Selected Papers from LAMDAMAP 2019
A special issue of Journal of Manufacturing and Materials Processing (ISSN 2504-4494).
Deadline for manuscript submissions: closed (30 June 2019) | Viewed by 10894
Special Issue Editors
Interests: surface metrology; manufacturing processes; precision engineering; additive manufacturing
Special Issues, Collections and Topics in MDPI journals
Interests: machine tool metrology; coordinate metrology; error budgeting
Special Issue Information
Dear Colleagues,
The 13th International Conference and Exhibition on Laser Metrology, Coordinate Measuring Machine, and Machine Tool Performance (LAMDAMAP 2019 https://www.euspen.eu/events/lamdamap-2019/) will be organized by euspen, drawing together many of the world’s distinguished scientists from all areas of science, engineering, and manufacturing. Advanced machine tool metrology supports superior part production, which enables, understands, and tracks the baseline performance and accuracy of machines. Whilst the trend towards nanometer level surfaces, finishes, and features progresses, the matching of both form and finish coherently in complex parts remains a major challenge. This year, the conference will focus on novel manufacturing technologies and machine tools, new developments in measurement techniques, performance evaluation for machine tools and coordinate measuring machines, roughness and machine tool standards, and metrology in new fabrication techniques, such as additive manufacturing.
The authors of selected high standard research contributions from the conference will be invited to submit their original papers and contributions under the following conference topics, which include, but are not limited to the following:
Novel manufacturing technologies and machine tools
New developments in measurement techniques
Performance evaluation for machine tools and CMMs
Roughness and machine tool standards
Metrology in new fabrication techniques
Robotics in shop-floor gauging
Prof. Dr. Liam Blunt
Dr. Wolfgang Knapp
Guest Editors
Manuscript Submission Information
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