Editorial Board Members’ Collection Series: "Durability and Moisture Dynamics of Wood"

A special issue of Forests (ISSN 1999-4907). This special issue belongs to the section "Wood Science and Forest Products".

Deadline for manuscript submissions: closed (15 December 2023) | Viewed by 189

Special Issue Editors


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Guest Editor
Department of Wood Science and Technology, Biotechnical Faculty, University of Ljubljana, Jamnikarjeva 101, SI-1000 Ljubljana, Slovenia
Interests: wood; wood modification; wood decay fungi; water repellent; natural waxes; recycled wood; sorption properties of protected wood; low energy houses; leaching of wood preservatives; wood service life; outdoor performance
Special Issues, Collections and Topics in MDPI journals

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Guest Editor
Department of Physics, Faculty of Science and Engineering, University of Northern British Columbia, Prince George, BC V2N 4Z9, Canada
Interests: forest products; wood; wood physics; wood anatomy; wood-water interaction; sorption isotherms; non-destructive testing; terahertz

Special Issue Information

Dear Colleagues,

The durability and moisture dynamics of wood and wood-based products have been studied over the years centered on decomposition factors with in-service applications. Wood-based products may include the solid wood of hardwoods and softwoods, or engineered wood products, such as CLT and panel broad products. Notwithstanding the enormous efforts of academic researchers and industry, an understanding of the moisture dynamics with respect to degradation is continually needed, given that newer wood products are being used in construction. This Special Issue will provide an overview of the most recent advances in the field of wood durability, as well as moisture dynamics for in-service products. Monitoring wood moisture dynamics during the construction and use of timber buildings are also welcome. Research on newer or improved technologies of non-destructive testing can be used to detect different degradation factors in wood-based materials. This Special Issue will showcase selected contributions on advances in the durability, moisture dynamics, characterization, and application of wood-based materials in relation to degradation. All degradation factors can be included, such as fungi, termites, and insects. In this Special Issue, Forests can accept both research papers and comprehensive review articles.

Dr. Boštjan Lesar
Dr. Ian Hartley
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Forests is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • durability
  • moisture dynamics
  • engineered wood products
  • service life

Published Papers

There is no accepted submissions to this special issue at this moment.
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