Advances in MEMS Sensors: Research and Applications
A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Electronic Sensors".
Deadline for manuscript submissions: 25 April 2027 | Viewed by 109
Editors
Interests: MEMS; micro-nano sensors
Special Issue Information
Dear Colleagues,
With the rapid rise of emerging fields such as artificial intelligence and the Internet of Things, MEMS sensors, as core devices in the perception layer, are playing an increasingly important role. However, in complex and dynamic real-world application scenarios, sensors still encounter numerous challenges in terms of sensitivity, stability, and system integration. Therefore, there is an urgent need for collaborative, multi-disciplinary efforts that span innovations in sensing materials, micro-/nanofabrication process optimization, signal conditioning circuit design, and intelligent information processing.
This Special Issue aims to showcase the latest research achievements and cutting-edge developments in MEMS sensors and advanced sensing technologies. It will focus on novel MEMS sensing mechanisms, new sensitive materials, device design and fabrication, interface circuits, and signal processing, as well as application technologies for pressure, optical, gas, chemical, humidity, and biological sensing, and other forms of multi-dimensional sensing. We welcome original research contributions on MEMS sensor theoretical modeling, sensing materials, micro-/nanofabrication processes, packaging and testing, multi-sensor fusion, AI-enhanced perception, and sensor applications in various fields.
Topics of interest for publication include, but are not limited to, the following:
- Advanced sensing technologies;
- Novel sensitive materials;
- Micro/nanofabrication and packaging;
- MEMS sensing devices;
- MEMS interface circuits and signal conditioning;
- MEMS sensing systems;
- Multi-sensor fusion and wireless sensor networks;
- Flexible, wearable, and implantable sensors.
Dr. Shiyu Wang
Prof. Dr. Jiwei Wang
Guest Editors
Manuscript Submission Information
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Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- MEMS
- sensing materials
- microfabrications
- signal conditioning
- sensor fusion
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