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Sensors Meet Deep Learning: Advancing 3D Vision for Classification, Detection, and Mapping

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Intelligent Sensors".

Deadline for manuscript submissions: 30 April 2026 | Viewed by 34

Special Issue Editors


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Guest Editor
Department of Computer Science, Wilfrid Laurier University, Waterloo, ON, Canada
Interests: computer vision; image processing; machine learning; deep learning

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Guest Editor
Photogrammetry and Computer Vision Laboratory, National Technical University of Athens, 15773 Athens, Greece
Interests: image processing; computer vision; robotic systems; deep learning; machine learning; Markovian models; signal processing and pattern analysis
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

The fusion of sensor technologies and deep learning is revolutionizing 3D vision, unlocking unparalleled precision in classification, detection, and mapping. This Special Issue focuses on three core areas: classification for precise object recognition, detection for accurate spatial localization, and mapping for high-fidelity 3D reconstruction. These advancements empower transformative applications in autonomous vehicles, robotics, augmented reality, and urban planning, tackling real-world challenges with improved precision and efficiency.

We invite high-quality submissions from interdisciplinary researchers in computer vision, machine learning, and sensor technology to contribute innovative methodologies and efficient deep learning models for 3D data processing. Topics of interest include, but are not limited to, the following:

  • 3D object classification
  • 3D object detection and localization
  • 3D scene mapping and reconstruction
  • Novel deep learning architectures
  • Multimodal sensor fusion techniques
  • Real-time 3D data processing
  • Robust perception under adverse conditions
  • Scalable solutions for large-scale 3D mapping
  • Applications of 3D vision with deep learning

Through this Special Issue, we aim to foster collaboration among researchers and practitioners, showcasing cutting-edge research that inspires the next generation of intelligent systems leveraging the powerful intersection of sensors and deep learning for 3D vision. We invite you to contribute your innovative research and collectively shape the future of this dynamic field.

Dr. Sheikh Ziauddin
Prof. Dr. Anastasios Doulamis
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • 3D vision
  • deep learning
  • sensor fusion
  • 3D object detection
  • 3D mapping and reconstruction

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Published Papers

This special issue is now open for submission.
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