Condition Monitoring and Fault Diagnosis for Smart Manufacturing
A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Fault Diagnosis & Sensors".
Deadline for manuscript submissions: 20 March 2026 | Viewed by 46
Special Issue Editors
Interests: cyber-physical integration systems for complex equipment; multidisciplinary design and optimization; high-performance medical device design and manufacturing; neurobiomechanics
Interests: development of cutting-process sensors; process monitoring, control, and precision measurement in mechanical engineering
Interests: cutting/grinding technology to realize high precision and efficiency for gear; machining center with CFRP; micro machining of glass with ultra short pulse laser; artificial knee joint designed for each patient
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
The growing demand for reliability and efficiency in Smart Manufacturing systems has elevated the importance of online condition monitoring and fault diagnosis. Advanced sensor networks play a pivotal role in capturing real-time data, enabling the early detection, localization, and prediction of anomalies to prevent system failures and unplanned downtime. This Special Issue, Condition Monitoring and Fault Diagnosis for Smart Manufacturing, aims to showcase the latest research achievements and practical applications in this domain.
We invite submissions that explore innovative sensor technologies, robust data-acquisition architectures, and the integration of artificial intelligence (AI) algorithms to enhance fault detection and diagnostic capabilities. Topics of interest include, but are not limited to, the following:
- Development of novel sensor materials, designs, and fusion strategies;
- AI-driven data analysis and anomaly detection techniques;
- Edge computing and hybrid edge-to-cloud solutions for low-latency, real-time monitoring; · Digital-twin and model-based diagnostic frameworks;
- Case studies demonstrating deployments in manufacturing, aerospace, transportation, and energy sectors.
This Special Issue seeks to foster interdisciplinary collaboration and provide a platform for sharing breakthroughs in sensor-based condition monitoring systems. We especially encourage contributions that highlight the synergistic use of sensors and AI to meet the challenges of real-time monitoring and predictive maintenance in next-generation smart factories. We look forward to your valuable contributions.
Prof. Dr. Liming Shu
Dr. Pengfei Zhang
Prof. Dr. Naohiko Sugita
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- sensors
- smart manufacturing
- condition monitoring
- fault diagnosis
- predictive maintenance
- artificial intelligence
- industrial applications
- machine learning
Benefits of Publishing in a Special Issue
- Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
- Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
- Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
- External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
- Reprint: MDPI Books provides the opportunity to republish successful Special Issues in book format, both online and in print.
Further information on MDPI's Special Issue policies can be found here.
