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Smart Sensors for Structural Health Monitoring and Nondestructive Evaluation: 2nd Edition

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Physical Sensors".

Deadline for manuscript submissions: closed (30 June 2024) | Viewed by 2624

Special Issue Editor

Prof. Dr. Zenghua Liu

E-Mail Website
Guest Editor
Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing 100124, China
Interests: ultrasonic nondestructive testing and evaluation; structural health monitoring; signal processing; smart sensors development; electromagnetic inspection
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Structural health monitoring (SHM) and nondestructive evaluation (NDE) technologies can be used to identify defects or damages and evaluate the health of components or systems to avoid structural failure or catastrophes. Sensors are widely used to collect information about the status of engineering components and systems. The development and application of sensors are key research topics in the areas of SHM and NDE. This Special Issue will collect recent research exploring the use of sensors for SHM and NDE.

We look forward to receiving papers on a wide range of research topics including, but not limited to, the following:

  • Sensors and sensor arrays;
  • Sensor modeling and simulation;
  • SHM systems and technology;
  • Nondestructive testing and evaluation;
  • Structure diagnosis and performance evaluation;
  • Signal processing;
  • Artificial intelligence applications in SHM and NDE;
  • System and instrument development;
  • Field applications of SHM and NDE.

For this Special Issue, you are also welcome to submit review papers reporting on sensor development and applications in SHM and NDE.

Prof. Dr. Zenghua Liu
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • structural health monitoring
  • nondestructive evaluation/testing
  • sensor
  • sensor array
  • detection
  • finite element simulation
  • signal processing
  • system development
  • artificial intelligence
  • field applications

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Related Special Issue

Published Papers (2 papers)

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Research

15 pages, 9001 KiB  
Article
Novel Water Probe for High-Frequency Focused Transducer Applied to Scanning Acoustic Microscopy System: Simulation and Experimental Investigation
by Van Hiep Pham, Le Hai Tran, Jaeyeop Choi, Hoanh-Son Truong, Tan Hung Vo, Dinh Dat Vu, Sumin Park and Junghwan Oh
Sensors 2024, 24(16), 5179; https://doi.org/10.3390/s24165179 - 10 Aug 2024
Viewed by 878
Abstract
A scanning acoustic microscopy (SAM) system is a common non-destructive instrument which is used to evaluate the material quality in scientific and industrial applications. Technically, the tested sample is immersed in water during the scanning process. Therefore, a robot arm is incorporated into [...] Read more.
A scanning acoustic microscopy (SAM) system is a common non-destructive instrument which is used to evaluate the material quality in scientific and industrial applications. Technically, the tested sample is immersed in water during the scanning process. Therefore, a robot arm is incorporated into the SAM system to transfer the sample for in-line inspection, which makes the system complex and increases time consumption. The main aim of this study is to develop a novel water probe for the SAM system, that is, a waterstream. During the scanning process, water was supplied using a waterstream instead of immersing the sample in the water, which leads to a simple design of an automotive SAM system and a reduction in time consumption. In addition, using a waterstream in the SAM system can avoid contamination of the sample due to immersion in water for long-time scanning. Waterstream was designed based on the measured focal length calculation of the transducer and simulated to investigate the internal flow characteristics. To validate the simulation results, the waterstream was prototyped and applied to the TSAM-400 and W-FSAM traditional and fast SAM systems to successfully image some samples such as carbon fiber-reinforced polymers, a printed circuit board, and a 6-inch wafer. These results demonstrate the design method of the water probe applied to the SAM system. Full article
(This article belongs to the Special Issue Smart Sensors for Structural Health Monitoring and Nondestructive Evaluation: 2nd Edition)
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12 pages, 3277 KiB  
Article
Non-Destructive Imaging of Defects Using Non-Cooperative 5G Millimeter-Wave Signals
by Stavros Vakalis, Jorge R. Colon-Berrios, Daniel Chen and Jeffrey A. Nanzer
Sensors 2023, 23(14), 6421; https://doi.org/10.3390/s23146421 - 14 Jul 2023
Cited by 4 | Viewed by 1153
Abstract
Recent developments in fifth-generation (5G) wireless communications networks are creating an increasingly crowded electromagnetic environment at microwave (3–30 GHz) and millimeter-wave (30–300 GHz) frequencies. Radiation at these bands can provide non-destructive testing of defects and shielded structures using non-ionizing signals. In an actual [...] Read more.
Recent developments in fifth-generation (5G) wireless communications networks are creating an increasingly crowded electromagnetic environment at microwave (3–30 GHz) and millimeter-wave (30–300 GHz) frequencies. Radiation at these bands can provide non-destructive testing of defects and shielded structures using non-ionizing signals. In an actual building setting where 5G millimeter-wave communications signals are present, passive imaging of the radiation that is propagating through a wall defect can take place by means of interferometric processing without emitting additional signals in an already-crowded spectrum. We investigate the use of millimeter-wave interferometric imaging of defects in building walls and shielded structures by capturing the transmission of 5G millimeter-wave signals through the defects. We experimentally explore the ability to image defects by capturing the transmission of 38 GHz signals through materials using a 24-element interferometric receiving array. Full article
(This article belongs to the Special Issue Smart Sensors for Structural Health Monitoring and Nondestructive Evaluation: 2nd Edition)
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