Conferences
12–15 May 2023, Chengdu, China
ICET 2023: IEEE 6th International Conference on Electronics Technology
It is our pleasure to extend a warm welcome to all delegates to participate in the 2023 6th International Conference on Electronics Technology (ICET), which is held yearly in Chengdu, China. It is co-sponsored by the Sichuan Institute of Electronics and IEEE, technically co-sponsored by the Chengdu Section, Chengdu Section SSC/CAS Joint Chapter, Chengdu Section AP/EMC Chapter and Chengdu Section SP Chapter, with the support of the University of Electronic Science and Technology of China, Sichuan University, Southwest Jiaotong University, Xi’an University of Technology, Singapore Institute of Electronics, etc. The ICET 2023 will be held from May 12th to 15th (Friday to Monday).
The primary aim of the ICET conference is to offer an academic platform for senior and young scientists from all over the world to exchange research ideas and share knowledge, development and experiences on topics related to their experimental and theoretical work in the very wide-spread field of electronics and micro/nanoelectronics technology and electronic packaging in a convenient and multicultural atmosphere. The other key aim of the ICET is to provide postgraduate students with the opportunity to present their research findings in front of experts from both academia and industry for scholarly feedback. It also provides university academics and industry the opportunity to interact with the technical community, to share experiences and gain insights into the latest developments in technology presented at the conference. We sincerely hope that all delegates can have rich, useful, and effective deliberations that can lead to international cooperation.
You are invited to participate in this great event for sharing ideas, friendship and culture in the long history and hospitality city of Chengdu.
Scope:
- Antennas and Microwaves;
- Electronics Materials and Devices;
- Communication and Networks;
- Power and Electrical Engineering;
- Aerospace and Electronics Systems;
- Electronics Applications;
- Internet of Things;
- Embedded Systems;
- AI and Applications;
- Control and Robotics;
- Signal Processing
