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Wireless Intelligent Sensing

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Intelligent Sensors".

Deadline for manuscript submissions: 20 March 2026 | Viewed by 31

Special Issue Editors


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Guest Editor
School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, China
Interests: RF/microwave/mm-wave circuits and systems; short-range radar sensor and sensing systems; new concept human-computer interaction (HCI); wireless sensing and its various applications in AI/AR/VR/IoT

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Guest Editor
Faculty of Computer and Information Science, Hosei University, 2 Chome-17-1 Fujimi, Chiyoda, Tokyo 102-8160, Japan
Interests: wireless sensing; networking; pervasive computing; social computing; wearable technology; smart things; intelligent IoT
Special Issues, Collections and Topics in MDPI journals
Pontosense Inc., 30 Adelaide Street E 12th Floor, Toronto, ON M5C 3G8, Canada
Interests: antenna; electromagnetic compatibility; wireless system; wireless sensing
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

This Special Issue of Wireless Intelligent Sensing (WISe) covers topics from WISe systems, hardware, digital signal processing (DSP), and AI empowered data analytics. WISe applications are also encouraged, such as WISe for robotics, for Automobile applications, and for Huaman Centric applications. The topics are listed below but are not limited to the following aspects:

  • WISe systems
  • Radar for smart sensing
  • WiFi-based sensing
  • Sensing hardware and software co-design
  • Noise reduction technologies
  • Measurement technologies for WISe systems
  • Antenna design for WISe systems including DBF and reconfigurable antennas
  • AI empowered digital signal processing
  • DSP algorithms
  • Noise filtering technologies
  • AI empowered data analytics
  • AI enabled algorithm for WISe applications
  • WISe for Human centric applications
  • WISe for Automobile applications
  • WISe for Robotics applications

Dr. Changzhan Gu
Prof. Dr. Jianhua Ma
Dr. Yihong Qi
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • WISe systems
  • radar for smart sensing
  • WiFi-based sensing
  • sensing hardware and software co-design
  • noise reduction technologies
  • measurement technologies for WISe systems
  • antenna design for WISe systems
  • DBF and reconfigurable antennas
  • AI empowered digital signal processing
  • DSP algorithms
  • noise filtering technologies
  • AI empowered data analytics
  • AI enabled algorithm for WISe applications
  • WISe for human centric applications
  • WISe for automobile applications
  • WISe for robotics applications

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Published Papers

This special issue is now open for submission.
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