Flexible Electronics and Multifunctional Materials
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Electronic Materials".
Deadline for manuscript submissions: closed (20 September 2023) | Viewed by 448
Special Issue Editor
Special Issue Information
Dear Colleagues,
Flexible electronics have attracted extensive research attention because of their great potential in the Internet of Things (IoT), artificial intelligence (AI), wearable medical devices, and soft robots. For instance, flexible sensors can convert various external signals into measurable electrical signals (i.e., resistance, capacitance, current, voltage, etc.) which play a crucial role in health monitoring, smart robotics, and medical diagnosis. Particularly, the most frequently used multifunctional materials play a critical role in the field of flexible electronics, and thus, developing novel and high-performance materials and devices for flexible electronics is a promising solution to meet the rapidly growing social requirements. Looking ahead, despite the rapid progress and the wide range of applications of flexible electronics, further work still needs to be carried out to bridge the gap between research and engineering application.
In this Special Issue, the editors invite submissions contributing to the latest advances, challenges, and perspectives in flexible electronics and multifunctional materials. Progress in material development, structural design, and manufacturing is especially welcome. Here, we hope to provide an opportunity for academic and industry scientists to share knowledge and exchange scientific achievements in flexible electronics and multifunctional materials.
This Special Issue encourages authors, from academia and industry, to submit original research articles and reviews in the broad field of flexible electronics and multifunctional materials. The Special Issue topics include but are not limited to:
- Flexible sensors;
- Soft actuators;
- Artificial muscles;
- Flexible energy harvesters;
- Energy materials;
- Self-healing materials;
- Smart materials;
- Multifunctional composites;
- Polymeric composites;
- 3D/4D printing.
Dr. Zhen-Hua Tang
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- flexible sensors
- soft actuators
- artificial muscles
- smart materials
- multifunctional composites
- polymeric composites
- 3D/4D printing
