heaters demonstrates rapid thermal response and >20 h continuous operational stability. This study provides a scalable design strategy for high-performance PET-supported Cu meshes, offering insights for interface and structural optimization of flexible metallic TCEs for next-generation optoelectronics. Full article
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17 pages, 6402 KB  
Article
Rapid Formation and Interfacial Adhesion Enhancement in Zirconium Conversion Coatings on 55AlZnMg-Coated Steel Under a Short H2ZrF6 Pretreatment
by Xiaonan Zhang, Weixi Zhao and Lin Lu
Materials 2026, 19(12), 2545; https://doi.org/10.3390/ma19122545 - 12 Jun 2026
Viewed by 257
Abstract
To address the uneven deposition of zirconium conversion coatings on multiphase 55AlZnMg under short pretreatment cycles, this study investigated the time-dependent formation behavior of ZrCC in a selected H2ZrF6 bath. By precisely controlling the immersion time (20–90 s) and utilizing [...] Read more.
To address the uneven deposition of zirconium conversion coatings on multiphase 55AlZnMg under short pretreatment cycles, this study investigated the time-dependent formation behavior of ZrCC in a selected H2ZrF6 bath. By precisely controlling the immersion time (20–90 s) and utilizing SEM-EDS and AFM characterization techniques, this study systematically revealed the growth kinetics and film-forming mechanisms of ZrCC on complex alloy surfaces. The results indicate that the Zn-rich phase on the surface of the 55AlZnMg coating, due to its relatively positive potential, preferentially induces the deposition of the film-forming material. Subsequently, dealloying occurs in the Al-rich phase and the Mg/Zn enriched regions, forming Zn-enriched regions that promote the continuous deposition of the film-forming material, ultimately achieving complete surface coverage; the film morphology evolves from an initial needle-like structure to a network structure, eventually forming a nanosheet structure. The film-forming process of ZrCC on the 55AlZnMg substrate surface is primarily driven by selective growth, with electrochemical properties of the alloy phases, significantly enhancing adhesion between the aluminum-zinc-magnesium coating and the overcoat and providing practical guidance for improving surface uniformity and interfacial adhesion of Al-Zn-Mg-coated steel. Full article
(This article belongs to the Section Corrosion)
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17 pages, 8735 KB  
Article
Regulation of Laser-Deposited Silver Microstructures on Ceramic Surfaces and Their Effects on Electrical Conductivity
by Hui Zhang, Yongling Wu and Hongyu Zheng
Micromachines 2026, 17(6), 702; https://doi.org/10.3390/mi17060702 - 8 Jun 2026
Viewed by 255
Abstract
Silver conductive structures were fabricated on 96% alumina ceramic substrates by selectively irradiating a silver nitrate precursor liquid film using a 355 nm Nd:YAG nanosecond laser under ambient conditions, without the use of external reducing agents. The effects of laser energy density, scan [...] Read more.
Silver conductive structures were fabricated on 96% alumina ceramic substrates by selectively irradiating a silver nitrate precursor liquid film using a 355 nm Nd:YAG nanosecond laser under ambient conditions, without the use of external reducing agents. The effects of laser energy density, scan number, precursor concentration, plasma pretreatment, and PVP-30 addition on the morphology, composition, electrical conductivity, and adhesion of the deposited structures were investigated using XRD, SEM, EDS, contact angle measurements, resistance measurements, and tape-peeling tests. XRD confirmed the formation of metallic Ag in the laser-scanned regions. Insufficient laser energy density led to incomplete Ag+ reduction and discontinuous conductive paths, whereas excessive energy input caused hollow formation and Ag edge accumulation. A laser energy density of 12.03 J/cm2 provided a favorable balance among structural integrity, Ag enrichment, and electrical conductivity. Increasing the scan number promoted particle coalescence and conductive network formation, while 1000 scanning cycles provided a suitable balance between structural continuity and dimensional precision. As the AgNO3 concentration increased, the deposited structures evolved from isolated particles into continuous and compact layers, with 5 mol/L showing favorable deposition performance. Plasma pretreatment combined with PVP-30 addition reduced the contact angle of the ceramic surface from 48.25° to 19.05°, thereby improving the continuity, uniformity, and compactness of the deposits. After the scan spacing was reduced to form continuous silver films, the samples retained more than 98% of their conductivity after five tape-peeling cycles, with a resistivity of 6.14 × 10−8 Ω·m. These results demonstrate that laser-induced deposition is a controllable strategy for fabricating conductive silver structures on ceramic surfaces. Full article
(This article belongs to the Special Issue Micro/Nano Manufacturing of Electronic Devices, 2nd Edition)
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16 pages, 3202 KB  
Article
In-Plane Strain in Thin Film Peeling: A Numerical Study and a Unified Criterion for Stage Transition
by Kunlun Li, Minjia Xu, Lu Jia, Yuan Gao and Hong Hu
Mathematics 2026, 14(11), 1869; https://doi.org/10.3390/math14111869 - 27 May 2026
Viewed by 428
Abstract
Releasing a thin film adhered to a rigid substrate by peeling is a fundamental issue in interfacial mechanics and is of practical significance in many fields including flexible electronics, heterogeneous integration, and advanced packaging. While classical peeling theories have established the relationship between [...] Read more.
Releasing a thin film adhered to a rigid substrate by peeling is a fundamental issue in interfacial mechanics and is of practical significance in many fields including flexible electronics, heterogeneous integration, and advanced packaging. While classical peeling theories have established the relationship between peeling force and interfacial adhesion, the in-plane strain evolution that governs film deformation and possible damage remains underexplored. This paper presents a numerical investigation of the in-plane strain in thin film peeling using an energy-variational framework. The results show that the strain response cannot be inferred solely from the peeling force response. Moreover, the dependence of the global maximum strain on film thickness h, Young’s modulus E, interfacial adhesion energy γ, peeling angle θF, and the characteristic length l of the cohesive zone is systematically examined. To distinguish between two-stage and three-stage strain responses, a unified classification criterion is established based on these parameters. A closed-form polynomial decision boundary is obtained, which enables direct identification of the applicable regime and facilitates appropriate strain estimation in peeling processes. Full article
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21 pages, 3158 KB  
Article
Antimicrobial Properties of Ti- and Zr-Based Nanotextured Thin Film Metallic Glasses Against Pseudomonas aeruginosa
by Chijioke R. Onyeagba, Jonathan M. Harris, Timothy E. Egbo, Cameron Brown, Hongxia Wang and Tuquabo Tesfamichael
Biomolecules 2026, 16(6), 759; https://doi.org/10.3390/biom16060759 - 22 May 2026
Viewed by 531
Abstract
Nanotextured thin film metallic glasses (TFMGs) have emerged as promising antimicrobial coatings for biomedical applications; however, systematic comparisons across compositionally distinct Ti- and Zr-based systems, as well as their early-stage bactericidal mechanisms, remain limited. Here, we show, for the first time, a comparative, [...] Read more.
Nanotextured thin film metallic glasses (TFMGs) have emerged as promising antimicrobial coatings for biomedical applications; however, systematic comparisons across compositionally distinct Ti- and Zr-based systems, as well as their early-stage bactericidal mechanisms, remain limited. Here, we show, for the first time, a comparative, compositionally resolved correlation linking alloy chemistry, nanotexture, and bactericidal mechanisms across polymorphic TFMGs. Three co-sputtered biocompatible coatings (Ti47Fe41Cu12, Zr71Fe3Al26, and Zr58W31Cu11) were deposited on medical-grade titanium and stainless steel (SS316L) via magnetron co-sputtering, producing uniform amorphous films (190–298 nm) with nanoscale roughness of 1.6 ± 0.05 to 8.1 ± 0.05 nm. Surface wettability spanned hydrophilic (71.1 ± 5.6°) to hydrophobic (106.5 ± 3.5°), modulating bacterial interactions. Antimicrobial performance against Pseudomonas aeruginosa was evaluated using live/dead fluorescence imaging, quantitative image analysis, and electron microscopy after 2–4 h incubation. All coatings reduced bacterial adhesion and viability relative to bare substrates, with Zr58W31Cu11 achieving >60% reduction in surface-associated bacterial coverage. Time-resolved analysis revealed a rapid transition to predominantly non-viable populations on coated surfaces, in contrast to sustained viability on controls. Mechanistically, bactericidal activity arises from the synergistic coupling of nanotopography-induced membrane stress, wettability-governed adhesion energetics, and in situ formation of CuO, Fe2O3, WO3, and ZrO2 oxides that promote electrostatic interactions and proposed reactive oxygen species generation, driving oxidative membrane damage. These results establish a scalable design framework for TFMGs, while highlighting the need for long-term biofilm and electrochemical validation. Full article
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13 pages, 2254 KB  
Article
Development of a Screen-Printable Liquid Metal Ink on PDMS Substrates Toward Flexible Conductive Electronics
by Mengwen Guo, Shengming Jin, Sanhu Liu and Fang Wang
Sensors 2026, 26(11), 3279; https://doi.org/10.3390/s26113279 - 22 May 2026
Viewed by 561
Abstract
In this study, poly(vinylpyrrolidone) (PVP)-modified liquid metal (LM) particles were formulated into a mixed-solvent system comprising ethanol (EtOH), 1,2-propanediol (1,2-PG), and a trace amount of N,N-dimethylformamide (DMF). This design addresses the instability, poor wetting/adhesion on polydimethylsiloxane (PDMS), and limited rheological tunability of conventional [...] Read more.
In this study, poly(vinylpyrrolidone) (PVP)-modified liquid metal (LM) particles were formulated into a mixed-solvent system comprising ethanol (EtOH), 1,2-propanediol (1,2-PG), and a trace amount of N,N-dimethylformamide (DMF). This design addresses the instability, poor wetting/adhesion on polydimethylsiloxane (PDMS), and limited rheological tunability of conventional LM inks for screen printing. By regulating solvent evaporation during drying, the system enables coordinated control over wettability, viscosity, shear-thinning behavior, and drying-induced film formation. At an LM:PVP weight ratio of 20:1, the contact angle on PDMS decreased from 115° to 17.8°. The ink exhibited pronounced shear-thinning characteristics with tunable viscosity in the range of 1000–3000 cP, meeting the screen-printing requirements of facile mesh passage and rapid setting. Following laser activation, the printed conductive patterns demonstrated stable electrical performance, with a resistance drift of less than 1% after 14 days of storage and a ΔR/R0 of less than 1% after 3000 bending cycles at a bending diameter of 1 cm. Furthermore, a resistance drift of less than 3% was observed after 1000 stretching cycles at 30% strain. This study proposes a viable materials and processing strategy for the reliable screen printing of LM:PVP ink on PDMS substrates toward flexible conductive electronics. The motion-monitoring test is presented only as a preliminary proof-of-concept demonstration of motion-induced electrical resistance response, rather than as a sensor performance evaluation. Full article
(This article belongs to the Section Sensor Materials)
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15 pages, 2392 KB  
Article
The Effect of the Ar:N2:O2 Flow Ratio on the Structure, Hardness, and Adhesion of Thin TiON Films
by Aidar Kengesbekov, Ainur Serikbaikyzy and Arnur Askhatov
Coatings 2026, 16(5), 600; https://doi.org/10.3390/coatings16050600 - 15 May 2026
Viewed by 218
Abstract
This study investigates the effect of the gas mixture composition ratio (Ar:N2:O2) during magnetron sputtering on the morphology, phase composition, and visual characteristics of TiNxOy thin films. Five different modes were used with a variable N [...] Read more.
This study investigates the effect of the gas mixture composition ratio (Ar:N2:O2) during magnetron sputtering on the morphology, phase composition, and visual characteristics of TiNxOy thin films. Five different modes were used with a variable N2:O2 ratio ranging from 0.5 to 3. The resulting coatings exhibited noticeable differences in color—from golden to dark blue—which correlates with changes in chemical composition and phase state. The morphology of the films, examined by scanning electron microscopy (SEM), varied from a dense to a columnar structure. These results demonstrate that the properties of TiON coatings can be controlled by adjusting the N2:O2 ratio: nitrogen-rich conditions promote denser coatings with higher hardness and improved wear resistance, whereas a balanced N2:O2 ratio enhances coating adhesion to the substrate. Full article
(This article belongs to the Special Issue Wear and Tribology Properties of Materials, Films and Coatings)
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17 pages, 9154 KB  
Article
High-Temperature Sintered Conductive Silver Paste with Optimized Structure and Performance: Formula Design and Process Adjustment
by Gang Liu, Songlin Lu and Pengpeng Chen
Nanomaterials 2026, 16(10), 606; https://doi.org/10.3390/nano16100606 - 15 May 2026
Viewed by 532
Abstract
High-temperature sintered conductive silver paste serves as a critical material in the fabrication of electronic components, with its performance directly influencing device reliability and integration density. In this work, conductive silver paste was prepared via a ball milling method by dispersing silver powder [...] Read more.
High-temperature sintered conductive silver paste serves as a critical material in the fabrication of electronic components, with its performance directly influencing device reliability and integration density. In this work, conductive silver paste was prepared via a ball milling method by dispersing silver powder (conductive filler), glass powder (binder), and ethyl cellulose (EC, thickener) in an organic carrier composed of α-terpineol, diethylene glycol butyl ether acetate (DBA), and dimethyl phthalate (DMP) at specific ratios. The effects of the formulation composition and preparation process on the rheological properties of the paste as well as the electrical and mechanical properties of the resulting films were systematically investigated. The results indicated that sintering time and temperature exerted regular effects on the resistance of the silver paste; ball milling speed and duration influenced the particle size distribution, thereby affecting the resistance behavior; thixotropy significantly impacted the resistance characteristics. Under optimal conditions, where the organic carrier consisted of α-terpineol, DBA, and DMP at a ratio of 6:3:1, with 30 wt.% silver powder, 18 wt.% glass powder, and 4 wt.% EC, combined with a sintering temperature of 500 °C for 50–60 min, a ball milling speed of 500–600 r/min, and a ball milling time of approximately 1.5 h, the obtained silver paste exhibited pronounced shear-thinning behavior and excellent thixotropy, indicating favorable processability. The corresponding silver paste film demonstrated the lowest resistivity, superior bending resistance, and good adhesion to both PET and glass substrates. This study provides valuable insights for the design and preparation of high-performance, high-temperature sintered conductive silver pastes. Full article
(This article belongs to the Section Nanocomposite Materials)
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11 pages, 2286 KB  
Article
Improved Adhesion Strength of Silica Thin Films on Polycarbonate Substrates Without an Interlayer Using Remote Atmospheric-Pressure Chemical Vapor Deposition
by Hayate Endo, Akira Shirakura and Testuya Suzukia
Coatings 2026, 16(5), 593; https://doi.org/10.3390/coatings16050593 - 13 May 2026
Viewed by 306
Abstract
Silica thin-film coatings used for surface protection of automotive parts are generally deposited by chemical vapor deposition (CVD). In this study, we investigated substrate pretreatment methods to improve the adhesion between a polycarbonate substrate and a silica thin film during the direct synthesis [...] Read more.
Silica thin-film coatings used for surface protection of automotive parts are generally deposited by chemical vapor deposition (CVD). In this study, we investigated substrate pretreatment methods to improve the adhesion between a polycarbonate substrate and a silica thin film during the direct synthesis of a hard silica thin film on a polycarbonate substrate using remote atmospheric-pressure plasma CVD, without the use of an acrylic primer intermediate layer. Two types of substrate surface treatments were used: flame treatment and silicone baking. With flame treatment, the adhesion strength of the thin film was 43.5 mN, representing a 26% improvement compared to the untreated sample. With the silicone baking treatment, the adhesion strength was 42.3 mN, representing an improvement of approximately 22% compared to the untreated sample. Therefore, it is considered that the adhesion between the polycarbonate substrate and the silica thin film can be improved by controlling the state of the substrate surface through pretreatment. Full article
(This article belongs to the Special Issue Deposition-Based Coating Solutions for Enhanced Surface Properties)
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26 pages, 15987 KB  
Article
Thin Copper Foils: From Electrodeposition Conditions to Adhesion Performances
by Ivana O. Mladenović, Željko Radovanović, Dana G. Vasiljević-Radović, Rastko Vasilić, Miloš Vorkapić, Predrag Živković and Nebojša D. Nikolić
Materials 2026, 19(9), 1838; https://doi.org/10.3390/ma19091838 - 29 Apr 2026
Viewed by 431
Abstract
Cathodic electrodeposition of copper on molybdenum and stainless-steel substrates has been investigated with the aim of examining their potential to produce thin copper foils (TCFs). Copper in the form of a thin film was electrodeposited galvanostatically from the acidic sulfate electrolyte without and [...] Read more.
Cathodic electrodeposition of copper on molybdenum and stainless-steel substrates has been investigated with the aim of examining their potential to produce thin copper foils (TCFs). Copper in the form of a thin film was electrodeposited galvanostatically from the acidic sulfate electrolyte without and with an addition of suppressor/activator additives, such as chloride ions, polyethylene glycol 6000 and 3–mercapto–1–propanesulfonic acid. The cathodes and electrodeposited Cu films were characterized by SEM, AFM, and XRD techniques, while the adhesion of Cu films, as a crucial parameter in the production of Cu foils, was estimated by a lab-made prototype of a bending test machine made by applying additive technology. The adhesion parameter named “critical cycle number” (nc), which defines the minimal number of cycles leading to a delamination (separation) of the film from the cathode was used for assessing the adhesion features of the films. The easiest delamination, i.e., the smallest nc, showed nanocrystalline films obtained with the addition of all additives, whereupon the values were significantly smaller than the values obtained for microcrystalline films obtained without and with a partial combination of the additives. The easy delamination of the nanocrystalline films indicated that both substrates have a high potential for application in the production of TCFs. Full article
(This article belongs to the Special Issue Advances in Electrodeposition of Thin Films and Alloys)
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38 pages, 12172 KB  
Article
Primer Adhesion on Laser-Textured AA2024-T3: Effects of Texture Geometry via Reciprocating Sliding Tests
by Özer Coşkun, Sinan Fidan, Mustafa Özgür Bora, Satılmış Ürgün, Mehmet İskender Özsoy and Yezen Kandur
Coatings 2026, 16(5), 533; https://doi.org/10.3390/coatings16050533 - 29 Apr 2026
Viewed by 520
Abstract
To improve coating adhesion and tribological stability on aircraft-grade aluminum, this work utilizes periodic fiber-laser microtexts as a surface-engineering pre-treatment before applying an epoxy primer. AA2024-T3 panels were imprinted with rhombus, hexagon, and circular lattices (scale factors 100–250 µm; scan speeds 250–750 mm [...] Read more.
To improve coating adhesion and tribological stability on aircraft-grade aluminum, this work utilizes periodic fiber-laser microtexts as a surface-engineering pre-treatment before applying an epoxy primer. AA2024-T3 panels were imprinted with rhombus, hexagon, and circular lattices (scale factors 100–250 µm; scan speeds 250–750 mm s−1), then primed with an aerospace epoxy primer and evaluated within reciprocating sliding wear tests. Areal profilometry and sessile-drop goniometry measured topography and wettability, whereas friction–distance traces and scratch-track metrology resolved interfacial integrity. The textures expanded surface area and modified energy states in a geometry- and scale-dependent fashion, producing stable friction plateaus and smaller, less-lateral scratch scars compared to the untextured reference. Circular dimples reliably provided the best damage-tolerant behavior, a function of improved mechanical interlocking and debris/film management (reservoir and micro-trap effects), whereas polygonal lattices evidenced greater sensitivity to both scale and speed. Factorial analyses disclosed prevalent interaction effects amongst geometry, scale, and scan speed, reinforcing the notion that performance arises from co-optimized texture architecture rather than a single parameter. In systemic terms, laser-defined microtexts complemented with aerospace-standard primers represent a controllable pathway to vary friction, dampen wear, and improve coating–substrate adhesion. These results provide practical selection guides; and a broad selection prefers larger, well-spaced circular dimples for best-in-class performance and a transferable framework for designing texture-coating systems across aerospace and allied manufacturing contexts. Full article
(This article belongs to the Section Metal Surface Process)
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14 pages, 8195 KB  
Article
Carbon-Nanotube-Enabled Low-Threshold Laser Lift-Off for Ultra-Thin Polyimide Films
by Junwei Fu, Yachong Xu, Run Bai, Zhenzhen Sun, Yili Zhang, Rui Yang, Zijuan Han, Fanfan Wang and Boyuan Cai
Nanomaterials 2026, 16(9), 527; https://doi.org/10.3390/nano16090527 - 27 Apr 2026
Viewed by 691
Abstract
Laser lift-off (LLO) is a critical process for separating ultra-thin polyimide (PI) films in flexible electronics manufacturing, yet traditional methods often induce thermal and mechanical damage due to high laser energy processing. To address this, we propose a low-threshold LLO method by integrating [...] Read more.
Laser lift-off (LLO) is a critical process for separating ultra-thin polyimide (PI) films in flexible electronics manufacturing, yet traditional methods often induce thermal and mechanical damage due to high laser energy processing. To address this, we propose a low-threshold LLO method by integrating carbon nanotubes (CNTs) at the interface between a 500 nm PI film and a glass substrate. The interfacial thermal dynamics and separation quality were evaluated through finite element simulations and experimental validations using a 355 nm ultraviolet nanosecond laser. Results demonstrate that CNTs significantly enhance interfacial ultraviolet absorption and promote lateral heat diffusion due to their high axial thermal conductivity. This mechanism broadens the thermal decomposition zone and suppresses vertical heat transfer, thereby reducing the required LLO threshold from 180 mJ/cm2 to 120 mJ/cm2. Furthermore, the integration of CNTs reduces interfacial adhesion and alters the separation dynamics, resulting in the formation of smoother blisters with increased diameters and reduced heights compared to conventional LLO. These effects effectively minimize thermal and mechanical damage to the ultra-thin PI film and its integrated devices. This CNT-assisted LLO approach provides an efficient, low-damage solution for ultra-thin film separation, showing strong potential for advancing high-performance flexible electronics. Full article
(This article belongs to the Special Issue Low-Dimensional Nanomaterials for Optical and Laser Applications)
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17 pages, 4102 KB  
Article
Fully Thermally Decomposable CO2-Based Thermoplastic Polyurethane Encapsulation Films for Photovoltaic Cells: Mechanical, Barrier and Recycling Aspects
by Yuting Ouyang, Jizhi Ai, Min Xiao, Dongmei Han, Sheng Huang, Shuanjin Wang and Yuezhong Meng
Nanomaterials 2026, 16(9), 503; https://doi.org/10.3390/nano16090503 - 22 Apr 2026
Viewed by 832
Abstract
The development of sustainable encapsulation materials with tunable thermomechanical properties remains a critical challenge for photovoltaic reliability. Currently, the mainstream encapsulant for polycrystalline silicon solar cells is crosslinked EVA (Ethylene-Vinyl Acetate), which complicates the end-of-life recycling and reuse of modules. There is an [...] Read more.
The development of sustainable encapsulation materials with tunable thermomechanical properties remains a critical challenge for photovoltaic reliability. Currently, the mainstream encapsulant for polycrystalline silicon solar cells is crosslinked EVA (Ethylene-Vinyl Acetate), which complicates the end-of-life recycling and reuse of modules. There is an urgent need to develop a novel encapsulant that combines excellent barrier properties with thermoplastic recyclability. Herein, we report a novel series of thermally decomposable CO2-based thermoplastic polyurethane (PPC-TE) films engineered through the rational design of soft and hard segments. Utilizing polycarbonate diol (PPCDL) and polyether glycol (PEG) as soft segments, we systematically tailor material properties by modulating PEG-to-PPCDL ratios (5–20 wt%) and PEG molecular weights (1000–4000 g/mol). The optimized PPC-TE films exhibit excellent transmittance (>90%), adjustable glass transition temperature (Tg: 35.1 °C~11.6 °C), and remarkable mechanical adaptability (51~92 HA). The PPC-TE films exhibit water vapor permeability (WVP) as low as 14.8 g·mm·m−2·day−1 and oxygen permeability (OP) of 4.13 cc·mm·m−2 day−1 at 15 wt% PEG content, surpassing commercial ethylene–vinyl acetate (EVA) encapsulants. Notably, these films demonstrate fully thermal decomposition above 350 °C, facilitating eco-friendly photovoltaic device recycling. Superior adhesion to glass substrates is evidenced by peel strengths up to 37 N/cm (PPC-TE2000-20) and the shrinkage rate is as low as 3%. This work contributes to improving the long-term stability of solar cells and has the potential for large-scale production. Full article
(This article belongs to the Special Issue New Trends in Nanoscale Materials Applied to Photovoltaic Research)
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16 pages, 2543 KB  
Article
Solution to the Problems of Cementitious Materials Exposed to Silane-Based Hydrophobic Coatings
by Jingjing He, Kaiqi Wei, Fang Liu, Wenping Yue, Puwei Wu and Yi Yang
Buildings 2026, 16(8), 1562; https://doi.org/10.3390/buildings16081562 - 16 Apr 2026
Viewed by 441
Abstract
Silane-based hydrophobic coatings are widely used to improve the durability of cement-based materials in aggressive environments such as marine and hydraulic structures. However, their long-term effectiveness is strongly influenced by interfacial adhesion degradation under humid conditions, which remains a critical challenge in engineering [...] Read more.
Silane-based hydrophobic coatings are widely used to improve the durability of cement-based materials in aggressive environments such as marine and hydraulic structures. However, their long-term effectiveness is strongly influenced by interfacial adhesion degradation under humid conditions, which remains a critical challenge in engineering applications. From a scientific perspective, the fundamental mechanisms governing how silane-based coatings interact with cement hydration products, particularly under varying moisture conditions, are still not fully understood. In particular, the role of interfacial water in regulating bonding strength and intermolecular force transfer at the nanoscale has not been quantitatively clarified. To address these issues, this study investigates the interfacial debonding behavior of polydimethylsiloxane (PDMS), a representative silane-based hydrophobic component, on calcium silicate hydrate (C–S–H) substrates using molecular dynamics simulations under controlled hydration states. The results show that the interfacial interaction is dominated by van der Waals forces, with a calculated binding energy of approximately 357 kcal/m2. As the interfacial water content increases from dry to high-humidity conditions, the maximum debonding force (F_max) decreases from approximately 1.6 × 103 pN to 1.3 × 103 pN, corresponding to a reduction of about 18–20%. Similarly, the debonding work (W_max) shows a consistent decreasing trend, indicating reduced energy required for interface separation. This reduction is attributed to the formation of a continuous water film, which increases the interfacial separation distance and reduces the efficiency of intermolecular force transfer. These findings demonstrate the humidity-dependent weakening of interfacial adhesion and provide new insights into the nanoscale mechanisms governing the performance of silane-based coatings. The results offer a theoretical basis for optimizing the durability and reliability of hydrophobic treatments in cement-based materials under realistic service conditions. Full article
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21 pages, 8886 KB  
Article
Strengthening the Substrates of Wood Single Lap Joints Using a Novel Hot-Melt Film Adhesive to Mitigate Delamination
by Francisco C. C. Ribeiro, Shahin Jalali, Vasco C. M. B. Rodrigues, Ricardo J. C. Carbas, Eduardo A. S. Marques, Fengzhen Sun and Lucas F. M. da Silva
Materials 2026, 19(8), 1547; https://doi.org/10.3390/ma19081547 - 13 Apr 2026
Viewed by 489
Abstract
Delamination remains a critical limitation in the structural application of wood, particularly in adhesively bonded joints. This study investigates the use of a cyclic olefin-based hot-melt film adhesive (Zeon® LS-XU) as a thermoplastic interlayer as a means to delay delamination and enhance [...] Read more.
Delamination remains a critical limitation in the structural application of wood, particularly in adhesively bonded joints. This study investigates the use of a cyclic olefin-based hot-melt film adhesive (Zeon® LS-XU) as a thermoplastic interlayer as a means to delay delamination and enhance joint performance. Single lap joints (SLJs) were tested under quasi-static (1 mm/min) and impact (3 m/s) loading to assess strain-rate effects. Six configurations were examined: two reference, two toughened (with an additional 15 mm of adhesive on each overlap side) and two hybrid configurations combining oak (Quercus alba) and pine (Pinus pinaster Aiton) substrates to improve stress wave propagation. A finite element elastic model was developed to analyse stress distributions and explain the superior performance of hybrid joints. Results revealed that the thermoplastic interlayer delayed delamination onset and increased energy absorption, while hybrid configurations achieved more uniform stress distributions and significantly higher strengths under dynamic loading. The most effective configuration, the hybrid joint under impact conditions, represents a strength improvement of approximately 84% of the peak load compared to the pine reference joints. Overall, introducing a thermoplastic interlayer offers an efficient and lightweight strategy to enhance the toughness and reliability of wood joints exposed to variable loading conditions. Full article
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