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Condition Monitoring of Electrical Equipment Within Power Systems

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Electronic Sensors".

Deadline for manuscript submissions: 31 July 2025 | Viewed by 356

Special Issue Editors


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Guest Editor
Faculty of Electrical Engineering, “Gheorghe Asachi” Technical University of Iaşi, 700050 Iasi, Romania
Interests: monitoring and diagnosis; electrical equipment; electrical thermal stress; design of electrical systems; modeling of thermal simulation
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
Faculty of Electronics, Telecommunications and Information Technology, “Gheorghe Asachi” Technical University of Iaşi, 700050 Iasi, Romania
Interests: hardware security; microwaves; smart cities
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

In modern society, consumers (especially industrial ones) are increasingly sensitive to equipment outages within the electrical system; they resort to contractual regulations to compensate for any losses. Therefore, it is necessary to use increasingly efficient devices to monitor thermal stresses in addition to methods that streamline the management of electrical equipment in order to minimize out-of-service time.

Considering this context, this Special Issue, “Condition Monitoring of Electrical Equipment Within Power Systems”, aims to collect up-to-date scientific research papers and reviews that focus on power sensor monitoring systems, particularly the thermal and electrical parameters of electrical equipment found within electrical cells, as these can reveal important data regarding their technical condition. The development of electrical substations involves the use of high-performance systems, with high reliability, that continuously monitor the thermal condition of electrical equipment.

This Special Issue will fit within the scope of Sensors by compiling up-to-date research on the use of power engineering sensors for condition monitoring.

The aim of this Special Issue is to gather the latest original research and review articles on condition monitoring using power sensors. The topics of this Special Issue will include, but are not limited to, the following:

Dr. Alin Dragomir
Dr. Cristian Andriesei
Guest Editors

Manuscript Submission Information

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Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • monitoring and diagnosis of electrical equipment
  • electrical thermal stress
  • condition monitoring
  • design of electrical systems
  • modeling of thermal simulation
  • IoT methods for condition monitoring
  • maintenance methods
  • saw sensors
  • zig-bee network
  • digital communication
  • adaptive operation and sensing
  • data collection and cloud computing
  • data transmission technologies and optimization
  • energy harvesting technologies
  • energy-efficient algorithms
  • energy management algorithms
  • fault and maintenance prediction
  • operation reliability analysis
  • hardware security
  • microwaves
  • smart cities

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Published Papers (1 paper)

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Research

22 pages, 12681 KiB  
Article
On Power-Off Temperature Attacks Potential Against Security Sensors
by Maryam Esmaeilian, Vincent Beroulle and David Hély
Sensors 2025, 25(6), 1912; https://doi.org/10.3390/s25061912 - 19 Mar 2025
Viewed by 176
Abstract
Embedded systems can be targeted by fault injection attacks (FIAs), which enable attackers to alter the system specified behavior, potentially gaining access to confidential information or causing unintended outcomes, among other effects. Although numerous security sensors and attack detectors have been proposed in [...] Read more.
Embedded systems can be targeted by fault injection attacks (FIAs), which enable attackers to alter the system specified behavior, potentially gaining access to confidential information or causing unintended outcomes, among other effects. Although numerous security sensors and attack detectors have been proposed in the literature to detect different sources of FIAs, it is crucial to ensure that these mechanisms themselves have not been tampered. Hence, the integrity of these detectors is critical in maintaining the security of embedded systems. This study focuses on evaluating the robustness of delay-based digital detectors against a new type of FIA called power-off temperature attack (POTA). POTA occurs when the chip power is turned off, rendering the detectors inactive and allowing the attackers to bypass them. After a POTA, the circuit or its detectors may not function properly when the power is restored, potentially allowing other attacks to go undetected if the detectors are less sensitive. This study implements two attack detectors on Xilinx Artix-7 FPGAs and investigates the impact of heating cycles on theses detectors’ characteristics when the FPGA is in different states, including power-off, power-on, and inactive modes (such as clock-freezing mode). Our experiments reveal that heating cycles in power-off or inactive modes can alter the FPGA component delays and reduce the accuracy of its detectors, which highlights the vulnerability of these systems to POTA and potential risks to embedded system security. Full article
(This article belongs to the Special Issue Condition Monitoring of Electrical Equipment Within Power Systems)
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