Welding, Joining, and Additive Manufacturing of Metals and Alloys (Second Edition)

Dear Colleagues,

The constant development of new materials and products also promotes the research and development of welding, joining, and build-up welding technologies as well as additive manufacturing technologies. These investigations are multidisciplinary and include processes and their automatization, monitoring and control, materials, weldability and joinability of materials and alloys, design of products and joints, and advanced characterisation and numerical simulations to comprehensively understand physical and metallurgical phenomena. A successful understanding of these phenomena enables the development of solutions to overcome these problems. This Special Issue aims to report basic and applied research results as well as case studies in the field of weldability and joinability of materials, additive manufacturing, automation, process improvement, and advanced characterisation.

The potential topics for the Special Issues include, but are not limited to, the following:

• Micro and nano joining.
• Diffusion bonding.
• Adhesive bonding.
• Hybrid welding and additive manufacturing.
• Laser welding.
• Welding with mechanical energy.
• Weldability of similar and dissimilar materials.
• Advanced material characterisation.
• Residual stress and distortion.
• Numerical modelling and simulation.
• Additive manufacturing processes (DED, powder bead fusion, binder jetting, etc.).
• Additive manufacturing of new materials, multi-materials, and functionally graded materials.
• Improvement in materials using weld surfacing and additive manufacturing.
• Repair welding and repair additive manufacturing of products.
• Advanced material characterisation.
• Fatigue of joints and AM parts.
• Destructive and non-destructive testing of joints and AM parts.
• Process automation, monitoring, and control.
• Vision systems in process monitoring, automation, and quality inspection.

Dr. Damjan Klobcar
Dr. Drago Bračun
Dr. Tomaž Vuherer
Guest Editors

Manuscript Submission Information

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