Search Results (68)

GaN-based terahertz (THz) Schottky barrier diodes (SBDs) are critical components for achieving high-power performance in THz frequency multipliers. However, the space applications of GaN-based THz SBDs are significantly constrained due to insufficient research on the effects of space irradiation. This work investigates the effects of 450 MeV Kr swift heavy ion (SHI) irradiation on the electrical characteristics and induced defects in GaN-based THz SBDs. It was found that the high-frequency performance of GaN-based THz SBDs is highly sensitive to Kr SHI irradiation, which can be attributed to defects induced in the GaN epitaxial layer by the irradiation. Low-frequency noise analysis reveals trap states located at an energy level of approximately 0.62 eV below the conduction band. Moreover, the results from SRIM calculation and photoluminescence spectra confirmed the presence of irradiation-induced defects caused by Kr SHI irradiation. Full article

The reliability of GaN-based devices operating under high temperatures is crucial for their application in extreme environments. To identify the fundamental mechanisms behind high-temperature degradation, we investigated GaN-on-sapphire Schottky barrier diodes (SBDs) under simultaneous heating and electrical biasing. We observed the degradation mechanisms in situ inside a transmission electron microscope (TEM) using a custom-fabricated chip for simultaneous thermal and electrical control. The pristine device exhibited a high density of extended defects, primarily due to lattice mismatch and thermal expansion differences between the GaN and sapphire. TEM and STEM imaging, coupled with energy-dispersive X-ray spectroscopy (EDS), revealed the progressive degradation of the diode with increasing bias and temperature. At higher bias levels (4–5 V) and elevated temperatures (300–455 °C), the interdiffusion and alloying of the Au/Pd Schottky metal stack with GaN, along with defect generation near the interface, resulted in Schottky contact failure and catastrophic device degradation. A geometric phase analysis further identified strain localization and lattice distortions induced by thermal and electrical stresses, which facilitated diffusion pathways for rapid metal atom migration. These findings highlight that defect-mediated electrothermal degradation and interfacial chemical reactions are critical elements in the high-temperature failure physics of GaN Schottky diodes. Full article

This paper proposes a terminal matching network (TMN) technology, which can realize wideband matching of microwave rectifiers in a wide input power range. At the same time, it is proposed to realize ultra-wideband microwave rectifiers by connecting two TMN branches of different frequencies in parallel. In order to verify this theory, two rectifiers using single TMN and dual TMN branches are designed and realized based on high-power GaN Schottky barrier diodes (SBDs). The single TMN GaN rectifier achieves a peak efficiency of 72.3% and a conversion efficiency of more than 70% in the frequency range of 1.8–2.7 GHz at 1 W of input power, while being more than 50% efficient in the input power range of 16–35 dBm. Benefitting from the power combination of different frequency TMNs, the dual TMNs GaN rectifier achieves 75.8% peak efficiency and over 70% conversion efficiency at 1.1–3.1 GHz frequency and 1 W input power with a relative bandwidth over 95.2% and maintains high efficiency of over 50% in the input power range of 15–35 dBm. The advantages of the ultra-wideband, wide input power range, high power, and high efficiency make the GaN rectifier with TMNs expected to play an important role in microwave power transmission (MPT). Full article

This study systematically investigates the effects of anode metals (Ti/Au and Ni/Au) with different work functions on the electrical and temperature characteristics of β-Ga₂O₃-based Schottky barrier diodes (SBDs), junction barrier Schottky diodes (JBSDs) and P-N diodes (PNDs), utilizing Silvaco TCAD simulation software, device fabrication and comparative analysis. From the perspective of transport characteristics, it is observed that the SBD exhibits a lower turn-on voltage and a higher current density. Notably, the V_on of the Ti/Au anode SBD is merely 0.2 V, which is the lowest recorded value in the existing literature. The V_on and current trend of two types of PNDs are nearly consistent, confirming that the contact between Ti/Au or Ni/Au and NiO_x is ohmic. A theoretical derivation reveals the basic principles of the different contact resistances and current variations. With the combination of SBD and PND, the V_on, current density, and variation rate of the JBSD lie between those of the SBD and PND. In terms of temperature characteristics, all diodes can work well at 200 °C, with both current density and V_on showing a decreasing trend as the temperature increases. Among them, the PND with a Ni/Au anode exhibits the best thermal stability, with reductions in V_on and current density of 8.20% and 25.31%, respectively, while the SBD with a Ti/Au anode shows the poorest performance, with reductions of 98.56% and 30.73%. Finally, the reverse breakdown (BV) characteristics of all six devices are tested. The average BV values for the PND with Ti/Au and Ni/Au anodes reach 1575 V and 1550 V, respectively. Moreover, although the V_on of the JBSD decreases to 0.24 V, its average BV is approximately 220 V. This work could provide valuable insights for the future application of β-Ga₂O₃-based diodes in high-power and low-power consumption systems. Full article

In this paper, we present various theoretical models that accurately approximate the spectral density of the optical capture cross-section (${\sigma }_e^0$) obtained through the analysis of photo-capacitance transients using the deep-level optical spectroscopy (DLOS) technique applied to semi-transparent Ni/Au Schottky barrier diodes (SBDs) fabricated on n-GaN films. The theoretical models examined in this study involved a variety of approaches, from the Lucovsky model that assumes no lattice relaxation to more sophisticated models such as the Chantre–Bois and the Pässler models, which consider the electron–phonon coupling phenomenon. By applying theoretical models to the experimentally determined data, we were able to estimate the photoionization (E⁰), trap level position (E_T), and Franck–Condon (d_FC) energy, respectively. In addition, the results of our analysis confirm that the photoionization processes of deep traps in n-GaN grown by the metal–organic vapor-phase epitaxy technique (MOVPE) are strongly coupled to the lattice. Moreover, it was shown that the Pässler model is preferred for the accurate determination of the individual trap parameters of defects present in n-GaN films grown on an Ammono-GaN substrate. Finally, a new trap level, Ec-1.99 eV with d_FC = 0.15, that has not been previously reported in n-GaN films grown by MOVPE was found. Full article

In this study, metal–silicide-based contacts to GaN-cap/AlGaN/AlN-spacer/GaN-on-Si heterostructure were investigated. Planar Schottky diodes with Cu-covered anodes comprising silicide layers of various metal–silicon (M–Si) compositions were fabricated and characterized in terms of their electrical parameters and thermal stability. The investigated contacts included Ti–Si, Ta–Si, Co–Si, Ni–Si, Pd–Si, Ir–Si, and Pt–Si layers. Reference diodes with pure Cu or Au/Ni anodes were also examined. To test the thermal stability, selected devices were subjected to subsequent annealing steps in vacuum at incremental temperatures up to 900 °C. The Cu/M–Si anodes showed significantly better thermal stability than the single-layer Cu contact, and in most cases exceeded the stability of the reference Au/Ni contact. The work functions of the sputtered thin layers were determined to support the discussion of the formation mechanism of the Schottky barrier. It was concluded that the barrier heights were dependent on the M–Si composition, although they were not dependent on the work function of the layers. An extended, unified Schottky barrier formation model served as the basis for explaining the complex electrical behavior of the devices under investigation. Full article

GaN Schottky diodes show great potential in high-power terahertz frequency multipliers. The thermal characteristics of GaN Schottky diodes with single and double-row anode arrangements are described in this paper. The temperature distribution inside the Schottky diode is discussed in detail under the coupling condition of Joule heat and solid heat transfer. The effects of different substrates and substrate geometric parameters on the thermal characteristics of the Schottky diode chips with single and double-row anode arrangements are systematically analyzed. Compared with that of the chip with single-row anode arrangement, the maximum temperature of the chip with double-row anode arrangement can be reduced by 40 K at the same conditions. For chips with different substrates, chips with diamond substrates can withstand greater power dissipation when reaching the same temperature. The simulation results are instructive for the design and optimization of Schottky diodes in the terahertz field. Full article

In this work, a GaN-on-Si quasi-vertical Schottky diode was demonstrated on a locally grown n-GaN drift layer using Selective Area Growth (SAG). The diode achieved a current density of 2.5 kA/cm², a specific on-resistance ${\mathrm{R}}_{\mathrm{O}\mathrm{N},\mathrm{s}\mathrm{p}}$ of 1.9 mΩ cm² despite the current crowding effect in quasi-vertical structures, and an on/off current ratio (I_on/I_off) of 10¹⁰. Temperature-dependent current–voltage characteristics were measured in the range of 313–433 K to investigate the mechanisms of leakage conduction in the device. At near-zero bias, thermionic emission (TE) was found to dominate. By increasing up to 10 V, electrons gained enough energy to excite into trap states, leading to the dominance of Frenkel–Poole emission (FPE). For a higher voltage range (−10 V to −40 V), the increased electric field facilitated the hopping of electrons along the continuum threading dislocations in the “bulk” GaN layers, and thus, variable range hopping became the main mechanism for the whole temperature range. This work provides an in-depth insight into the leakage conduction transport on pseudo-vertical GaN-on-Si Schottky barrier diodes (SBDs) grown by localized epitaxy. Full article

In this work, by employing field plate (FP) and N ion-implantation edge termination (NIET) structure, the electrical performance of the β-Ga₂O₃ Schottky barrier diode (SBD) was greatly improved. Ten samples of vertical SBDs were fabricated to investigate the influence of the relative positions of field plates (FPs) and ion implantation on the device performance. The device with the FP of 15 μm and the ion implantation at the edge of the Schottky electrode exhibited a breakdown voltage (V_br) of 1616 V, a specific on-resistance (R_on,sp) of 5.11 mΩ·cm², a power figure of merit (PFOM) of 0.511 GW/cm², and a reverse current density of 1.2 × 10⁻⁵ A/cm² @ −1000 V. Compared to the control device, although the R_on,sp increased by 1 mΩ·cm², the V_br of the device increased by 183% and the PFOM increased by 546.8%. Moreover, the reverse leakage current of the device with the FP and NIET structure decreased by three orders of magnitude. The TCAD simulation revealed that the peak electric field at the interface decreased from 7 MV/cm @ −500 V to 4.18 MV/cm @ −1000 V. These results demonstrate the great potential for the β-Ga₂O₃ SBD with a FP and NIET structure in power electronic applications. Full article

Rectifier plays a pivotal role in wireless power transfer systems. While numerous studies have concentrated on enhancing efficiency and bandwidth at specific high-power levels, practical scenarios often involve unpredictable power inputs. Consequently, a distinct need arises for a rectifier that demonstrates superior efficiency across a broad range of input power levels. This paper introduces a high-power RF-to-DC rectifier designed for WPT applications, featuring an ultrawide dynamic range of input power. The rectification process leverages a GaN (gallium nitride) high electron mobility transistor (HEMT) to efficiently handle high power levels up to 12.6 W. The matching circuit was designed to ensure that the rectifier will operate in class-F mode. A Schottky diode is incorporated into the design for relatively lower-power rectification. Seamless switching between the rectification modes of the two circuits is accomplished through the integration of a circulator. The proposed rectifier exhibits a 27.5 dB dynamic range, achieving an efficiency exceeding 55% at 2.4 GHz. Substantial improvement in power handling and dynamic range over traditional rectifiers is demonstrated. Full article

This study focuses on the impact of negative fixed charge, achieved through fluorine (F) implantation, on breakdown voltage (BV) enhancement in vertical GaN Schottky diodes. Several device and implant-related parameters are examined using Synopsys Sentaurus TCAD simulations in order to determine the optimum fixed negative charge concentration required to achieve the highest BV. The simulated structure consisted of a Schottky diode with a box consisting of negative fixed charges to achieve the edge termination of the Schottky device. An empirical equation is proposed to determine the optimum fixed charge concentration for the highest BV based on depth. The simulation also considered implantation profiles derived from SIMS data from an actual device implanted with multi-energy and multi-dose F. It is demonstrated that the BV has a similar dependence on the key parameters like in the box profile. In summary, this work provides valuable insights into optimizing edge termination techniques using negative fixed charge for improved BV in vertical GaN power devices. Full article

In our pursuit of high-power terahertz (THz) wave generation, we propose innovative edge-terminated single-drift region (SDR) multi-quantum well (MQW) impact avalanche transit time (IMPATT) structures based on the Al_xGa_1−xN/GaN/Al_xGa_1−xN material system, with a fixed aluminum mole fraction of x = 0.3. Two distinct MQW diode configurations, namely p⁺-n junction-based and Schottky barrier diode structures, were investigated for their THz potential. To enhance reverse breakdown characteristics, we propose employing mesa etching and nitrogen ion implantation for edge termination, mitigating issues related to premature and soft breakdown. The THz performance is comprehensively evaluated through steady-state and high-frequency characterizations using a self-consistent quantum drift-diffusion (SCQDD) model. Our proposed Al_0.3Ga_0.7N/GaN/Al_0.3Ga_0.7N MQW diodes, as well as GaN-based single-drift region (SDR) and 3C-SiC/Si/3C-SiC MQW-based double-drift region (DDR) IMPATT diodes, are simulated. The Schottky barrier in the proposed diodes significantly reduces device series resistance, enhancing peak continuous wave power output to approximately 300 mW and DC to THz conversion efficiency to nearly 13% at 1.0 THz. Noise performance analysis reveals that MQW structures within the avalanche zone mitigate noise and improve overall performance. Benchmarking against state-of-the-art THz sources establishes the superiority of our proposed THz sources, highlighting their potential for advancing THz technology and its applications. Full article

We conducted a comparative study on the characterization of Ga-polar and N-polar GaN metal–insulator–semiconductor (MIS) Schottky contact with a SiN_x gate dielectric. The correlation between the surface morphology and the current–voltage (I–V) characteristics of the Ga- and N-polar GaN Schottky contact with and without SiN_x was established. The insertion of SiN_x helps in reducing the reverse leakage current for both structures, even though the leakage is still higher for N-polar GaN, consistent with the Schottky barrier height calculated using X-ray photoelectron spectroscopy. To optimize the electric property of the N-polar device, various substrate misorientation angles were adopted. Among the different misorientation angles of the sapphire substrate, the GaN MIS Schottky barrier diode grown on 1° sapphire shows the lowest reverse leakage current, the smoothest surface morphology, and the best crystalline quality compared to N-polar GaN grown on 0.2° and 2° sapphire substrates. Furthermore, the mechanism of the reverse leakage current of the MIS-type N-polar GaN Schottky contact was investigated by temperature-dependent I–V characterization. FP emissions are thought to be the dominant reverse conduction mechanism for the N-polar GaN MIS diode. This work provides a promising approach towards the optimization of N-polar electronic devices with low levels of leakage and a favorable ideality factor. Full article

A novel atomic-level post-etch-surface-reinforcement (PESR) process is developed to recover the p-GaN etching induced damage region for high performance p-GaN gate HEMTs fabrication. This process is composed of a self-limited surface modification step with O₂ plasma, following by an oxide removal step with BCl₃ plasma. With PESR process, the AlGaN surface morphology after p-GaN etching was comparable to the as-epitaxial level by AFM characterization, and the AlGaN lattice crystallization was also recovered which was measured in a confocal Raman system. The electrical measurement further confirmed the significant improvement of AlGaN surface quality, with one-order of magnitude lower surface leakage in a metal-semiconductor (MS) Schottky-diode and 6 times lower interface density of states (D_it) in a MIS C-V characterization. The XPS analysis of Al₂O₃/AlGaN showed that the p-GaN etching induced F-byproduct and Ga-oxide was well removed and suppressed by PESR process. Finally, the developed PESR process was successfully integrated in p-GaN gate HEMTs fabrication, and the device performance was significantly enhanced with ~20% lower of on-resistance and ~25% less of current collapse at V_ds,Q bias of 40 V, showing great potential of leverage p-GaN gate HEMTs reliability. Full article

We investigated the temperature-dependent reverse characteristics (J_R-V_R-T) of vertical GaN Schottky-barrier diodes with and without a fluorine-implanted edge termination (ET). To understand the device leakage mechanism, temperature-dependent characterizations were performed, and the observed reverse current was modeled through technology computer-aided design. Different levels of current were observed in both forward and reverse biases for the ET and non-ET devices, which suggested a change in the conduction mechanism for the observed leakages. The measured J_R-V_R-T characteristics of the non-edge-terminated device were successfully fitted in the entire temperature range with the phonon-assisted tunneling model, whereas for the edge-terminated device, the reverse characteristics were modeled by taking into account the emission of trapped electrons at a high temperature and field caused by Poole–Frenkel emission. Full article