Additive Manufacturing for Advanced Sensing Applications

Dear Colleagues,

Additive manufacturing (AM) is transforming the design and fabrication of advanced sensing devices by enabling outstanding geometrical freedom, material tunability and functional integration. This Special Issue seeks high-quality contributions that explore the synergy between AM and next-generation sensing technologies. Submissions are encouraged on topics such as novel materials, innovative manufacturing strategies, complex sensor architectures, integration methods, characterization techniques and performance assessments. Particular emphasis is placed on studies demonstrating how AM can enhance sensor sensitivity, selectivity, miniaturization, structural robustness, and multifunctionality. Special interest is given to contributions addressing applications in mechanical and aerospace engineering—such as lightweight structural monitoring, embedded sensors for intelligent components, aerothermal measurements, vibration and strain sensing in complex geometries and AM-enabled sensing solutions for extreme environments. By highlighting cutting-edge research, this collection aims to provide a comprehensive overview of current trends, inspire innovation in sensor design and fabrication and promote the translation of AM-enabled technologies into practical applications across industrial, mechanical, aerospace, medical and wearable domains. The intention is for this Special Issue to serve as a platform for knowledge exchange and scientific advancement at the forefront of additive manufacturing-enabled sensing, supporting both fundamental research and applied developments. Contributions offering novel insights, experimental validation, or theoretical advancements are especially encouraged.

Dr. Maurizio Arena
Prof. Dr. Massimo Viscardi
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.