Intelligent Inspection Technologies for Advanced Electronic Packaging and Other Industrial Applications
A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Electronic Sensors".
Deadline for manuscript submissions: 31 December 2026 | Viewed by 128
Editor
Interests: nondestructive testing for advanced electronic packaging; infrared lock-in thermography; high-frequency ultrasonic testing; multi-source data fusion and intelligent image recognition
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Intelligent inspection has become a transformative force in the realm of advanced electronic packaging, driven by the imperative to ensure reliability and precision at ever-shrinking scales. The increasing complexity of 3D integration, chiplet architectures, and fan-out wafer-level packaging demands inspection systems capable of high accuracy and real-time decision-making. By leveraging artificial intelligence, machine learning, and advanced sensor fusion, these smart technologies are revolutionizing quality control, enabling predictive maintenance and closed-loop manufacturing processes. This evolution is critical for meeting the stringent requirements of next-generation devices in AI computing, 5G/6G communications, and the Internet of Things.
This Special Issue aims to present the latest developments in this rapidly evolving field. We welcome both original research papers and review articles that showcase the significant developments in these fields. Potential areas of interest include, but are not limited to, the following:
Dr. Bo Sun
Guest Editor
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Keywords
- AI-driven intelligent inspection
- nondestructive inspection
- online inspection
- automated optical inspection (AOI)
- X-ray inspection
- active thermography
- infrared imaging
- scanning acoustic microscopy (SAM)
- super-resolution imaging
- multi-source data fusion
- 3D tomography
- micro-defect detection
- image recognition network
- heterogeneous integrated advanced packaging
- high-density electronic packaging
- hybrid bonding
- chiplet
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