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Special Issue "Sensors for Nondestructive Testing"
A special issue of Sensors (ISSN 1424-8220).
Deadline for manuscript submissions: 31 May 2020.
Interests: structural health monitoring (shm); non-destructive evaluation (nde); acoustic emission (ae); ultrasonic testing (ut); scattering; dispersion; attenuation; material evaluation; concrete
Special Issues and Collections in MDPI journals
Special Issue in Applied Sciences: Advances in Acoustic Emission and Health Monitoring of Materials and Structures
Special Issue in Applied Sciences: Modelling of Early Age Cracking Risks and Serviceability of Concrete Structures
Special Issue in Applied Sciences: 10th Anniversary of Applied Sciences-Invited Papers in Acoustics and Vibrations Section
Interests: (Elastic waves, optical techniques, electronic speckle pattern interferometry, photoelasticity, thermoelasticity, polymer composites, metals)
Intelligent sensor technologies will revolutionize our everyday lives, providing safety, security, surveillance, monitoring, automation, and awareness in general. They drive innovation in many industrial applications and are vital for progress in medicine. Miniaturization through micro- and nanotechnology, novel materials and intelligent, networked, and integrated devices are key for future developments and improved performance. In addition, new engineering demands dictate a continuously improving characterization of the materials and components used in modern life. In all fields of science and engineering, standards of safety, productivity, and quality are rising. The absolute control which is necessary to raise these standards is achieved by means of sensors, which are the cornerstone in order to perform accurate characterization in any type of condition monitoring approach and any material field. The present Special Issue intends to explore new developments in sensors technology for nondestructive testing and modern applications in all domains of materials and processes. Topics include (but are not limited to):
- Advancement in optical techniques (photoelasticity, interferometry, DIC, DVC, etc.);
- Advances in sensor technology;
- Contactless ultrasonic sensors;
- Elastic waves (ultrasonics, acoustic emission);
- Electromagnetic antennas, radar, mmW;
- Embedded sensors;
- Energy harvesting for NDT;
- Fiber sensors;
- Infrared sensing;
- Sensors for cultural heritage items;
- Sensors for durability and durability of sensors.
In addition to developments in the sensor technology itself, the issue welcomes novel applications of sensors in materials and processes.
Prof. Dr. Dimitrios Aggelis
Prof. Dr. Danny Van Hemelrijck
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- acoustic emission
- elastic waves
- digital image correlation
- pressure sensors
- infrared sensors
- embedded sensors
- contactless sensors