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Smart Materials for Soft Robotics and Sensors

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Sensor Materials".

Deadline for manuscript submissions: 30 June 2026 | Viewed by 7

Special Issue Editors


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Guest Editor
Manchester Metropolitan University, Ormond Building, Manchester M15 6BX, UK
Interests: soft robots for health applications

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Guest Editor
Faculty of Engineering and Physical Sciences, University of Leeds, Leeds LS2 9JT, UK
Interests: soft and continuum medical robotic systems

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Guest Editor Assistant
Soft Transducers Lab, EPFL, 1015 Lausanne, Switzerland
Interests: conformable electronics

Special Issue Information

Dear Colleagues,

Over the past few decades, smart soft materials have revolutionized the field of electronics by enabling the creation of flexible/stretchable, conformable, lightweight, and multifunctional sensors for a wide range of applications in wearable technologies and soft robotics.

Empowering soft robots and wearable devices with high resolution, high sensitivity, and rapid response sensing capabilities is crucial for their advancement in numerous real-world applications, including, but not limited to, portable wearables in mobile healthcare and sport engineering, a broad range of human–machine interfaces, advanced rehabilitation and assistive devices, medical implants, and smart soft robots for minimally invasive surgery, drug delivery, remote exploration, and environmental monitoring.

In order to fully exploit the potential of smart materials for such applications, they must be compatible with effective, efficient, agile, low-cost, and sustainable techniques for their processing and integration into flexible/stretchable devices. For this reason, the development of new engineered smart materials, combined with advanced manufacturing techniques, has become an urgent topic.

This Special Issue is addressed to all kinds of smart soft material-based sensors that are currently being used for wearable technologies and soft robotics. We welcome original research contributions and state-of-the-art reviews that highlight recent advancements and novel applications and promote further research in this area.

Dr. Silvia Taccola
Dr. James H. Chandler
Guest Editors

Dr. Arianna Mazzotta
Guest Editor Assistant

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • smart materials
  • multifunctional materials
  • smart material processing
  • smart materials synthesis
  • smart sensors
  • wearable sensors
  • soft sensors
  • flexible electronics
  • conformable electronics
  • stretchable electronics
  • soft robotic sensing
 

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Published Papers

This special issue is now open for submission.
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