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Emerging Wireless Sensing Components and Platforms

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Wearables".

Deadline for manuscript submissions: closed (20 October 2021) | Viewed by 684

Special Issue Editors


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Guest Editor
Wireless Sensor Network Group, Micro and Nanoelectronics Research Centre, Tyndall National Institute, University College Cork, T12R5CP Cork, Ireland
Interests: wearable antennas and sensors; flexible antennas; ultra-wideband antennas; reconfigurable antennas; unconventional materials-based antennas
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Guest Editor
Faculty of Medicine and Health Technology, Tampere University, Tampere, Finland
Interests: technology for wireless health including implantable and wearable antennas; sensors; wireless power transfer; microwave circuits; RFID-inspired wireless solutions

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Guest Editor
Advanced Communication Engineering (ACE) COE, Faculty of Electronic Engineering Technology,Universiti Malaysia Perlis, Perlis, Malaysia
Interests: wearable antennas; flexible metasurfaces; body area communication; electromagnetic safety and absorption; wireless and radar techniques for healthcare
Special Issues, Collections and Topics in MDPI journals

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Guest Editor
School of Information and Communications Engineering, Xi'an Jiaotong University, Xi'an, China
Interests: wearable antennas; metamaterials; microfluidic biosensors; antenna diversity technology

Special Issue Information

Dear Colleagues,

Research and development of wireless sensor technology has experienced an explosive amount of growth, with prospected applications ranging across all the domains of society from healthcare to industrial automation to space exploration.

Several crucial challenges in creating sophisticated wireless sensing platforms are the requirements of flexible, inconspicuous, and highly integrated structures that combine the sensing element(s), transducer(s), and wireless communication modules, including antennas and other electronics. These should integrate seamlessly with the application environment and operate effectively and reliably in it. Further, wireless sensing platforms are desired to operate at very low power levels and in some cases through wireless power transfer, totally avoiding batteries. Some of the extreme structural requirements of thinness, flexibility, and biocompatibility are underlined by the wireless health applications, where implanted and on-skin structures are used for physiological monitoring. Similarly, in any wearable devices, textile materials must be used to replace the conventional circuit boards, and the devices must endure repeated washing.

To advance the state-of-the-art in the field, we solicit original research contributions focused on novel wireless sensor components and platforms, including (but not limited to) sensors, antennas, circuits and systems, materials and manufacturing techniques, computational models and methods, and experimental demonstrations.

Dr. Roy B.V.B. Simorangkir
Dr. Toni Björninen
Dr. Ping Jack Soh
Prof. Sen Yan
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Flexible electronics
  • Electronic textiles
  • Epidermal electronics
  • Wearable electronics
  • Implantable/ingestible electronics
  • Intelligent sensing surfaces
  • 3D printing
  • Micro and nanostructures
  • Radio-frequency Identification (RFID)
  • Wireless health monitoring
  • Metamaterials-based sensing
  • Wireless power transfer
  • Energy harvesting components/subsystems
  • Wireless body area network (WBAN)
  • Numerical modeling

Published Papers

There is no accepted submissions to this special issue at this moment.
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