Integration of Cloud Edge Computing into IoT in Modern Industrial Environments
A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Networks".
Deadline for manuscript submissions: 15 November 2025 | Viewed by 305
Special Issue Editors
Interests: cloud and edge computing; Internet of Things; distributed systems; mobile computing and middleware; cloud continuum; big data; industrial Internet of Things; industry 4/5.0
Special Issue Information
Dear Colleagues,
The integration of cloud edge computing into Internet of Things (IoT) in modern industrial scenarios represents a pivotal development in enhancing industrial efficiency, reliability, and innovation. This amalgamation leverages the strengths of both cloud and edge computing to address the unique demands of industrial environments, where real-time data processing, robust security, and efficient data management are critical.
This integration has proven to be one of the pillars of the Industry 4.0 revolution. I4.0 has fostered a deep change in the rigid organization model for factories. The multiple implications of the “connected factory" concept will lead to unexpected developments in production environments. Connected and interacting IoT objects will populate the factories of the future.
A progressive and decisive integration of cloud edge computing paradigms into modern industrial IoT objects is expected to occur, which practitioners refer to as the modern industrial digitalization, emphasizing the shortening of the gap between the manufacturing processes running on the shop floor and the storage, networking, computing resources, virtualization, and business-orientated software suites of the cloud and edge paradigms.
In this context, we propose this Special Issue, addressing “The Integration of Cloud Edge computing into IoT in modern Industrial Environments”. The focus of this Special Issue will be on technologies, paradigms, practices, and systems that ease or enable this revolutionary integration.
Emergent paradigms including artificial intelligence (AI), privacy-enhancing technologies (PETs), cybersecurity, blockchain (BC), IIoT systems and platforms, Cloud Continuum, zero defect/waste manufacturing, big data, industrial sustainability, advanced service orchestration in industrial deployments, 5G/6G communication, digital twins (DTs), and the metaverse are key aspects shaping the development of modern smart factories built on the integration of Cloud Edge computing into IoT.
Topics of interest include, but are not limited, to the following:
- Application of industrial Cloud Continuum;
- IIoT platforms and service orchestration;
- 5G/6G communication for industrial deployment;
- Computing continuum for smart factory services;
- Digital twins for industrial process or product monitoring;
- Edge data center deployment in industrial environments;
- ML- and AI-based approaches to cloud/edge-based smart factory applications;
- AI-driven models, architectures, and frameworks for industrial cloud edge computing;
- Design and evaluation tools for scalability and efficient resource allocation in Industry 4.0;
- Blockchain solutions for secure and reliable transactions between counterparts in data sharing/trading;
- Post-quantum security and privacy for industrial applications;
- Design and evaluation of microservice-based networking for 5G edge networks;
- Zero waste/defect manufacturing;
- Green manufacturing in Industry 5.0 deployment.
Dr. Riccardo Venanzi
Dr. Ruidong Li
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- IoT
- cloud continuum
- industry 4/5.0
- big data
- AI/ML
- predictive maintenance
- anomaly detection
- industrial 5G
- ML/DevOps
- smart manufacturing
Benefits of Publishing in a Special Issue
- Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
- Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
- Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
- External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
- Reprint: MDPI Books provides the opportunity to republish successful Special Issues in book format, both online and in print.
Further information on MDPI's Special Issue policies can be found here.
