Photonics Enabled by Plasmonic Metamaterials: Recent Developments and Future Directions

A special issue of Photonics (ISSN 2304-6732).

Deadline for manuscript submissions: 1 June 2026 | Viewed by 558

Special Issue Editor


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Guest Editor
Institute of Optics and Electronics, Chinese Academy of Sciences, Chengdu, China
Interests: plasmonics; metamaterials; nanophotonics; nano-optics; metasurface; nanofabrication; super resolution; sub-diffraction; lithography
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Special Issue Information

Dear Colleagues,

Due to rapid advancements in materials, computation and nanofabrication techniques, photonics enabled by plasmonic metamaterials and metasurfaces have led to remarkable developments in both fundamental principles and various practical domains, including super-resolution imaging, nanolithography, sensing with high sensitivity and hyperspectral detection. In recent years, researchers have endeavored to combine this technology with physics, materials, and techniques such as deep/extreme ultraviolet source, two-dimensional materials and quantum to search for exciting phenomena and applications.

This Special Issue welcomes the submission of original research articles and reviews that present recent developments and future directions in “Photonics Enabled by Plasmonic Metamaterials and Metasurfaces”. We welcome the submission of all theoretical, numerical, and experimental papers. The scope of this Special Issue includes, but is not limited to, the following topics:

  • High/super-resolution imaging;
  • Nanolithography and nanofabrication;
  • Plasmonic metamaterials and metasurfaces;
  • Ultraviolet plasmonic;
  • Plasmonics in two-dimensional materials;
  • Nonlinear plasmonics;
  • Quantum plasmonics;
  • Plasmonic waveguides;
  • Plasmonic spectroscopy;
  • Plasmonics sensing.

Dr. Weijie Kong
Guest Editor

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Keywords

  • plasmonic
  • metamaterial
  • metasurface
  • super-resolution
  • subwavelength
  • nanolithography
  • nanofabrication
  • ultraviolet
  • quantum
  • spectroscopy
  • sensing

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Published Papers (1 paper)

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Research

22 pages, 5062 KB  
Article
A Tunable Hydrogen-Bond-Mediated Polymer-Based Mechanical Approach for Non-Destructive Cleaning of Silver Films
by Yuhang Zhang, Yun Du, Tao Shen, Xingyue Gao, Kaipeng Liu, Yunfei Luo, Chengwei Zhao, Zeyu Zhao, Changtao Wang and Ling Liu
Photonics 2026, 13(4), 358; https://doi.org/10.3390/photonics13040358 - 8 Apr 2026
Viewed by 105
Abstract
Silver films are key building blocks for plasmonic and nanophotonic devices, whose optical performance and device reliability are highly sensitive to particulate contamination introduced during fabrication and operation. Herein, a non-destructive surface cleaning strategy specifically applicable to silver film systems is proposed, based [...] Read more.
Silver films are key building blocks for plasmonic and nanophotonic devices, whose optical performance and device reliability are highly sensitive to particulate contamination introduced during fabrication and operation. Herein, a non-destructive surface cleaning strategy specifically applicable to silver film systems is proposed, based on the synergistic regulation of the mechanical properties of a polymer layer and its interfacial adhesion to the silver film. Such regulation is achieved by tuning hydrogen-bond-mediated interactions within a modified poly(vinyl alcohol) (PVA) layer, enabling effective control over the locus of fracture during peeling, such that fracture preferentially occurs at the polymer/silver interface. Unlike conventional polymer-assisted cleaning methods that suffer from an inherent trade-off between bulk cohesion and interfacial adhesion, this approach decouples the two properties through molecular-level hydrogen-bond redistribution. As a result, particulate contaminants can be efficiently removed from the silver surface while preserving the structural integrity of the silver film. The proposed method achieves a particle removal efficiency of up to 98% for contaminants larger than 30 nm and can be stably applied to silver films with lateral dimensions ranging from 1 inch to 12 inches, demonstrating excellent scalability. By further adjusting the processing parameters and compositional ratios of the polymer layer, this strategy is expected to be adaptable to silver films with different thicknesses and structural configurations, providing a reliable surface cleaning solution for improving the performance and reliability of plasmonic and optoelectronic thin-film devices. Full article
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