Advanced Millimeter-Wave and Terahertz Hardware for 6G Systems: From Devices and Characteristics to Integrated Networks
A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Microwave and Wireless Communications".
Deadline for manuscript submissions: 15 June 2026
Special Issue Editor
2. School of Interdisciplinary Science, Beijing Institute of Technology, Beijing 100081, China
3. Department of Electrical and Electronic Engineering, Imperial College London, London SW7 2AZ, UK
Interests: reconfigurable RF/microwave/millimetre-wave devices; multilevel inverters; power electronics; thermal-hydraulic instrumentation; application security; sentiment analysis
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
The impending era of 6G communication promises to unlock unprecedented data rates, ultra-low latency, and pervasive connectivity, fundamentally transforming industries and societal infrastructures. To realize this vision, the exploration of the millimeter-wave (mmWave) and Terahertz (THz) frequency bands is paramount. These spectral regions offer the vast bandwidth necessary to support terabit-per-second speeds and enable revolutionary applications such as sub-millimeter imaging, high-precision sensing, and integrated communication and sensing. However, harnessing these high-frequency bands presents profound challenges, including significant propagation losses, complex channel modeling, and the demanding task of developing efficient, compact, and cost-effective active and passive devices.
This Special Issue of Electronics, titled ‘Advanced Millimeter-Wave and Terahertz Hardware for 6G Systems: From Devices and Characteristics to Integrated Networks,’ seeks to compile cutting-edge research and comprehensive review articles that address these critical challenges. We invite contributions that span the entire technology stack, from fundamental device physics to full system integration. A key focus is on the synergistic role of advanced simulation methodologies, e.g., multi-physics and multi-scale modeling, alongside precise experimental characterization techniques for validating the performance of novel transistors, antennas, metamaterials, on-chip components, and packaging solutions. Topics of interest extend to the development of sophisticated system architectures that efficiently integrate these high-frequency devices, including innovative beamforming networks, reconfigurable intelligent surfaces (RIS), and antenna-in-package (AiP) designs. We also welcome studies on novel materials, fabrication processes, and the critical interplay between device performance and 6G-specific use cases like holographic beamforming, joint communication and sensing, and ultra-massive MIMO. The goal of this Issue is to serve as a foundational resource for researchers and engineers pioneering the hardware that will form the backbone of future 6G wireless ecosystems.
Dr. Jinfeng Li
Guest Editor
Manuscript Submission Information
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Keywords
- millimeter-wave (mmWave)
- Terahertz (THz)
- 6G mobile communication
- device characteristics
- high-frequency simulation
- system integration
- reconfigurable intelligent surfaces (RIS)
- antenna-in-package (AiP)
- joint communication and sensing
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