Search Results (12)

In this work, the effects of heavy ion strike position, incident angle, linear energy transfer (LET) value, ambient temperature, bias conditions, and the synergistic effects of total dose irradiation on the single-event transient (SET) in silicon-germanium heterojunction bipolar transistors on silicon-on-insulator (SiGe-on-SOI HBTs) were investigated using TCAD simulations. It was demonstrated that, compared to the bulk SiGe HBT, the SiGe-on-SOI HBT exhibits lower transient current and less charge collection, indicating better resistance to SET. The SET response is more pronounced when heavy ions strike vertically from the emitter and base regions. Transient current and collected charge escalate with increasing incident angle, demonstrating a strong linear correlation with LET values. As the temperature decreases, the peak transient current increases, while the pulse duration decreases and the total collected charge diminishes. After total dose irradiation, the peak transient current in the SiGe-on-SOI HBT decreases, whereas the damage was more severe in the absence of irradiation. Under collector positive bias and positive bias, significant SET responses were observed, while cutoff bias and substrate bias exhibited better resistance to SET damage. These findings provide critical insights into radiation-hardened design strategies for the SiGe-on-SOI HBT. Full article

This paper presents a new SiGe HBT-based high dynamic range double-balanced down-conversion differential mixer. Operating within the 0.5 GHz to 1.8 GHz range, the suggested mixer is appropriate for a variety of applications, such as cellular base stations, satellite communication (SATCOM), and military radar. The down-conversion mixer is made up of a single-ended to a differential-balanced radiofrequency (RF) stage, a dual feedback linearization for the RF stage, a local oscillator (LO) balun, LO mixing cores, and a fixed intermediate frequency (IF)-tuned circuit connected between two outputs to serve as a load at 145 MHz. Compared to earlier research in the literature, the measured SSB noise figure is approximately 7 dB ± 0.4 dB, and the measured conversion gain is approximately 12 dB ± 1 dB for a full band of operation. The mixer achieves a good return loss of over 8 dB for an RF and LO port in the desired band and a measured return loss of over 18 dB at 145 MHz and IF frequency. Furthermore, the design achieved an RF-to-IF isolation of greater than 35 dB, LO feedthrough, and an LO leakage isolation of better than 50 dB. Lastly, the measured third-order intercept point was found to be +4.7 dBm, and the 1 dB compression point was approximately −8 dBm. These results demonstrate good linearity performance. Full article

In this study, the degradation characteristics of radio frequency (RF)-low-noise amplifiers (LNA) due to a total ionizing dose (TID) is investigated. As a device-under-test (DUT), sample LNAs were prepared using silicon–germanium (SiGe) heterojunction bipolar transistors (HBTs) as core elements. The LNA was based on a cascode stage with emitter degeneration for narrowband applications. By using a simplified small-signal model of a SiGe HBT, design equations such as gain, impedance matching, and noise figure (NF) were derived for analyzing TID-induced degradations in the circuit-level performance. To study radiation effects in circuits, the SiGe-RF-LNAs fabricated in a commercial 350 nm SiGe technology were exposed to 10-keV X-rays to a total ionizing dose of up to 3 Mrad(SiO₂). The TID-induced performance changes of the LNA were modeled by applying degradation to device parameters. In the modeling process, new parameter values after irradiation were estimated based on information in the literature, without direct measurements of SiGe HBTs used in the LNA chip. As a result, the relative contributions of parameters on the circuit metrics were compared, identifying dominant parameters for degradation modeling. For the TID effects on input matching (S₁₁) and NF, the base resistance (R_B) and the base-to-emitter capacitance (C_π) of the input transistor were mostly responsible, whereas the transconductances (g_m) played a key role in the output matching (S₂₂) and gain (S₂₁). To validate the proposed approach, it has been applied to a different LNA in the literature and the modeling results predicted the TID-induced degradations within reasonable ranges. Full article

In this work, the design of a wideband low-noise amplifier (LNA) using a resistive feedback network is proposed for potential multi-band sensing, communication, and radar applications. For achieving wide operational bandwidth and flat in-band characteristics simultaneously, the proposed LNA employs a variety of circuit design techniques, including a voltage–current (shunt–shunt) negative feedback configuration, inductive emitter degeneration, a main branch with an added cascode stage, and the shunt-peaking technique. The use of a feedback network and emitter degeneration provides broadened transfer characteristics for multi-octave coverage and a real impedance for input matching, respectively. In addition, the cascode stage pushes the band-limiting low-frequency pole, due to the Miller capacitance, to a higher frequency. Lastly, the shunt-peaking approach is optimized for the compensation of a gain reduction at higher frequency bands. The wideband LNA proposed in this study is fabricated using a commercial 0.13 μm silicon-germanium (SiGe) BiCMOS process, employing SiGe heterojunction bipolar transistors (HBTs) as the circuit’s core active elements in the main branch. The measurement results show an operational bandwidth of 2.0–29.2 GHz, a noise figure of 4.16 dB (below 26.5 GHz, which was the measurement limit), and a total power consumption of 23.1 mW under a supply voltage of 3.3 V. Regarding the nonlinearity associated with large-signal behavior, the proposed LNA exhibits an input 1-dB compression (IP1dB) point of −5.42 dBm at 12 GHz. These performance numbers confirm the strong viability of the proposed approach in comparison with other state-of-the-art designs. Full article

In this work, the numerical simulation of a SiGe heterojunction bipolar transistor (HBT) for DC and AC performance operating at cryogenic temperature with a hydrodynamic carrier transport model is analyzed. A new modified temperature-dependent Si_1−xGe_x energy bandgap model was used. Using a simplified 2D TCAD design structure, the device characteristics on 55 nm SiGe HBT technology and the mobility model are calibrated with experimental data. Base current reversal due to induced impact-ionization at the collector-base junction is analyzed, where the estimated collector-emitter breakdown voltage with the base open (BV_CEO) is 1.48 V at 300 K. This reveals good voltage handling ability. At cryogenic temperatures, dopant incomplete ionization in the lightly doped collector region shows a 28% decrease in ionized dopant concentration at 50 K; this affects the base-collector depletion capacitance. The emitter electron barrier tunneling leakage on collector current is studied using a non-local e-barrier tunneling model at different temperatures that shows an improvement in peak DC gain at lower temperatures. Using the small-signal ac analysis, the cut-off frequency and the maximum oscillation frequency are extracted for high-frequency application, and the base widening effect is discussed. A comparison of this work with measured data on 90 nm SiGe HBT is also discussed in brief, which shows improvements in the simulated structure. Full article

Silicon technologies for HF applications have been proven for more than two decades, and technologies have greatly evolved. Whether CMOS or BiCMOS technologies, the unique combination of radio frequency, baseband, and digital functions allow a very high level of integration. While it is possible to achieve fully integrated transceivers, the major advantages of these silicon technologies lie mainly in their unparalleled performance in the field of frequency synthesis and frequency conversion. We propose in this paper a review of the major results obtained on these RF components since the beginning of the 2000s, also considering the impact of the technology node. The back-end of line (BEOL) process on which depends the quality of microwave monolithic integrated circuits (MMICs) is briefly presented in the introductory part. If circuit performances are tightly bound to the active devices (i.e., the heterojunction bipolar transistor SiGe HBT or CMOS transistor), passive elements (i.e., quality factor of inductors and varactors, losses of transmission, or interconnection lines) as well as the definition of the substrate also play a major role. The core of the article is oriented toward the noise of synthesized signals and frequency conversion. Frequency synthesis is presented through the analog design of a voltage-controlled oscillator (VCO) or through the direct digital frequency synthesis (DDFS), for which respective figures of merit are presented and discussed in a second section. The spectral purity of the oscillators being decisive in the definition of the throughput of a link is approached through the comparison of different figures of merit (FoM) for a set of circuits achievements over the selected period. If the realization of free oscillators is closely bound to the phase-locked loop (PLL)-type control loop for VCOs, the DDFS solution provides more direct and more flexible alternative at first sight. Therefore, these two solutions are analyzed collectively. Finally, the oscillator integrated in the transmitter or receiver supplies the needed LO (local oscillator) power to the frequency mixer in the frequency conversion module: henceforth, the third part of this study focuses on high-frequency mixer realizations. We thus consider this LO power in some advanced figure of merit mentioned in the second section. The design trade-off of the mixer is presented in an approach combining LO (conversion gain, channel isolation, and phase noise) and RF (HF noise figure and channel isolation) constraints. The final section provides a summary of the results and trends mentioned in the paper. Full article

This paper presents the design and implementation of a low-noise amplifier (LNA) for millimeter-wave (mm-Wave) 5G wireless applications. The LNA was based on a common-emitter configuration with cascode amplifier topology using an IHP’s 0.13 $\mathsf{\mu }$m Silicon Germanium (SiGe) heterojunction bipolar transistor (HBT) whose f_T/f_MAX/gate-delay is 360/450 GHz/2.0 ps, utilizing transmission lines for simultaneous noise and input matching. A noise figure of 3.02–3.4 dB was obtained for the entire wide bandwidth from 20 to 44 GHz. The designed LNA exhibited a gain (S_21) greater than 20 dB across the 20–44 GHz frequency range and dissipated 9.6 mW power from a 1.2 V supply. The input reflection coefficient (S_11) and output reflection coefficient (S_22) were below −10 dB, and reverse isolation (S_12) was below −55 dB for the 20–44 GHz frequency band. The input 1 dB (P1dB) compression point of −18 dBm at 34.5 GHz was obtained. The proposed LNA occupies only a 0.715 mm² area, with input and output RF (Radio Frequency) bond pads. To the authors’ knowledge, this work evidences the lowest noise figure, lowest power consumption with reasonable highest gain, and highest bandwidth attained so far at this frequency band in any silicon-based technology. Full article

A power efficient static frequency divider in commercial 55 nm SiGe BiCMOS technology is reported. A standard Current Mode Logic (CML)-based architecture is adopted, and optimization of layout, biasing and transistor sizes allows achieving a maximum input frequency of 63 GHz and a self-oscillating frequency of 55 GHz, while consuming 23.7 mW from a 3 V supply. This results in high efficiency with respect to other static frequency dividers in BiCMOS technology presented in the literature. The divider topology does not use inductors, thus optimizing the area footprint: the divider core occupies 60 × 65 μm² on silicon. Full article

For performance-driven systems such as space-based applications, it is important to maximize the gain of radio-frequency amplifiers (RFAs) with a certain tolerance against radiation, temperature effects, and small form factor. In this work, we present a K-band, compact high-gain RFA using an f_T-doubler topology in a silicon-germanium (SiGe) heterojunction bipolar transistors (HBTs) technology platform. The through-silicon vias (TSVs), typically used for small-size chip packaging purposes, have been effectively utilized as an adjustable matching element for input impedance, reducing the overall area of the chip. The proposed RFA, fabricated in a modest 0.35 µm SiGe technology, achieves a gain of 14.1 dB at 20 GHz center frequency, and a noise figure (NF) of 11.2 dB at the same frequency, with a power consumption of 3.3 mW. The proposed design methodology can be used for achieving high gain, avoiding a complex multi-stage amplifier design approach. Full article

It has been known that negative feedback loops (internal and external) in a SiGe heterojunction bipolar transistors (HBT) DC current mirrors improve single-event transient (SET) response; both the peak transient current and the settling time significantly decrease. In the present work, we demonstrate how radiation hardening by design (RHBD) techniques utilized in DC bias blocks only (current mirrors) can also improve the SET response in AC signal paths of switching circuits (e.g., current-mode logic, CML) without any additional hardening in those AC signal paths. Four CML circuits both with and without RHBD current mirrors were fabricated in 130 nm SiGe HBT technology. Two existing RHBD techniques were employed separately in the current mirrors of the CML circuits: (1) applying internal negative feedback and (2) adding a large capacitor in a sensitive node. In addition, these methods are also combined to analyze the overall SET performance. The single-event transients of the fabricated circuits were captured under the two-photon-absorption laser-induced single-event environment. The measurement data clearly show significant improvements in SET response in the AC signal paths of the CML circuits by using the two radiation hardening techniques applied only in DC current mirrors. The peak output transient current is notably reduced, and the settling time upon a laser strike is shortened significantly. Full article

A 120–140 GHz frequency-switchable, very compact low-noise amplifier (LNA) fabricated in a 0.13 µm SiGe:C BiCMOS technology is proposed. A single radio-frequency (RF) switch composed of three parallel hetero junction bipolar transistors (HBTs) in a common-collector configuration and a multimodal three-line microstrip structure in the input matching network are used to obtain a LNA chip of miniaturized size. A systematic design procedure is applied to obtain a perfectly balanced gain and noise figure in both frequency states (120 GHz and 140 GHz). The measured gain and noise figure are 14.2/14.2 dB and 8.2/8.2 dB at 120/140 GHz respectively, in very good agreement with circuit/electromagnetic co-simulations. The LNA chip and core areas are 0.197 mm² and 0.091 mm², respectively, which supposes an area reduction of 23.4% and 15.2% compared to other LNAs reported in this frequency band. The experimental results validate the design procedure and its analysis. Full article

A novel varactor circuit exhibiting a wider tuning range and a new technique for quadrature coupling of LC-Voltage Controlled Oscillator (LC-VCO) is presented and validated on a 25 GHz oscillator. The proposed varactor circuit employs distribute-biased parallel varactors with a series inductor connected at both ends of the varactor bank to extend the tuning range of the oscillator. Similarly, the quadrature coupling is accomplished by employing the 2nd harmonic, explicitly generated in the stand-alone free-running differential oscillator using frequency doubler. As an example, the Differential VCO (DVCO) is tunable between 20 GHz and 31 GHz and exhibits the best Phase Noise $\left(PN\right)$ of −100 dBc/Hz at 1 MHz offset frequency. Similarly, the Quadrature VCO (QVCO) covers 42% tuning bandwidth around 25 GHz oscillation frequency, which is significantly wider than other state-of-the-art VCOs at comparable frequencies. In addition, all the oscillators are designed in class-C to further improve their performances both in term of low power and low phase noise. The presented oscillators are designed using high-performance SiGe HBTs of the GlobalFoundries (GFs) 130 nm SiGe BiCMOS 8HP process. The presented DVCO and QVCO draw currents of approximately 10 mA and 21 mA, respectively from a 1.2 V supply. Full article