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Keywords = ammonothermal growth

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13 pages, 6224 KiB  
Article
The Impact of GaN Crystal Growth on Ammonia Flow Dynamics in Ammonothermal Processes
by Marek Zak, Pawel Kempisty, Boleslaw Lucznik, Robert Kucharski and Michal Bockowski
Crystals 2025, 15(3), 261; https://doi.org/10.3390/cryst15030261 - 11 Mar 2025
Viewed by 757
Abstract
A computational fluid dynamics simulation was developed for the growth zone of gallium nitride crystallized using the alkaline ammonothermal method, considering the geometry of the seed crystals and the installation setup. The model focuses on temperature and velocity distributions, revealing turbulent and transient [...] Read more.
A computational fluid dynamics simulation was developed for the growth zone of gallium nitride crystallized using the alkaline ammonothermal method, considering the geometry of the seed crystals and the installation setup. The model focuses on temperature and velocity distributions, revealing turbulent and transient flow characteristics. Significant findings include the effect of crystal thickness on temperature and velocity changes, as well as the relationship between temperature distribution and growth rate. The results indicate that transient variations in flow and thermal fields affect the uniformity of growth and structural quality of the crystals. The paper contributes to optimizing ammonothermal crystallization processes by addressing critical parameters such as turbulence, thermal mixing, and crystal geometry. Full article
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91 pages, 19320 KiB  
Review
Ammonothermal Crystal Growth of Functional Nitrides for Semiconductor Devices: Status and Potential
by Thomas Wostatek, V. Y. M. Rajesh Chirala, Nathan Stoddard, Ege N. Civas, Siddha Pimputkar and Saskia Schimmel
Materials 2024, 17(13), 3104; https://doi.org/10.3390/ma17133104 - 25 Jun 2024
Cited by 4 | Viewed by 3004
Abstract
The state-of-the-art ammonothermal method for the growth of nitrides is reviewed here, with an emphasis on binary and ternary nitrides beyond GaN. A wide range of relevant aspects are covered, from fundamental autoclave technology, to reactivity and solubility of elements, to synthesized crystalline [...] Read more.
The state-of-the-art ammonothermal method for the growth of nitrides is reviewed here, with an emphasis on binary and ternary nitrides beyond GaN. A wide range of relevant aspects are covered, from fundamental autoclave technology, to reactivity and solubility of elements, to synthesized crystalline nitride materials and their properties. Initially, the potential of emerging and novel nitrides is discussed, motivating their synthesis in single crystal form. This is followed by a summary of our current understanding of the reactivity/solubility of species and the state-of-the-art single crystal synthesis for GaN, AlN, AlGaN, BN, InN, and, more generally, ternary and higher order nitrides. Investigation of the synthesized materials is presented, with a focus on point defects (impurities, native defects including hydrogenated vacancies) based on GaN and potential pathways for their mitigation or circumvention for achieving a wide range of controllable functional and structural material properties. Lastly, recent developments in autoclave technology are reviewed, based on GaN, with a focus on advances in development of in situ technologies, including in situ temperature measurements, optical absorption via UV/Vis spectroscopy, imaging of the solution and crystals via optical (visible, X-ray), along with use of X-ray computed tomography and diffraction. While time intensive to develop, these technologies are now capable of offering unprecedented insight into the autoclave and, hence, facilitating the rapid exploration of novel nitride synthesis using the ammonothermal method. Full article
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20 pages, 1398 KiB  
Article
Formation of Grown-In Nitrogen Vacancies and Interstitials in Highly Mg-Doped Ammonothermal GaN
by Marcin Zajac, Paweł Kaminski, Roman Kozlowski, Elzbieta Litwin-Staszewska, Ryszard Piotrzkowski, Karolina Grabianska, Robert Kucharski and Rafal Jakiela
Materials 2024, 17(5), 1160; https://doi.org/10.3390/ma17051160 - 1 Mar 2024
Cited by 3 | Viewed by 1725
Abstract
The formation of intrinsic point defects in the N-sublattice of semi-insulating Mg-doped GaN crystals grown by the ammonothermal method (SI AT GaN:Mg) was investigated for the first time. The grown-in defects produced by the displacement of nitrogen atoms were experimentally observed as deep [...] Read more.
The formation of intrinsic point defects in the N-sublattice of semi-insulating Mg-doped GaN crystals grown by the ammonothermal method (SI AT GaN:Mg) was investigated for the first time. The grown-in defects produced by the displacement of nitrogen atoms were experimentally observed as deep traps revealed by the Laplace transform photoinduced transient spectroscopy in the compensated p-type crystals with the Mg concentrations of 6 × 1018 and 2 × 1019 cm−3 and resistivities of ~1011 Ωcm and ~106 Ωcm, respectively. In both kinds of materials, three closely located traps with activation energies of 430, 450, and 460 meV were revealed. The traps, whose concentrations in the stronger-doped material were found to be significantly higher, are assigned to the (3+/+) and (2+/+) transition levels of nitrogen vacancies as well as to the (2+/+) level of nitrogen split interstitials, respectively. In the material with the lower Mg concentration, a middle-gap trap with the activation energy of 1870 meV was found to be predominant. The results are confirmed and quantitatively described by temperature-dependent Hall effect measurements. The mechanism of nitrogen atom displacement due to the local strain field arising in SI AT GaN:Mg is proposed and the effect of the Mg concentration on the charge compensation is discussed. Full article
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17 pages, 3227 KiB  
Review
Progress in Ammonothermal Crystal Growth of Gallium Nitride from 2017–2023: Process, Defects and Devices
by Nathan Stoddard and Siddha Pimputkar
Crystals 2023, 13(7), 1004; https://doi.org/10.3390/cryst13071004 - 23 Jun 2023
Cited by 13 | Viewed by 3967
Abstract
Gallium nitride continues to be a material of intense interest for the ongoing advancement of electronic and optoelectronic devices. While the bulk of today’s markets for low-performance devices is still met with silicon and blue/UV LEDs derived from metal–organic chemical vapor deposition gallium [...] Read more.
Gallium nitride continues to be a material of intense interest for the ongoing advancement of electronic and optoelectronic devices. While the bulk of today’s markets for low-performance devices is still met with silicon and blue/UV LEDs derived from metal–organic chemical vapor deposition gallium nitride grown on foreign substrates such as sapphire and silicon carbide, the best performance values consistently come from devices built on bulk-grown gallium nitride from native seeds. The most prominent and promising of the bulk growth methods is the ammonothermal method of high-pressure solution growth. The state-of-the-art from the last five years in ammonothermal gallium nitride technology is herein reviewed within the general categories of growth technology, characterization and defects as well as device performance. Full article
(This article belongs to the Special Issue Research in GaN-based Materials and Devices)
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12 pages, 2948 KiB  
Article
Evolution of the Growth Mode and Its Consequences during Bulk Crystallization of GaN
by Tomasz Sochacki, Robert Kucharski, Karolina Grabianska, Jan L. Weyher, Magdalena A. Zajac, Malgorzata Iwinska, Lutz Kirste and Michal Bockowski
Materials 2023, 16(9), 3360; https://doi.org/10.3390/ma16093360 - 25 Apr 2023
Cited by 4 | Viewed by 1818
Abstract
A detailed analysis of morphology of gallium nitride crystal growth obtained by ammonothermal and halide vapor phase epitaxy methods was carried out. The work was conducted to determine the source of triangular planar defects visible in X-ray topography as areas with locally different [...] Read more.
A detailed analysis of morphology of gallium nitride crystal growth obtained by ammonothermal and halide vapor phase epitaxy methods was carried out. The work was conducted to determine the source of triangular planar defects visible in X-ray topography as areas with locally different lattice parameters. It is shown that the occurrence of these defects is related to growth hillocks. Particular attention was paid to analyzing the manner and consequences of merging hillocks. In the course of the study, the nature of the mentioned defects and the cause of their formation were determined. It was established that the appearance of the defects depends on the angle formed between the steps located on the sides of two adjacent hillocks. A universal growth model is presented to explain the cause of heterogeneity during the merging of growth hillocks. Full article
(This article belongs to the Section Electronic Materials)
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27 pages, 19024 KiB  
Article
Temperature Field, Flow Field, and Temporal Fluctuations Thereof in Ammonothermal Growth of Bulk GaN—Transition from Dissolution Stage to Growth Stage Conditions
by Saskia Schimmel, Daisuke Tomida, Tohru Ishiguro, Yoshio Honda, Shigefusa F. Chichibu and Hiroshi Amano
Materials 2023, 16(5), 2016; https://doi.org/10.3390/ma16052016 - 28 Feb 2023
Cited by 5 | Viewed by 2942
Abstract
With the ammonothermal method, one of the most promising technologies for scalable, cost-effective production of bulk single crystals of the wide bandgap semiconductor GaN is investigated. Specifically, etch-back and growth conditions, as well as the transition from the former to the latter, are [...] Read more.
With the ammonothermal method, one of the most promising technologies for scalable, cost-effective production of bulk single crystals of the wide bandgap semiconductor GaN is investigated. Specifically, etch-back and growth conditions, as well as the transition from the former to the latter, are studied using a 2D axis symmetrical numerical model. In addition, experimental crystal growth results are analyzed in terms of etch-back and crystal growth rates as a function of vertical seed position. The numerical results of internal process conditions are discussed. Variations along the vertical axis of the autoclave are analyzed using both numerical and experimental data. During the transition from quasi-stable conditions of the dissolution stage (etch-back process) to quasi-stable conditions of the growth stage, significant temperature differences of 20 K to 70 K (depending on vertical position) occur temporarily between the crystals and the surrounding fluid. These lead to maximum rates of seed temperature change of 2.5 K/min to 1.2 K/min depending on vertical position. Based on temperature differences between seeds, fluid, and autoclave wall upon the end of the set temperature inversion process, deposition of GaN is expected to be favored on the bottom seed. The temporarily observed differences between the mean temperature of each crystal and its fluid surrounding diminish about 2 h after reaching constant set temperatures imposed at the outer autoclave wall, whereas approximately quasi-stable conditions are reached about 3 h after reaching constant set temperatures. Short-term fluctuations in temperature are mostly due to fluctuations in velocity magnitude, usually with only minor variations in the flow direction. Full article
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10 pages, 3908 KiB  
Article
Negative Magnetoresistivity in Highly Doped n-Type GaN
by Leszek Konczewicz, Malgorzata Iwinska, Elzbieta Litwin-Staszewska, Marcin Zajac, Henryk Turski, Michal Bockowski, Dario Schiavon, Mikołaj Chlipała, Sandrine Juillaguet and Sylvie Contreras
Materials 2022, 15(20), 7069; https://doi.org/10.3390/ma15207069 - 11 Oct 2022
Cited by 2 | Viewed by 1853
Abstract
This paper presents low-temperature measurements of magnetoresistivity in heavily doped n-type GaN grown by basic GaN growth technologies: molecular beam epitaxy, metal-organic vapor phase epitaxy, halide vapor phase epitaxy and ammonothermal. Additionally, GaN crystallized by High Nitrogen Pressure Solution method was also examined. [...] Read more.
This paper presents low-temperature measurements of magnetoresistivity in heavily doped n-type GaN grown by basic GaN growth technologies: molecular beam epitaxy, metal-organic vapor phase epitaxy, halide vapor phase epitaxy and ammonothermal. Additionally, GaN crystallized by High Nitrogen Pressure Solution method was also examined. It was found that all the samples under study exhibited negative magnetoresistivity at a low temperature (10 K < T < 50 K) and for some samples this effect was observed up to 100 K. This negative magnetoresistivity effect is analyzed in the frame of the weak localization phenomena in the case of three-dimensional electron gas in a highly doped semiconductor. This analysis allows for determining the phasing coherence time τφ for heavily doped n-type GaN. The obtained τφ value is proportional to T−1.34, indicating that the electron–electron interaction is the main dephasing mechanism for the free carriers. Full article
(This article belongs to the Special Issue Advances in Conducting and Semiconducting Materials)
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23 pages, 7139 KiB  
Review
Characterization of Defects in GaN: Optical and Magnetic Resonance Techniques
by Jaime A. Freitas, James C. Culbertson and Evan R. Glaser
Crystals 2022, 12(9), 1294; https://doi.org/10.3390/cryst12091294 - 14 Sep 2022
Cited by 3 | Viewed by 3823
Abstract
GaN and its alloys with InN and AlN are of technological importance for a variety of optical, electronic, and optoelectronic devices due to its high thermal conductivity, wide band gap, high breakdown voltage and high saturation velocity. GaN-based devices now provide superior performance [...] Read more.
GaN and its alloys with InN and AlN are of technological importance for a variety of optical, electronic, and optoelectronic devices due to its high thermal conductivity, wide band gap, high breakdown voltage and high saturation velocity. GaN-based devices now provide superior performance for a variety of high power, high frequency, high temperature, and optical applications. The major roadblock for the full realization of Nitride semiconductor potential is still the availability of affordable large-area and high-quality native substrates with controlled electrical properties. Despite the impressive accomplishments recently achieved by techniques such as hydride vapor phase epitaxy and ammonothermal for GaN growth, much more must be attained before establishing a fully satisfactory bulk growth method for this material. Recent results suggest that ammonothermal GaN wafers can be successfully used as seeds to grow thick freestanding GaN wafers by hydride vapor phase epitaxy. A brief review of defect-sensitive optical and paramagnetic spectroscopy techniques employed to evaluate structural, optical, and electronic properties of the state-of-the-art bulk and thick-film (quasi-bulk) Nitride substrates and homoepitaxial films is presented. Defects control the performance of devices and feeding back knowledge of defects to growth efforts is key to advancing technology. Full article
(This article belongs to the Special Issue Research in GaN-based Materials and Devices)
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17 pages, 4370 KiB  
Article
High-Energy Computed Tomography as a Prospective Tool for In Situ Monitoring of Mass Transfer Processes inside High-Pressure Reactors—A Case Study on Ammonothermal Bulk Crystal Growth of Nitrides including GaN
by Saskia Schimmel, Michael Salamon, Daisuke Tomida, Steffen Neumeier, Tohru Ishiguro, Yoshio Honda, Shigefusa F. Chichibu and Hiroshi Amano
Materials 2022, 15(17), 6165; https://doi.org/10.3390/ma15176165 - 5 Sep 2022
Cited by 3 | Viewed by 3197
Abstract
For the fundamental understanding and the technological development of the ammonothermal method for the synthesis and crystal growth of nitrides, an in situ monitoring technique for tracking mass transport of the nitride throughout the entire autoclave volume is desirable. The feasibility of using [...] Read more.
For the fundamental understanding and the technological development of the ammonothermal method for the synthesis and crystal growth of nitrides, an in situ monitoring technique for tracking mass transport of the nitride throughout the entire autoclave volume is desirable. The feasibility of using high-energy computed tomography for this purpose was therefore evaluated using ex situ measurements. Acceleration voltages of 600 kV were estimated to yield suitable transparency in a lab-scale ammonothermal setup for GaN crystal growth designed for up to 300 MPa operating pressure. The total scan duration was estimated to be in the order of 20 to 40 min, which was sufficient given the comparatively slow crystal growth speed in ammonothermal growth. Even shorter scan durations or, alternatively, lower acceleration voltages for improved contrast or reduced X-ray shielding requirements, were estimated to be feasible in the case of ammonoacidic growth, as the lower pressure requirements for this process variant allow for thinned autoclave walls in an adapted setup designed for improved X-ray transparency. Promising nickel-base and cobalt-base alloys for applications in ammonothermal reactors with reduced X-ray absorption in relation to the maximum operating pressure were identified. The applicability for the validation of numerical simulations of the growth process of GaN, in addition to the applicability of the technique to further nitride materials, as well as larger reactors and bulk crystals, were evaluated. Full article
(This article belongs to the Special Issue Wide and Ultra-Wide Bandgap Semiconductor Materials for Power Devices)
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9 pages, 3721 KiB  
Article
Progress in Near-Equilibrium Ammonothermal (NEAT) Growth of GaN Substrates for GaN-on-GaN Semiconductor Devices
by Tadao Hashimoto, Edward R. Letts and Daryl Key
Crystals 2022, 12(8), 1085; https://doi.org/10.3390/cryst12081085 - 3 Aug 2022
Cited by 16 | Viewed by 2860
Abstract
This paper reviews the near-equilibrium ammonothermal (NEAT) growth of bulk gallium nitride (GaN) crystals and reports the evaluation of 2″ GaN substrates and 100 mmbulk GaN crystal grown in our pilot production reactor. Recent progress in oxygen reduction enabled growing NEAT GaN substrates [...] Read more.
This paper reviews the near-equilibrium ammonothermal (NEAT) growth of bulk gallium nitride (GaN) crystals and reports the evaluation of 2″ GaN substrates and 100 mmbulk GaN crystal grown in our pilot production reactor. Recent progress in oxygen reduction enabled growing NEAT GaN substrates with lower residual oxygen, coloration, and optical absorption. The oxygen concentration was approximately 2 × 1018 cm−2, and the optical absorption coefficient was 1.3 cm−1 at 450 nm. Maps of full-width half maximum (FWHM) of X-ray diffraction rocking curveswere generated for grown crystals and finished wafers. The X-ray rocking curve maps confirmed high-quality and uniform microstructure across the entire surface of the bulk crystals and substrates. The average FWHM of the 50 best bulk crystals from the recent batch was 28 ± 4 arcsec for the 002 diffraction and 34 ± 5 arcsec for the 201 diffraction, with an average radius of curvature of 20 m. X-ray topography measured on both sides of the bulk crystals implied that the density of dislocations wasreduced by one order of magnitude during the NEAT growth. A typical NEAT GaN substrate shows dislocation density of about 2 × 105 cm−2. Full article
(This article belongs to the Special Issue Research in GaN-based Materials and Devices)
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27 pages, 12124 KiB  
Article
Fundamental Studies on Crystallization and Reaching the Equilibrium Shape in Basic Ammonothermal Method: Growth on a Native Lenticular Seed
by Tomasz Sochacki, Robert Kucharski, Karolina Grabianska, Jan L. Weyher, Malgorzata Iwinska, Michal Bockowski and Lutz Kirste
Materials 2022, 15(13), 4621; https://doi.org/10.3390/ma15134621 - 30 Jun 2022
Cited by 6 | Viewed by 2564
Abstract
In this paper, a detailed investigation of the basic ammonothermal growth process of GaN is presented. By analyzing the crystallization on a native seed with a lenticular shape, thus with an intentionally varying off-cut, we wanted to answer some basic questions: (i) Which [...] Read more.
In this paper, a detailed investigation of the basic ammonothermal growth process of GaN is presented. By analyzing the crystallization on a native seed with a lenticular shape, thus with an intentionally varying off-cut, we wanted to answer some basic questions: (i) Which crystallographic planes play the most important role during growth (which planes are formed and which disappear)? (ii) What is the relationship between the growth rates in different crystallographic directions? (iii) What is the influence of the off-cut of the seed on the growth process? Two non-polar slices, namely, 12¯10 and 1¯100, as well as a 0001 basal plane slice of an ammonothermal crystal were analyzed. The examined planes were selectively etched in order to reveal the characteristic features of the growth process. The applied characterization methods included: optical microscopy with Nomarski contrast and ultraviolet illumination, X-ray topography and high-resolution X-ray diffraction, and secondary ion mass spectrometry. The obtained results allowed for creating a growth model of an ammonothermal GaN crystal on a lenticular seed. These findings are of great importance for the general understanding of the basic ammonothermal crystal growth process of GaN. Full article
(This article belongs to the Section Electronic Materials)
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18 pages, 11213 KiB  
Article
Large-Sized GaN Crystal Growth Analysis in an Ammonothermal System Based on a Well-Developed Numerical Model
by Pengfei Han, Bing Gao, Botao Song, Yue Yu, Xia Tang and Botao Liu
Materials 2022, 15(12), 4137; https://doi.org/10.3390/ma15124137 - 10 Jun 2022
Cited by 4 | Viewed by 2165
Abstract
The ammonothermal method is considered the most promising method of fabricating bulk gallium nitride (GaN) crystals. This paper improves the ammonothermal growth model by replacing the heater-long fixed temperature boundary with two resistance heaters and considering the real thermal boundary outside the shell. [...] Read more.
The ammonothermal method is considered the most promising method of fabricating bulk gallium nitride (GaN) crystals. This paper improves the ammonothermal growth model by replacing the heater-long fixed temperature boundary with two resistance heaters and considering the real thermal boundary outside the shell. The relationship between power values and temperatures of dissolution and crystallization is expressed by the backpropagation (BP) neural network, and the optimal power values for specific systems are found using the non-dominated sorting genetic algorithm (NSGAII). Simulation results show that there are several discrepancies between updated and simplified models. It is necessary to build an ammonothermal system model with resistance heaters as a heat source. Then large-sized GaN crystal growth is analyzed based on the well-developed numerical model. According to the simulation results, both the increasing rate and maximum stable values of the metastable GaN concentration gradient are reduced for a larger-sized system, which is caused by the inhomogeneity of heat transfer in the autoclave. Full article
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10 pages, 6130 KiB  
Article
On Stress-Induced Polarization Effect in Ammonothermally Grown GaN Crystals
by Karolina Grabianska, Robert Kucharski, Tomasz Sochacki, Jan L. Weyher, Malgorzata Iwinska, Izabella Grzegory and Michal Bockowski
Crystals 2022, 12(4), 554; https://doi.org/10.3390/cryst12040554 - 15 Apr 2022
Cited by 8 | Viewed by 2514
Abstract
The results of basic ammonothermal crystallization of gallium nitride are described. The material is mainly analyzed in terms of the formation of stress (called stress-induced polarization effect) and defects (threading dislocations) appearing due to a stress relaxation process. Gallium nitride grown in different [...] Read more.
The results of basic ammonothermal crystallization of gallium nitride are described. The material is mainly analyzed in terms of the formation of stress (called stress-induced polarization effect) and defects (threading dislocations) appearing due to a stress relaxation process. Gallium nitride grown in different positions of the crystallization zone is examined in cross-polarized light. Interfaces between native ammonothermal seeds and new-grown gallium nitride layers are investigated in ultraviolet light. The etch pit densities in the seeds and the layers is determined and compared. Based on the obtained results a model of stress and defect formation is presented. New solutions for improving the structural quality of basic ammonothermal gallium nitride crystals are proposed. Full article
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20 pages, 5623 KiB  
Article
Structural Analysis of Low Defect Ammonothermally Grown GaN Wafers by Borrmann Effect X-ray Topography
by Lutz Kirste, Karolina Grabianska, Robert Kucharski, Tomasz Sochacki, Boleslaw Lucznik and Michal Bockowski
Materials 2021, 14(19), 5472; https://doi.org/10.3390/ma14195472 - 22 Sep 2021
Cited by 26 | Viewed by 3869 | Correction
Abstract
X-ray topography defect analysis of entire 1.8-inch GaN substrates, using the Borrmann effect, is presented in this paper. The GaN wafers were grown by the ammonothermal method. Borrmann effect topography of anomalous transmission could be applied due to the low defect density of [...] Read more.
X-ray topography defect analysis of entire 1.8-inch GaN substrates, using the Borrmann effect, is presented in this paper. The GaN wafers were grown by the ammonothermal method. Borrmann effect topography of anomalous transmission could be applied due to the low defect density of the substrates. It was possible to trace the process and growth history of the GaN crystals in detail from their defect pattern imaged. Microscopic defects such as threading dislocations, but also macroscopic defects, for example dislocation clusters due to preparation insufficiency, traces of facet formation, growth bands, dislocation walls and dislocation bundles, were detected. Influences of seed crystal preparation and process parameters of crystal growth on the formation of the defects are discussed. Full article
(This article belongs to the Section Electronic Materials)
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30 pages, 4724 KiB  
Review
Numerical Simulation of Ammonothermal Crystal Growth of GaN—Current State, Challenges, and Prospects
by Saskia Schimmel, Daisuke Tomida, Tohru Ishiguro, Yoshio Honda, Shigefusa Chichibu and Hiroshi Amano
Crystals 2021, 11(4), 356; https://doi.org/10.3390/cryst11040356 - 30 Mar 2021
Cited by 18 | Viewed by 5577
Abstract
Numerical simulations are a valuable tool for the design and optimization of crystal growth processes because experimental investigations are expensive and access to internal parameters is limited. These technical limitations are particularly large for ammonothermal growth of bulk GaN, an important semiconductor material. [...] Read more.
Numerical simulations are a valuable tool for the design and optimization of crystal growth processes because experimental investigations are expensive and access to internal parameters is limited. These technical limitations are particularly large for ammonothermal growth of bulk GaN, an important semiconductor material. This review presents an overview of the literature on simulations targeting ammonothermal growth of GaN. Approaches for validation are also reviewed, and an overview of available methods and data is given. Fluid flow is likely in the transitional range between laminar and turbulent; however, the time-averaged flow patterns likely tend to be stable. Thermal boundary conditions both in experimental and numerical research deserve more detailed evaluation, especially when designing numerical or physical models of the ammonothermal growth system. A key source of uncertainty for calculations is fluid properties under the specific conditions. This originates from their importance not only in numerical simulations but also in designing similar physical model systems and in guiding the selection of the flow model. Due to the various sources of uncertainty, a closer integration of numerical modeling, physical modeling, and the use of measurements under ammonothermal process conditions appear to be necessary for developing numerical models of defined accuracy. Full article
(This article belongs to the Special Issue Robust Microelectronic Devices)
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