Wire Arc Additive Manufacturing (WAAM): New Trends and Future Perspectives
A special issue of Machines (ISSN 2075-1702). This special issue belongs to the section "Advanced Manufacturing".
Deadline for manuscript submissions: closed (31 December 2024) | Viewed by 3095
Special Issue Editors
2. Joining and Welding Research Institute, Osaka University, Osaka, Japan
Interests: welding engineering; process modelling; additive manufacturing
Special Issue Information
Dear Colleagues,
Wire Arc Directed Energy Deposition (WA-DED), commonly known as Wire Arc Additive Manufacturing (WAAM), has emerged as a transformative technology in the field of additive manufacturing (AM), promising unprecedented opportunities for innovation in the production of metallic components. This Special Issue aims to explore the latest trends and future perspectives in WAAM, providing a comprehensive platform for researchers and industry professionals to contribute cutting-edge insights.
WAAM, characterized by its use of an electric arc as the heat source and a metal wire as the feedstock, offers distinct advantages such as high deposition rates, cost-effectiveness, and versatility in handling various materials. This Special Issue will delve into the recent advancements in process optimization, material development, and equipment design, addressing challenges and pushing the boundaries of what is achievable with this additive manufacturing technique.
Authors are invited to submit contributions (full length research articles, communications, or reviews) that highlight novel applications of WAAM across diverse industries, including aerospace, automotive, energy, and healthcare, thereby sharing their expertise and ultimately enriching the discourse on WAAM. This Special Issue will encompass a broad spectrum of topics, ranging from fundamental research on process parameters and microstructural evolution to practical considerations in real-world manufacturing scenarios. By bringing together diverse perspectives and the latest research findings, this Special Issue aims to chart the trajectory of WAAM's evolution and pave the way for its future integration into mainstream manufacturing processes.
Key areas of interest include, but are not limited to, the following:
Process Development: New processes, process hybridization, laser arc, plasma and multi-wire WAAM;
Advanced Process Control: Exploring intelligent algorithms and real-time monitoring systems to enhance control over WAAM processes, ensuring precise deposition and superior part quality;
Material Innovation: Investigating new alloy developments, hybrid material combinations, and the impact of microstructure on mechanical properties to expand the material repertoire for WAAM applications;
Multi-Material Printing: Examining the feasibility and challenges of multi-material printing with WAAM, opening avenues for complex, multi-functional components with diverse material requirements;
Industrial Applications: Showcasing successful case studies and practical implementations of WAAM in various industries, emphasizing efficiency gains, cost-effectiveness, and sustainability.
Dr. Abhay Sharma
Dr. Angshuman Kapil
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
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Keywords
- wire arc additive manufacturing (WAAM)
- wire arc directed energy deposition (WA-DED)
- welding-based additive manufacturing
- laser arc
- plasma
- process optimization
- material innovation
- advanced process control
- multi-material printing
- industrial applications
- microstructural evolution
- future perspectives
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