Diamond Devices: Design, Fabrication and Applications

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D:Materials and Processing".

Deadline for manuscript submissions: 31 May 2026 | Viewed by 6

Special Issue Editors

Research Center for Electronics and Optical Materials, National Institute for Materials Science, Namiki 1-1, Tsukuba 305-0044, Ibaraki, Japan
Interests: diamond; M/NEMS resonators; sensors

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Guest Editor
Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
Interests: diamond; M/NEMS; resonators; actuators and sensors; photodetectors

Special Issue Information

Dear Colleagues,

Diamond has emerged as a next-generation material for electronic and photonic technologies owing to its exceptional physical properties, including a wide bandgap, high thermal conductivity, excellent carrier mobility, and superior chemical stability. These outstanding characteristics make diamond devices highly attractive for MEMS/NEMS, power electronics, optoelectronics, and sensing applications, particularly in extreme or harsh environments where conventional semiconductors are insufficient. Recent advances in diamond growth, doping, microfabrication, and surface engineering have created new opportunities for device design and system integration, paving the way for innovative applications such as high-power switches, high-frequency transistors, photodetectors, sensors, and quantum devices.

Accordingly, this Special Issue seeks to highlight the latest research and developments in this rapidly evolving field. We welcome original research articles, short communications, and comprehensive reviews that address progress in diamond-based materials, device design, fabrication techniques, and application-driven studies in MEMS/NEMS, power electronics, optoelectronics, and sensors.

Dr. Guo Chen
Prof. Dr. Zilong Zhang
Guest Editors

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Keywords

  • diamond devices
  • MEMS/NEMS
  • power electronics
  • optoelectronics
  • sensors

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Published Papers

This special issue is now open for submission.
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