Search Results (12)

Efficient thermal management is critical for the performance, safety, and longevity of lithium-ion batteries, particularly in new energy vehicles. This paper presents the development and application of a NiCr/NiSi thin-film thermocouple fabricated via magnetron sputtering on a polyimide substrate, aiming to provide high-precision, fast-response internal temperature measurements for lithium-ion battery systems. The thermocouple demonstrates a Seebeck coefficient of approximately 40.95 μV/°C and a repeatability error of only 0.45%, making it highly suitable for capturing transient thermal events. The main innovation of this work lies in the comprehensive integration of simulation and experimental validation to optimize the thermocouple’s performance for lithium-ion battery applications. This includes static calibration, external short-circuit, and puncture tests, which collectively confirm the thermocouple’s reliability and accuracy. Additionally, the study explores the impact of ambient temperature variations on internal battery temperatures, revealing a nearly linear increase in internal temperature with rising ambient conditions. The findings offer valuable insights for improving battery thermal management systems, establishing early warning thresholds for thermal runaway, and enhancing the overall safety of lithium-ion battery applications. Full article

This study presents the calibration methodology of NiCr-NiSi thin-film thermocouples and evaluates their application in real-time temperature monitoring and characterization of fuel cell thermal behavior. Experimental results reveal that the Seebeck coefficients of the NiCr-NiSi thin films remain stable after multiple calibration cycles, indicating good reliability and repeatability. Furthermore, the thermocouples demonstrate an ultrafast response time of less than 15 microseconds and reach thermal equilibrium within 200 microseconds under transient thermal inputs. These characteristics enable accurate and rapid temperature measurement of fuel cell plates up to 100 °C, which is critical for maintaining the safe and efficient operation of fuel cells. Full article

Based on the COMSOL simulation software (v.6.1), this paper systematically investigates the influence law of runner length on the velocity and pressure distribution of cathode and anode gas runners in proton exchange membrane fuel cells (PEMFCs), and experimentally verifies the measurement effect of thin-film thermocouples on the operating temperature of PEMFCs. The simulation results show that the maximum pressure of the cathode and anode increases nonlinearly with the increase in the runner length, while the velocity distribution remains stable; the shortening of the runners significantly reduces the friction loss along the flow path and optimizes the matching of the permeability of the porous medium. In addition, the NiCr/NiSi thin-film thermocouple prepared by magnetron sputtering exhibits high accuracy (Seebeck coefficient of 41.56 μV/°C) in static calibration and successfully captures the dynamic response characteristics of temperature in PEMFC operation. This study provides a theoretical basis and experimental support for the optimization of fuel cell flow channel design and temperature monitoring technology. Full article

In the new energy electric drive system, the thermal stability of IGBT, a core power device, significantly impacts the system’s overall performance. Accurate IGBT temperature measurement is crucial, but traditional methods face limitations in IGBT’s compact working space. Thin-film thermocouples, with their thin and light features, offer a new solution. In this study, Ni 90% Cr 10% and Ni 97% Si 3% thin-film thermocouples were prepared on polyimide substrates via magnetron sputtering. After calibration, the Seebeck coefficient of the thin-film thermocouple temperature sensors reached 40.23 μV/°C, and the repeatability error stabilized at about 0.3% as the temperature rose, showing good stability. Researchers studied factors affecting IGBT temperature. Thin-film thermocouples can accurately monitor IGBT module surface temperature under different conditions. Compared to K-type wire thermocouples, they measure slightly higher temperatures. As the control signal’s switching frequency increases, IGBT temperature first rises then falls; as the duty cycle increases, the temperature keeps rising. This is consistent with RAC’s junction temperature prediction theory, validating the feasibility of thin-film thermocouples for IGBT chip temperature measurement. Thin-film thermocouples have great application potential in power device temperature measurement and may be a key research direction, supporting the optimization and upgrading of new energy electric drive systems. Full article

To enhance the safety of lithium ternary battery cases in new energy vehicles, this study designed a temperature monitoring and fault warning system based on NiCr/NiSi thin-film thermocouples. The system integrates six modules—sensor, amplifier, data acquisition, microprocessor (using the KPCA nonlinear dimensionality reduction algorithm), communication and monitoring, and alarm control—to monitor temperature, voltage, and humidity changes in real time. Multi-level warning thresholds are established (e.g., Level 1: initial temperature 35–55 °C rising to 42–65 °C after 10 min; initial voltage 400–425 V dropping to 398–375 V after 10 min). Experimental results demonstrate that the NiCr/NiSi thermocouple exhibits high sensitivity (average Seebeck coefficient: 41.42 μV/°C) and low repeatability error (1.04%), with a dense and uniform surface structure (roughness: 3.2–5.75 nm). The warning logic, triggered in four levels based on dynamic temperature and voltage changes, achieves an 80% accuracy rate and a low false/missed alarm rate of 4%. Long-term operation tests show stable monitoring deviations (±0.2 °C for temperature and ±0.02 V for voltage over 24 h). The system also adapts to varying humidity environments, with peak sensitivity (41.3 μV/°C) at 60% RH. This research provides a highly reliable solution for battery safety management in new energy vehicles. Full article

Thin-film thermocouple is widely used in temperature measurement because of its high temperature measurement accuracy and small size. In order to calibrate the temperature accurately with thin-film thermocouple, NiCr/NiSi thin-film thermocouple was prepared by magnetron sputtering according to the Seebeck effect. Through static calibration experiments, the Seebeck coefficient of K-wire thermocouple was found to be 39.23 μV/°C, while that of the NiCr/NiSi thin-film thermocouple was 38.89 μV/°C. Further experiments showed a Seebeck coefficient of 39.092 μV/°C for the NiCr/NiSi thin-film thermocouple, which verifies that the prepared thin-film thermocouple has good consistency and repeatability. Through the temperature measurement experiment of automobile engines, the highest stable working temperature of the engine is 107.9 °C, which further verifies that the prepared NiCr/NiSi thin-film thermocouple can have a sensitive dynamic response to temperature and high temperature measurement accuracy. Finally, the causes of experimental errors, the application prospect and existing problems of thin-film thermocouples are analyzed. Full article

In the process of using thin-film thermocouples for contact measurement of the reaction temperature in proton exchange membrane fuel cells (PEMFC), the impact of thin-film thermocouple volume on the system’s reaction temperature field variation, reaction efficiency, and the lifespan of thermocouples under these conditions is not thoroughly studied. Using magnetron sputtering technology, NiCr/NiSi thin-film thermocouples (NiCr/NiSi TFTCs) with different junction sizes were fabricated on the proton exchange membrane (PEM). These NiCr/NiSi TFTCs exhibit excellent compactness, with thickness and planar dimensions in the micrometer range. When PEMFCs are equipped with built-in NiCr/NiSi TFTCs of different hot junction sizes, the time required for the system to reach a steady state varies with the size of the hot junction, with smaller hot junction sizes reaching a steady state more quickly. In a 500-h continuous operation test, the failure rates of NiCr/NiSi TFTCs also vary based on the hot junction size. Both smaller and larger hot junction sizes have relatively higher failure rates, whereas medium-sized junctions have a lower failure rate. These extensive and repetitive comparative experiments provide significant reference value for the size design of TFTCs operating inside PEMFCs, promoting both industrial production and scientific research. Full article

Ni90%Cr10% and Ni97%Si3% thin-film thermocouples (TFTCs) were fabricated on a silicon substrate using magnetron sputtering technology. Static calibration yielded a Seebeck coefficient of 23.00 μV/°C. During staged temperature elevation of the TFTCs while continuously monitoring their thermoelectric output, a rapid decline in thermoelectric potential was observed upon the hot junction reaching 600 °C; the device had failed. Through three cycles of repetitive static calibration tests ranging from room temperature to 500 °C, it was observed that the thermoelectric performance of the TFTCs deteriorated as the testing progressed. Utilizing the same methodology, Ni-Cr and Ni-Si thin films corresponding to the positive and negative electrodes of the TFTCs were prepared. Their resistivity after undergoing various temperature annealing treatments was measured. Additionally, their surfaces were characterized using Scanning Electron Microscopy (SEM) and X-ray Photoelectron Spectroscopy (XPS). The causes behind the decline in thermoelectric performance at elevated temperatures were analyzed from both chemical composition and microstructural perspectives. Full article

An accurate and continuous measurement of heat flux is needed in many long-term operation facilities in order to monitor and improve the life of its machinery. A thin film heat flux sensor is usually fabricated via sputtering, according to different spatial arrangements of thermocouple junctions. A novel thin film heat flux sensor was designed, fabricated, and calibrated, but the connection between the thin film and the leads could not be fixed quickly and steadily. For this purpose, in this paper a method to seamlessly integrate the leads and the thin film has been proposed to improve the sensor output signal. The sensor is capable of simultaneously measuring surface heat flux and temperature magnitude, to address the current situation of the single design of heat flux sensors. The novel thin film heat flux sensor is structured as follows: Thirty pairs of NiCr-NiSi thermocouple junctions are deposited in an annular pattern on a well-designed ceramic substrate. Over the annular thermopile, a 2000 nm-thick thermal insulator layer is deposited to create a temperature gradient across the layers. In addition, in this study a new calibration method was used to evaluate the static and dynamic properties of this novel thin film heat flux sensor. The analysis and experimental results show that the heat flux calculated from the sensor output was in good agreement with the value obtained from the pre-calibrated standard sensor. The sensitivity and response time of the novel sensor were measured at 0.06 mV/(kW/m²) and 475 ms, respectively. The heat flux measurements made with the sensor presented good repeatability. The heat-transfer coefficient of the Al₂O₃ thin film was 4.477 w/(m∙k) for the novel thin film heat flux sensor described in this paper. Full article

During the titanium alloy milling process, high temperatures in the tool-chip contact area will affect the tool life and precision of titanium alloy machining. Therefore, it is essential to measure the temperature of the tool-chip contact area continuously. In this paper, a finite element simulation model of the milling process was established using ABAQUS2020 to obtain the highest temperature location in the tool-chip contact area when milling titanium alloy. The integration of the wire with the alumina ceramic substrate formed an integrated wire substrate. Furthermore, NiCr, NiSi, and SiO₂ films were deposited on the substrate sequentially using the DC pulsed magnetron sputtering technique. Finally, its microscopic morphology and static and dynamic performance were tested. The results show that the developed thin-film thermocouple temperature sensor has a Seebeck coefficient of 40.72 μV/°C and a dynamic response time of 0.703 ms. The application of the sensor to our titanium alloy milling experiments showed that the sensor can monitor the transient temperature in the tool-chip contact area, and its temperature measurement performance showed no detrimental effect from wearing. The effect of each milling parameter on the milling temperature was analyzed using ANOVA, and a regression model with an R-sq of 96.76% was obtained for the milling temperature. Full article

With the continuous improvement of train speeds, it is necessary to find the possible problems of bearings in time, otherwise they will cause serious consequences. Aiming at the characteristics of rapid temperature change of bearings, a thin film thermocouple temperature sensor was developed to measure the real-time temperature of the bearing’s rolling elements during train operation. Using dc pulse magnetron sputtering technology, Al₂O₃ film, NiCr film, NiSi film, and SiO₂ film were successively deposited on an aluminum alloy substrate. We studied their microstructure, static characteristics, dynamic characteristics, and repeatability. Finally, we installed an adaptive film temperature sensor on the bearing testing machine to measure the temperature of the rolling elements. The results show that the developed temperature sensor has good linearity in the range of 30~180 ℃. The Seebeck coefficient is 40.69 μV/℃, the nonlinear fitting error is less than 0.29%, the maximum repeatability error is less than 4.55%, and the dynamic response time is 1.42 μs. The temperature of the measured rolling elements is 6~10 ℃ higher than that of the outer ring, which can reflect the actual temperature of the bearing operation. Full article

In this paper, the electric and thermoelectric properties of thin films of germanium–gold alloy (Ge–Au) are discussed in terms of choosing the optimal deposition process and post-processing conditions to obtain Ge–Au layers with the best thermoelectric parameters. Thin films were fabricated by magnetron sputtering using the Ge–Au alloy target onto glass substrates at two various conditions; during one of the sputtering processes, the external substrate bias voltage (U_b = −150 V) was used. After deposition thin films were annealed in the atmosphere of N₂ at various temperatures (473, 523 and 573 K) to investigate the influence of annealing temperature on the electric and thermoelectric properties of films. Afterwards, the thermocouples were created by deposition of the NiCrSi/Ag contact pads onto Ge–Au films. In this work, particular attention has been paid to thermoelectric properties of fabricated thin films—the thermoelectric voltage, Seebeck coefficient, power factor PF and dimensionless figure of merit ZT were determined. Full article