Low-Dimensional Semiconductor Materials: Preparation, Properties, and Applications

A special issue of Coatings (ISSN 2079-6412). This special issue belongs to the section "Thin Films".

Deadline for manuscript submissions: closed (20 October 2023) | Viewed by 309

Special Issue Editor


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Guest Editor
Department of Science and Technology, HUTECH University, 475A Dien Bien Phu, Ward 25, Binh Thanh District, Ho Chi Minh City 700000, Vietnam
Interests: low-dimensional materials; photocatalysis; organic coatings; thin-film materials

Special Issue Information

Dear Colleagues,

Recent theoretical and experimental developments in low-dimensional semiconductors have become a new trend in the field of materials science. In particular, the scientific community is interested in the development of new materials, such as thin-film materials; one-dimensional semiconductors (nanorods, nanotubes, nanowires, nanofibers, etc.); studying crystals and the defects of materials; new findings in the optoelectronic properties of semiconductors; applications in optoelectronic devices, environmental treatment, and renewable energy, etc.

Interest is also focused on the manufacture, design, and testing of high-performance low-dimensional semiconductor materials that are either electroactive (e.g., metals, metal oxides, transparent conducting oxides (TCOs), graphene, graphitic carbon nitrides, conductive polymers, etc.) or are capable of discovering new physical and chemical properties.

This scope of this Special Issue will serve as a forum for papers covering the following concepts:

  • Synthesis, characterization, and new findings in properties and applications in the development of low-dimensional semiconductors—especially, transparent conducting oxides (TCOs), graphene, and graphitic carbon nitride materials.
  • Low-dimensional semiconductors produced by different processes, including—but not limited to—additive manufacturing processes, i.e., physical vapor deposition (PVD) or chemical vapor deposition (CVD).
  • The latest developments in test methods considering the interplay between mechanical, chemical, and electrochemical interactions and the ability to predict performance and/or reliability.
  • Computer modeling; simulation to predict the properties of thin-film materials; and performance, durability, and reliability in service environments.

Dr. Viet Van Pham
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Coatings is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • semiconductor thin film
  • doping
  • optoelectronics
  • photocatalysis
  • band structure
  • heterojunction
  • TCOs

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Published Papers

There is no accepted submissions to this special issue at this moment.
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