Future Internet Circuits and Systems: Bridging Communication, Sensing and AI
A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Circuit and Signal Processing".
Deadline for manuscript submissions: 15 January 2026 | Viewed by 9
Special Issue Editors
Interests: signal processing; circuits and systems; wireless communication
Interests: artificial intelligence; machine learning; Internet of Things; positioning; wireless networks
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
The transition towards 6G and beyond is driving unprecedented demand for advanced circuits and systems that can support a new era of intelligent, energy-efficient and immersive wireless connectivity. As novel applications such as the Internet of Senses (IoS) and Ambient IoT (AIoT) emerge, circuit and system designers are at the forefront of developing these technologies through innovations in sensing, signal processing and integrated low-power design.
This Special Issue aims to bring together cutting-edge research focused specifically on circuits and systems underpinning next-generation wireless networks. These wireless networks require the seamless integration of communication and sensing capabilities, support for AI-native operations at the edge and ultra-low power consumption to meet the stringent requirements of IoT scalability and sustainability.
The IoS employs circuits capable of processing multisensory data such as touch, sound and vision with ultra-low latency, while AIoT systems depend on energy-harvesting and ambient-powered devices, necessitating novel hardware and circuit innovations.
We welcome high-quality original research and review articles focused on circuits and systems. Contributions may address (but are not limited to) the following topics:
- Millimetre-wave/sub-THz hardware for 6G and beyond.
- AIoT.
- Integrated communications and sensing.
- AI-centric wireless and architectures.
- IoS applications, e.g., haptic and audio-visual processing.
- Digital twin support and sensory data emulation.
This Special Issue will provide a focused platform for academics, engineers and practitioners to present their latest innovations in circuit and system design that will shape the technological foundations of the future internet. Through this issue, we will foster dialogue and collaboration across the domains of communications, sensing and AI.
We look forward to receiving your contributions.
Dr. Jaswinder Lota
Dr. Seyed Ali Ghorashi
Guest Editors
Manuscript Submission Information
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Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- millimetre-wave
- sub-THz
- AIoT
- AI-wireless
- integrated communication sensing
- haptic processing
- digital twin
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