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Flexible and Stretchable Electronics for Next-Generation Smart Sensing

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Electronic Sensors".

Deadline for manuscript submissions: 20 November 2026 | Viewed by 183

Special Issue Editor


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Guest Editor
Department of Mechanical Engineering and Material Science, Duke University, Durham, NC 27708, USA
Interests: soft electronics; epidermal electronics; wearable ultrasound

Special Issue Information

Dear Colleagues,

Flexible and stretchable electronics have emerged as a transformative platform for next-generation smart-sensing systems, enabling seamless integration of sensors with complex, soft and dynamic environments such as the human body, biological tissues and deformable structures. Unlike conventional rigid sensors, these systems offer unique advantages including mechanical compliance, conformability, lightweight form factors and robustness under large deformations, which are essential for continuous, long-term and unobtrusive sensing.

This Special Issue aims to highlight recent advances in smart-sensing systems based on flexible and stretchable electronics, covering innovations from materials and device architectures to system-level integration and real-world applications. Topics of interest include, but are not limited to, flexible and stretchable sensors for physical, chemical and biological signals; wearable and epidermal sensing platforms; soft and implantable sensing devices; wireless and battery-free sensing technologies; flexible sensor arrays and networks; data acquisition, signal processing and intelligent sensing enabled by flexible electronics and applications in healthcare monitoring, human–machine interfaces, robotics and the Internet of Things (IoT).

This Special Issue aligns well with the scope of Sensors by focusing on novel sensor designs, sensing principles, system integration and sensing applications enabled by emerging flexible and stretchable electronic technologies. We invite original research articles and comprehensive reviews that advance the state of the art in smart-sensing systems and promote interdisciplinary collaboration across materials science, electronics, mechanics and sensing technologies.

Dr. Chaorui Qiu
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • epidermal electronics
  • sensing network
  • multimodality sensing
  • Internet of Things (IoT)
  • e-skin

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Published Papers

This special issue is now open for submission.
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