Advances in Thermal Management for Power Electronics

Dear Colleagues,

Under the impetus of efficient energy conversion and carbon neutrality goals, power electronic devices—such as IGBTs and SiC/GaN devices—have emerged as the core components of power electronic systems. Their application areas are rapidly expanding from traditional industrial control to emerging fields such as electric vehicles (EVs), renewable energy generation, rail transit, and smart grids. However, as the power density of these devices continues to increase, the heat flux generated during operation rises sharply. Elevated temperatures not only accelerate the aging of device materials and reduce conversion efficiency but can also directly trigger thermal runaway, severely compromising system reliability and lifespan. Traditional thermal management solutions, which rely on single-material structures and passive air cooling, have become inadequate to meet the heat dissipation demands of high heat flux scenarios. Current research urgently needs to break through conventional thermal management paradigms by leveraging material innovations, structural optimizations, and cross-scale heat transfer modulation to develop next-generation thermal management technologies capable of addressing the demands of high power density and high reliability.

This Special Issue aims to showcase the latest breakthroughs in the ​theory, design, modeling, and application​ of advanced thermal management systems for power electronics. We invite original contributions and comprehensive reviews on, but not limited to, the following topics:

• Nover thermal management design;
• Advanced materials for heat transfer;
• Intelligent thermal management;
• Novel applications of thermal management systems;
• Cross-scale heat transfer modulation;
• Optimal design methodologies;
• Advanced modeling approaches;
• Extreme environment adaptability.

Dr. Zhi Huang
Guest Editor

Manuscript Submission Information

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