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Nanotechnology for Novel Nanojoining and Microjoining

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Nanotechnology and Applied Nanosciences".

Deadline for manuscript submissions: closed (15 February 2020) | Viewed by 9653

Special Issue Editors


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Guest Editor
Swiss Federal Laboratories for Materials Science and Technology, Laboratory for Joining Technologies & Corrosion, Dubendorf, Switzerland
Interests: surface and interface engineering of metals, alloys, oxides, and their coating systems for joining and corrosion management; interfacial design and application of nanostructured materials for novel micro-/nano-joining technologies; tailoring microstructure–property relationships of functional oxide films

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Guest Editor
Swiss Federal Laboratories for Materials Science and Technology, 8600 Dübendorf, Switzerland
Interests: stress analysis in thin films; oxide thin films; XRD
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Fast-growing demands on component and product performance and functionality, as well as the trend of continuous miniaturization, require new integral manufacturing solutions. In particular, there is an increasing demand for combining different materials (e.g., compound semiconductors, dielectrics, metals, organics, and their composites), different devices (e.g., logic, memory, sensors, radio frequency, analog), and different technologies (e.g., electronics, photonics, plasmonics, MEMS, and sensors) into one single heterogeneous integrated system. New joining materials combined with innovative low-temperature, pressureless, residue-free joining processes with improved alignment accuracies are needed to overcome the limitations of current bonding and packaging technologies. As a result, the scientific discipline of micro-/nanojoining has recently emerged. Microjoining involves the advanced manufacturing of micro-scaled devices and components. The field of nanojoining focuses on the creation of functional bonds at the nano- or atomic-scale (joining of nanomaterials and nano-objects), as well as with the utilization of nanoeffects (joining with nanomaterials) for the development of new joining materials and processes. Nanojoining is expected to become a key technology for the large-scale production and commercial application of nano-devices and nano-systems in the near-future.

This Special Issue is devoted to all scientific and technological aspects related to the emerging field of micro-/nanojoining.

Dr. Lars P.H. Juergens
Dr. Claudia Cancellieri
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Joining for integration of nano-/micro-scale materials, components, and devices;
  • Nanostructured materials for joining;
  • Experimental investigations and model predictions of interface-controlled and/or size-dependent phenomena relevant to the field of nano-/micro-joining (e.g., nano-sintering, short-circuit diffusion, wetting, nucleation, premelting, metastable phase formation, phase stability of nano-confined systems, stress-driven mass transport);
  • Method development for nano-/micro-joint characterization (e.g., the determination of mechanical, thermal, and chemical properties of micro-/nano-joints).

Published Papers (2 papers)

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Research

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15 pages, 7750 KiB  
Article
Deformation Behavior of Transient Liquid-Phase Sintered Cu-Solder-Resin Microstructure for Die-Attach
by Hiroaki Tatsumi, Hiroshi Yamaguchi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba and Akio Hirose
Appl. Sci. 2019, 9(17), 3476; https://doi.org/10.3390/app9173476 - 23 Aug 2019
Cited by 10 | Viewed by 3544
Abstract
We have proposed a low-temperature bonding technology utilizing the sintering of Cu particles with transient liquid-phase of Sn-based solder, called transient liquid-phase sintering (TLPS), as a die-attach solution for high-temperature power modules. A copper-intermetallic compound-resin (Cu-IMC-resin) microstructure, which consists of Cu particles connected [...] Read more.
We have proposed a low-temperature bonding technology utilizing the sintering of Cu particles with transient liquid-phase of Sn-based solder, called transient liquid-phase sintering (TLPS), as a die-attach solution for high-temperature power modules. A copper-intermetallic compound-resin (Cu-IMC-resin) microstructure, which consists of Cu particles connected with Cu–Sn intermetallic compounds (IMCs) partially filled with polyimide resin, is obtained by the pressureless TLPS process at 250 °C for 1 min using a novel Cu-solder-resin composite as the bonding material in a nitrogen atmosphere. Macro- and micro-deformation properties of the unique microstructure of the TLPS Cu-IMC-resin are evaluated by finite element analysis using a three-dimensional image reconstruction model. The macroscopic computational uniaxial tensile tests of the Cu-IMC-resin model reveal that the utilization of the IMCs and the addition of the easily-deformable resin facilitates the temperature-stability and low-stiffness of the mechanical properties. The microstructure exhibits a significantly low homogenized Young’s modulus (11 GPa). Microscopic investigations show that the local stresses are broadly distributed on the IMC regions under uniaxial macroscopic tensile displacement, indicating highly reliable performance of the joint within a specific macroscopic strain condition. Numerical and experimental investigations demonstrate the excellent thermal cyclic reliability of die-attached joints between silicon carbide chips and directly bonded copper substrate. Full article
(This article belongs to the Special Issue Nanotechnology for Novel Nanojoining and Microjoining)
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Review

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20 pages, 8085 KiB  
Review
Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review
by Peng Zhang, Songbai Xue, Jianhao Wang, Peng Xue, Sujuan Zhong and Weimin Long
Appl. Sci. 2019, 9(10), 2044; https://doi.org/10.3390/app9102044 - 17 May 2019
Cited by 51 | Viewed by 5499
Abstract
With the development of microelectronic packaging and increasingly specific service environment of solder joints, much stricter requirements have been placed on the properties of lead-free solders. On account of small size effect and high surface energy, nanoparticles have been widely used to improve [...] Read more.
With the development of microelectronic packaging and increasingly specific service environment of solder joints, much stricter requirements have been placed on the properties of lead-free solders. On account of small size effect and high surface energy, nanoparticles have been widely used to improve the microstructure and properties of lead-free solders. Therefore, the composite solders bearing nanoparticles have recently attracted wide attention. This article reviewed the recent research on SnAgCu, SnBi, and SnZn composite solder alloys and introduced the effect of nanoparticles on their microstructure, mechanical properties, wettability, and reliability. The mechanism of nanoparticles strengthening was analyzed and summarized. In addition, the shortcomings and future development trends of nanoparticle-reinforced lead-free solders were discussed, which is expected to provide some theoretical reference for the application of these composite solder in 3D IC package. Full article
(This article belongs to the Special Issue Nanotechnology for Novel Nanojoining and Microjoining)
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