Advances in 3D Computer Vision and 3D Data Processing
A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Computer Science & Engineering".
Deadline for manuscript submissions: 20 May 2026 | Viewed by 49
Special Issue Editors
Interests: 2D and 3D processing; machine learning; AI; virtual and augmented reality
Interests: electronics; machine vision; computer vision; computer architecture; embedded computer systems; robotics
Interests: online and distributed optimization; multimodal large language models
Special Issue Information
Dear Colleagues,
This Special Issue, “Advances in 3D Computer Vision and 3D Data Processing”, aims to highlight cutting-edge research and technological advancements in the rapidly evolving domains of 3D computer vision and data processing. With the increasing demand for precise 3D data acquisition, analysis, and application across diverse fields such as robotics, augmented reality (AR), virtual reality (VR), healthcare, and autonomous systems, this Special Issue seeks to provide a platform for innovative solutions addressing current challenges and exploring new possibilities.
The scope of this Special Issue encompasses a wide range of topics, including but not limited to 3D object recognition, scene reconstruction, multi-view geometry, depth estimation, and point cloud processing. It also focuses on advancements in machine learning and artificial intelligence techniques that enhance the accuracy, efficiency, and scalability of 3D vision systems. Contributions on novel algorithms for 3D data fusion, segmentation, registration, and geometric modeling are particularly encouraged. Additionally, we welcome research addressing practical challenges such as handling large-scale datasets, improving computational efficiency, and ensuring robustness in real-world applications.
By gathering high-quality research articles, reviews, and case studies, this Special Issue aims to foster collaboration among researchers from academia and industry. It seeks to advance the theoretical foundations of 3D computer vision while promoting its practical applications in areas like smart manufacturing, digital twins, autonomous navigation, and immersive technologies. This collection will serve as a valuable resource for researchers and practitioners striving to push the boundaries of what is achievable with 3D vision and data processing technologies.
Topic list:
- 3d object recognition and classification;
- Point cloud processing and analysis;
- Scene reconstruction and depth estimation;
- Generative AI for 3D model creation;
- Multi-view geometry and stereo vision techniques;
- Neural representations for 3D data (e.g., neural fields, NeRFs);
- Applications of 3D vision in AR/VR and the metaverse;
- Efficient algorithms for large-scale 3D data fusion;
- Robustness and security in 3D computer vision systems;
- Evaluation metrics and benchmarks for 3D vision algorithms;
- Parallel and distributed computing for 3D data processing.
Prof. Dr. Časlav Livada
Prof. Dr. Tomislav Keser
Dr. Linbo Qiao
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- 3D object recognition
- point cloud processing
- scene reconstruction
- depth estimation
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