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Advanced Millimeter-Wave and Terahertz Hardware for 6G Systems: From Devices...
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Advanced Millimeter-Wave and Terahertz Hardware for 6G Systems: From Devices and Characteristics to Integrated Networks

A Special Issue of Electronics (ISSN 2079-9292) belonging to the section "Microwave and Wireless Communications".

Deadline for manuscript submissions: closed (15 June 2026) | Viewed by 1967

Editor

Dr. Jinfeng Li

E-Mail Website
Guest Editor
1. Beijing Key Laboratory of Millimeter Wave and Terahertz Technology, School of Integrated Circuits and Electronics, Beijing Institute of Technology, Beijing, China
2. School of Interdisciplinary Science, Beijing Institute of Technology, Beijing, China
3. Department of Electrical and Electronic Engineering, Imperial College London, London, UK
Interests: reconfigurable RF/microwave/millimetre-wave devices; multilevel inverters; power electronics; thermal–hydraulic instrumentation; application security; sentiment analysis
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

The impending era of 6G communication promises to unlock unprecedented data rates, ultra-low latency, and pervasive connectivity, fundamentally transforming industries and societal infrastructures. To realize this vision, the exploration of the millimeter-wave (mmWave) and Terahertz (THz) frequency bands is paramount. These spectral regions offer the vast bandwidth necessary to support terabit-per-second speeds and enable revolutionary applications such as sub-millimeter imaging, high-precision sensing, and integrated communication and sensing. However, harnessing these high-frequency bands presents profound challenges, including significant propagation losses, complex channel modeling, and the demanding task of developing efficient, compact, and cost-effective active and passive devices.

This Special Issue of Electronics, titled ‘Advanced Millimeter-Wave and Terahertz Hardware for 6G Systems: From Devices and Characteristics to Integrated Networks,’ seeks to compile cutting-edge research and comprehensive review articles that address these critical challenges. We invite contributions that span the entire technology stack, from fundamental device physics to full system integration. A key focus is on the synergistic role of advanced simulation methodologies, e.g., multi-physics and multi-scale modeling, alongside precise experimental characterization techniques for validating the performance of novel transistors, antennas, metamaterials, on-chip components, and packaging solutions. Topics of interest extend to the development of sophisticated system architectures that efficiently integrate these high-frequency devices, including innovative beamforming networks, reconfigurable intelligent surfaces (RIS), and antenna-in-package (AiP) designs. We also welcome studies on novel materials, fabrication processes, and the critical interplay between device performance and 6G-specific use cases like holographic beamforming, joint communication and sensing, and ultra-massive MIMO. The goal of this Issue is to serve as a foundational resource for researchers and engineers pioneering the hardware that will form the backbone of future 6G wireless ecosystems.

Dr. Jinfeng Li
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-anonymized peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • millimeter-wave (mmWave)
  • Terahertz (THz)
  • 6G mobile communication
  • device characteristics
  • high-frequency simulation
  • system integration
  • reconfigurable intelligent surfaces (RIS)
  • antenna-in-package (AiP)
  • joint communication and sensing

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Published Papers (1 paper)

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Research

30 pages, 19497 KB  
Article
Radial Surface Roughness-Induced Loss Signature of 60 GHz Liquid Crystal Coaxial Delay Lines Conditioned on Models from Groisse and Huray
by Jinfeng Li and Haorong Li
Electronics 2026, 15(15), 3285; https://doi.org/10.3390/electronics15153285 - 25 Jul 2026
Viewed by 1023
Abstract
Liquid crystal (LC) is a key enabling technology for continuously phase-reconfigurable microwave devices, offering analogue-tuning capabilities distinct from discrete alternatives such as MEMS and p-i-n diodes. However, the insertion loss of LC-based phase shifters is inevitably influenced by conductor surface roughness—a factor often [...] Read more.
Liquid crystal (LC) is a key enabling technology for continuously phase-reconfigurable microwave devices, offering analogue-tuning capabilities distinct from discrete alternatives such as MEMS and p-i-n diodes. However, the insertion loss of LC-based phase shifters is inevitably influenced by conductor surface roughness—a factor often neglected in idealised simulations. This paper presents, for the first time, a rigorous numerical quantification of how metal surface roughness affects the insertion loss and phase shift of a 60 GHz LC-filled coaxial delay line (0–180° phase shifter) with radial conductor surfaces instead of conventional planar ones. Using full-wave finite-element simulations incorporating Groisse’s phenomenological model and Huray’s snowball model, four surface configurations are analysed at 54–66 GHz: perfectly smooth conductors, roughness on both inner and outer conductors simultaneously, and roughness applied to each conductor individually. Results show that roughness induces a measurable increase in insertion loss—worst when both conductors are rough—but its impact on differential phase shift remains minimal (<0.32°). Huray’s model predicts conductor losses 1.77 times higher than Groisse’s model, yielding more conservative metrics. For the insertion loss evaluation in Case 2 at 60 GHz under the reference isotropic LC state, Groisse’s model predicts 1.90921 dB, while Huray’s model predicts 2.16319 dB, a 0.25 dB discrepancy (12% uncertainty relative to the mean). The inner conductor dominates roughness-induced losses due to concentrated current density, suggesting prioritised surface finishing of the core line. This study isolates loss mechanisms in a coaxial LC structure, providing insights into low-loss reconfigurable devices. Practical PCB copper foil fabrication methods are also evaluated with quantitative analysis of non-ideal cylindrical geometries. Full article
(This article belongs to the Special Issue Advanced Millimeter-Wave and Terahertz Hardware for 6G Systems: From Devices and Characteristics to Integrated Networks)
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