Next Generation IoT Applications in Smart Manufacturing and Industry 5.0
A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Internet of Things".
Deadline for manuscript submissions: closed (15 January 2023) | Viewed by 29850
Special Issue Editors
Interests: Industry 4.0 and IIoT; infrastructures for multicloud; fog computing and edge; protocols for industrial IoT; smart cities and crowdsensing; innovation and technology transfer; innovation service for smart manufacturing; serverless architectures and FaaS; service innovation and design thinking
Interests: communication electronics; wireless sensor networks; Internet of Things; data transmission and analytics; digitalization and industry 5.0
Interests: cloud computing; fog computing and edge; Industry 5.0; Industrial Internet of things (IIoT); middleware; software defined networking
Special Issue Information
Dear Colleagues,
The market requirements imposed on manufacturing companies and the availability of new quality sensor technology and good Cloud continuum chains have created a necessity for new innovative services for Industry 5.0 and the Industrial Internet of Things (IIoT). The pandemic crisis has further stimulated the quest for new strategies and new investments and opportunities to accelerate research.
The large-scale chain of production, in both operation and information technologies (OT and IT), necessitates entirely new forms of operations. The potential for innovative services and data arriving from any possible source can lead to disruptive changes in OT, while the IT architecture must extend it in new ways, from any aspect in terms of Cloud, Edge, and Smart industrial applications.
This Special Issue of Sensors aims to collect both reviews and original research papers on advancing all aspects of IIoT related to manufacturing sensors, to push forward the technology for the Industry 5.0 era.
Potential topics include but are not limited to the following:
- Synergic innovation for OT and IT architectures;
- Quality pub/sub models and implementations;
- Integration of OPC UA and enhancements;
- Protocols for TSN and case studies in IIoT;
- New models and applications of digital twins;
- Cloud continuum architecture innovation for Industry 5.0;
- Integration and partitioning of Cloud–Edge computing;
- Serverless computing and FaaS (defined) in manufacturing;
- Advanced simulation and novel digital twins;
- Infrastructures toward mobility and offloading;
- Innovative crowdsensing and sensor mobility;
- Big data architectures for manufacturing;
- Workflow management and frameworks for Industry 5.0;
- Diagnostic and prognostic in predictive maintenance;
- Human–machine interaction;
- Crowdsensing and smart cities;
- Real-time-based digital twins and simulation;
- Cyber safe data transmission, storage, and analysis solutions;
- Artificial Intelligence and machine learning services;
- Solutions for energy efficiency and trustworthy autonomy;
- Real-world industrial use cases of 5G technology;
- Multi-access Edge computing and network slicing in Industry 5.0;
- Digitalization and Industry 5.0;
- 5G performance analysis in Industry 5.0.
Prof. Dr. Antonio Corradi
Prof. Dr. Shaofang Gong
Dr. Domenico Scotece
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- IIoT and I5.0
- OT and IT integration
- Communication protocols for OT
- Cloud continuum, Fog, and Edge computing
- New services for I5.0 and smart cities and communities
- Novel models of execution and containerization
- Dynamic and self-management
- Big data protocols, tools, and architectures
- Digitalization and predictive maintenance in I5.0
Benefits of Publishing in a Special Issue
- Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
- Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
- Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
- External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
- e-Book format: Special Issues with more than 10 articles can be published as dedicated e-books, ensuring wide and rapid dissemination.
Further information on MDPI's Special Issue policies can be found here.