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Recent Developments in Manufacturing Processes for Electronics

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Manufacturing Processes and Systems".

Deadline for manuscript submissions: closed (30 June 2021) | Viewed by 588

Special Issue Editor

Imperial College London, UK
Interests: joint microstructure and properties heterogeneity; fatigue life of welded structures; residual stress simulation; structural integrity assessment; life-time prediction

Special Issue Information

Dear Colleagues,
 
The electronics manufacturing industry has always been at the forefront of the latest technological innovations. Development of advanced materials for future electronics and adoption of modern technologies such as 3D printing, smart manufacturing, artificial intelligence (AI), internet of things (IoT), big data, cloud computing, advanced robotics and so on, revolutionise and transform the way products are manufactured, and the welding and joining industry is no different. Growing demands for more compact electronic devices and systems operating under higher temperatures and harsher environments mean that a range of material properties and quality requirements must be satisfied according to factors such as the use environment, design and assembly method. Manufacturing processes induce thermal-mechanical-electrical stresses and in some cases, electrostatic discharge during handling and assembly, which may all lead to deterioration of the lifetime and structural integrity of electronic products.
 
The application of laser welding technology is rapidly increasing in many sectors of the manufacturing industry owing to its high efficiency, sustainability and automation. The need to control costs and improve efficiency has driven manufacturers towards new, energy-efficient manufacturing methods such as fibre laser welding and additive manufacturing technologies. In this Special Issue, latest advances and prospects of technologies, including, but not limited to, welding and joining, are strongly welcomed to form a body of state-of-the-art knowledge on manufacturing processes impacting the electronics manufacturing industry. It is my pleasure to invite you to submit a manuscript and contribute to this Special Issue.
 
The objectives are:
-    provide in-depth analysis towards processing of materials for smart  
     electronic devices
-    influence of the manufacturing process and the damages generated
-    impact of the damages on the structural integrity
-    understand questions associated with the processing of materials for
     electronic products
 

Dr. Joseph Ahn
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Published Papers

There is no accepted submissions to this special issue at this moment.
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