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Artificial Intelligence-Enhanced Flexible Electronics for Human–Machine Interaction

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Sensors and Robotics".

Deadline for manuscript submissions: 31 May 2026 | Viewed by 42

Special Issue Editor


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Guest Editor
Institute of Semiconductors, Chinese Academy of Sciences, Beijing, China
Interests: flexible self-powered sensors; two-dimensional materials; multimode sensing; machine learning
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

With the rapid development of mobile Internet of Things and intelligent devices, flexible electronics have received tremendous attention driven by high market demand. In recent years, various flexible electronics based on low-dimensional nanomaterials have been fabricated to detect different signal stimuli, such as pressure, deformation, humidity, light, heat, gas, and current, for application in artificial skin and human–machine interactions. Low-dimensional materials can be integrated into various soft materials, such as hydrogels and elastomers, to achieve multifunctional performance. However, conventional analysis of human–machine interaction data largely relies on human supervision, where signal processing and data evaluation are time-consuming and allow for limited interpretation. There is an unmet demand for flexible electronic devices and efficient data analysis solutions.  Artificial intelligence, together with the rapidly growing interest in human–machine interactions, has become the main catalyst for innovations in advanced flexible electronics.

This Special Issue is dedicated to the latest advances in artificial intelligence-enhanced flexible electronics for human–machine interaction. Both review and original research articles on the design, synthesis, fabrication, characterization, and applications of flexible electronics are welcome.

Dr. Huamin Chen
Guest Editor

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Keywords

  • flexible sensors
  • flexible actuators
  • low-dimensional materials
  • wearable electronics
  • human–machine interactions
  • artificial intelligence
  • machine learning

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Published Papers

This special issue is now open for submission.
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