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Polymeric Materials for Flexible Electronics

A special issue of Polymers (ISSN 2073-4360). This special issue belongs to the section "Smart and Functional Polymers".

Deadline for manuscript submissions: 15 June 2025 | Viewed by 166

Special Issue Editors


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Guest Editor
Industry-Education-Research Institute of Advanced Materials and Technology for Integrated Circuits, Anhui University, Hefei, China
Interests: surface acoustic wave sensors; FBAR, flexible electronics
Special Issues, Collections and Topics in MDPI journals

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Guest Editor
Department of Mechanical & Aerospace Engineering, University of Missouri, Columbia, MO, USA
Interests: self-powered sensors; flexible electronics; sensors; polymer
Special Issues, Collections and Topics in MDPI journals

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Guest Editor
Light Industry College, Liaoning University, Shenyang 110036, China
Interests: polyoxometalates; electrochromism; metal organic framework
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

We are excited to announce the launch of a Special Issue entitled "Polymeric Materials for Flexible Electronics" in the esteemed journal Polymers. This Special Issue aims to bring together cutting-edge research and comprehensive reviews that explore the latest advancements in the field of polymer-based semiconductors and their applications in flexible electronics.

The scope of this Issue encompasses a wide range of topics, including, but not limited to, the following:

  1. Development and characterization of new polymeric materials with enhanced electrical properties.
  2. Processing techniques and manufacturing methods for polymer semiconductors in flexible electronics.
  3. Theoretical and computational models for designing polymer semiconductors.
  4. Polymer-based sensors and actuators for flexible and wearable electronics.
  5. Emerging applications of polymer semiconductors in flexible electronics, such as smart textiles and bioelectronics.
  6. Biocompatibility and biodegradability of polymer semiconductors for wearable and implantable devices.

We invite researchers, academics, and industry professionals to contribute their latest findings and insights to this Special Issue. Your contributions will significantly advance the understanding and development of polymer semiconductors for the next generation of flexible electronics.

Dr. Hongsheng Xu
Dr. Lin Shi
Dr. Shi-Ming Wang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Polymers is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2700 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • polymer semiconductors
  • polymer-based devices
  • flexible electronics
  • wearable devices
  • organic electronics
  • organic solar cells

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Published Papers

This special issue is now open for submission.
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