New Information Storage Films and Flexible Devices

A special issue of Coatings (ISSN 2079-6412). This special issue belongs to the section "Thin Films".

Deadline for manuscript submissions: closed (31 December 2023) | Viewed by 365

Special Issue Editor


E-Mail Website
Guest Editor
School of Mathematics and Physics, Jiangsu University of Technology, Changzhou 213000, China
Interests: phase-change memory films and integrated devices; flexible information storage films and electronic devices; structure design and theoretical study of composite nano-thin films

Special Issue Information

Dear Colleagues,

In recent years, research into semiconductor memory films and devices has attracted considerable attention. In particular, with the wide application of mobile electronic devices, the demand for wearable electronic devices is increasing day by day. As the core component of the next generation of information storage materials, semiconductor films are developing towards being ultra-thin, low-power consumption, long life, flexible, and highly durability. By optimizing the composition and structure of the film, the thermal stability of the information memory can be improved, the power consumption in the cycle transformation process can be reduced, and the structural relaxation caused by bending can be decreased. This Special Issue welcomes original and innovative research on new information storage films and devices, and wearable flexible films and devices, and will provide a platform for academic exchanges between relevant researchers.

We look forward to receiving your contributions!

Prof. Dr. Yifeng Hu
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Coatings is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • phase-change film
  • flexible electronic device
  • new information memory
  • photoelectric information film

Benefits of Publishing in a Special Issue

  • Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
  • Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
  • Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
  • External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
  • e-Book format: Special Issues with more than 10 articles can be published as dedicated e-books, ensuring wide and rapid dissemination.

Further information on MDPI's Special Issue policies can be found here.

Published Papers

There is no accepted submissions to this special issue at this moment.
Back to TopTop