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Advanced Flexible Sensors

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Physical Sensors".

Deadline for manuscript submissions: 31 December 2026 | Viewed by 103

Special Issue Editor


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Guest Editor
École de Technologie Supérieure, Department of Electrical Engineering, 1100, rue Notre-Dame Ouest (Angle Peel), Montréal, QC H3C 1K3, Canada
Interests: materials chemistry; flexible and printed electronics; polymer and inorganic nanocomposites; advanced sensing materials; electrochemical energy storage

Special Issue Information

Dear Colleagues,

Flexible sensors are rapidly transforming how we measure and interact with the physical, chemical and biological world, enabling conformable, lightweight and unobtrusive platforms for health monitoring, soft robotics, human–machine interfaces, structural health, environmental monitoring and smart infrastructure. Recent advances in flexible substrates, stretchable conductors, functional nanomaterials and emerging manufacturing technologies (e.g., printing, laser patterning, additive manufacturing) are opening new possibilities for high‑performance, low‑cost sensing systems that can conform to complex surfaces, withstand deformation and operate reliably in real‑world conditions. At the same time, integrating power management, signal processing and wireless communication into flexible form factors raises critical challenges in material compatibility, device architecture, durability and large‑area fabrication. Reflecting this rapid technological development, the global flexible sensors market is projected to expand from around 8 billion USD in 2026 to more than 11 billion USD by 2032, underscoring both the scientific importance and growing economic impact of advanced flexible sensing technologies.

This Special Issue aims to present and disseminate the most recent advances in advanced flexible sensors, spanning fundamental materials development, device engineering, system integration and application‑driven demonstrations. We welcome contributions that address the full chain from materials and structures (e.g., polymers, nanocomposites, 2D materials, hybrid organic–inorganic systems) to novel transduction mechanisms; reliability and stability under mechanical and environmental stress and integration with power, communication and data‑analytics modules. Both experimental and theoretical/computational studies are encouraged, as well as works that highlight scalability, manufacturability and pathways toward real‑world deployment.

Topics of interest for the publication include, but are not limited to, the following:

  • Materials and architectures for flexible, stretchable and wearable sensors
  • Polymer, nanocomposite and 2D‑material‑based sensing layers
  • Flexible chemical, gas and biosensors (e.g., VOC, sweat, breath and biomarker sensing)
  • Flexible physical sensors (strain, pressure, temperature, vibration and motion)
  • Self‑powered and energy‑harvesting flexible sensing systems
  • Printed, roll‑to‑roll and additive manufacturing approaches for flexible sensors
  • Integration of flexible sensors with wireless, IoT and edge‑computing platforms
  • Reliability, durability and long‑term stability of flexible sensors under mechanical and environmental loading
  • Modeling, simulation and data‑driven design of flexible sensor materials and devices
  • Application demonstrations in healthcare, robotics, human–machine interfaces, structural health monitoring and smart environments

Dr. Ahmad Al Shboul
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • flexible sensors
  • wearable sensors
  • printed electronics
  • polymer nanocomposites
  • stretchable electronics
  • self‑powered sensing
  • environmental and gas sensors
  • soft robotics
  • IoT and wireless sensing
  • advanced sensor materials

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Published Papers

This special issue is now open for submission.
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