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Selected Papers from the 14th Southern Conference on Computational Mechanics

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Materials Simulation and Design".

Deadline for manuscript submissions: 20 October 2025 | Viewed by 89

Special Issue Editors


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Guest Editor
College of Mechanics and Materials, Hohai University, Nanjing 211100, China
Interests: computational mechanics; damage and fracture; peridynamics; fluid–structure interaction; multi-scale modeling; multiphysics analysis; concrete materials and structures; functionally graded materials; data-driven analysis
Special Issues, Collections and Topics in MDPI journals

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Guest Editor
College of Civil and Transportation, Hohai University, Nanjing 210098, China
Interests: peridynamics; nonlocal modeling; multiphysics analysis; functionally graded materials; anisotropy

Special Issue Information

Dear Colleagues,

The 14th Southern Computational Mechanics Academic Conference (SCCM-14) will be held from April 18 to 20, 2025, in Nanjing, Jiangsu Province. This event continues to uphold the committee's mission of promoting interdisciplinary integration and fostering collaborative development between theoretical innovation and engineering applications.

As a core driver integrating theoretical modeling and numerical simulation, computational mechanics has deeply penetrated the entire R&D chain of materials science, structural engineering, industrial, and technological innovation, becoming a key enabler in tackling interdisciplinary challenges such as multi-scale material behavior prediction and structural failure analysis under extreme operating conditions. This Special Issue will select papers from the 14th Southern Conference on Computational Mechanics for publication. Original research and review articles are welcome in this Special Issue. Potential topics include the following:

  • Novel theories in computational mechanics and cross-scale modeling;
  • Numerical algorithms and high-performance computing;
  • Smart materials and machine learning-enabled advancements;
  • Biomechanics and nanomechanics;
  • Industrial software development;
  • Fatigue fracture mechanics and composite material simulations;
  • Fluid–structure interactions and granular material mechanics;
  • Multiphysics coupling under extreme environments;
  • Data-driven approaches and interdisciplinary methodologies.

Prof. Dr. Dan Huang
Dr. Zhiyuan Li
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • computational mechanics
  • multi-scale modeling
  • multiphysics modeling
  • damage and failure
  • data-driven approaches
  • industrial software development
  • high-performance computing
  • biomechanics and nanomechanics

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Published Papers

This special issue is now open for submission.
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