Sensing and Imaging for Defect Detection: 3rd Edition
A Special Issue of Sensors (ISSN 1424-8220) belonging to the section "Sensing and Imaging".
Deadline for manuscript submissions: 20 September 2027 | Viewed by 45
Editors
Interests: NDT&E technology with ultrasonic; electromagnetic; imaging processing technology; high-imaging-resolution technology
Special Issues, Collections and Topics in MDPI journals
Interests: sensor technology; structural health monitoring technology
Special Issues, Collections and Topics in MDPI journals
Interests: sensor technology; robotics
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Rapid advances in industrial intelligence, digitalisation and high‑precision manufacturing have raised stringent demands for reliable, efficient and automated nondestructive testing and evaluation (NDT&E). Traditional NDT approaches relying on eddy current, penetrant, magnetic particle, ultrasonic and X‑ray techniques face persistent bottlenecks when addressing complex engineering scenarios, including complex component geometries, tiny early‑stage flaws, multi‑layered structures, and defects buried deep inside heterogeneous materials. The 3rd Edition focuses on cutting‑edge breakthroughs, emerging research frontiers and unresolved practical challenges in this rapidly evolving field.
This Special Issue targets critical defect types and real‑world application pain points, including microcracks, early fatigue damage, subsurface inclusions, porosity, interfacial debonding and hidden corrosion in metallic alloys, composite materials, advanced ceramics and large‑scale infrastructure components. It highlights state‑of‑the‑art sensing and imaging modalities, such as phased‑array ultrasonic imaging, terahertz sensing, thermographic imaging, laser‑based scanning, machine‑vision inspection and multi‑sensor fusion systems. We welcome original methodological advances, novel signal reconstruction algorithms, intelligent defect characterisation enabled by artificial intelligence, and practical validations under complex operating conditions.
We invite high‑quality original research papers and comprehensive review articles that report recent progress in sensing and imaging for defect detection. Contributions should demonstrate innovative sensing hardware, advanced image processing and reconstruction, intelligent defect segmentation and quantification, or field‑oriented NDT&E implementations.
Prof. Dr. Haitao Wang
Dr. Yongkai Zhu
Dr. Fei Fei
Guest Editors
Manuscript Submission Information
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Keywords
- sensors
- NDT&E technology
- defect detection technology
- imaging technology
- data acquirement and processing
- sensing techniques
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Related Special Issue
- Sensing and Imaging for Defect Detection: 2nd Edition in Sensors (10 articles)
